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HTRC11001T

NXP Semiconductors

HTRC11001T by NXP Semiconductors

The NXP Semiconductors HTRC11001T is a telecom interface IC with 14 terminals, operating at temperatures from -40 to 85°C. It has a supply voltage of 3V and max current of 0.01mA, suitable for industrial applications requiring a small outline package style. The IC features nickel palladium gold terminal finish and gull wing form factor for surface mount assembly.

Median Price

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Lifecycle Status

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7

In-Stock Inventory

1k+

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Digiode

USA . 2,214 parts In-Stock

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Anansix

USA . 808 parts In-Stock

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Tectiva GmbH

Germany . 100 parts In-Stock

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Rebound Electronics

UK . 40 parts In-Stock

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Pegasus Components GmbH

Germany . 37 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Aztec Data Supply Inc.

USA . 83 parts In-Stock

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$11.180

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Corohmni

South Africa . 106 parts In-Stock

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$11.831

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AZTECH Wire

Italy . 410 parts In-Stock

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$13.148

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Ampacity Inc.

Singapore . 222 parts In-Stock

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$64.000

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One Stop Electronics

USA . 1,579 parts In-Stock

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$774.000

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Semicontronic

India . 637 parts In-Stock

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$898.950

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$894.340

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Lixinc

USA . 13,419 parts In-Stock

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UNI Independent Distributors

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A-Z Elektronik GmbH

Germany . 6,351 parts In-Stock

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Argo Parts USA

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Alle Elektronik GmbH

Germany . 4,234 parts In-Stock

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Corphita

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Continental Prestige Electronics

USA . 2,503 parts In-Stock

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Kepictronics

USA . 2,500 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 189 parts In-Stock

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Perfect Parts

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Assy Fe

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ChipstoGo Electronic ltd

UK . 37 parts In-Stock

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Overview

Unlock the power of seamless communication with the HTRC11001T by NXP Semiconductors. Manufactured with precision and expertise, this telecom interface IC offers unparalleled quality and reliability. Ideal for various applications in the telecommunications industry, this product delivers exceptional value and benefits to customers. Experience enhanced performance, efficiency, and versatility with the HTRC11001T, setting new standards in the world of telecom interface ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY for the package body material ensures durability and resistance to damage, making this product a reliable choice for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Package Shape: RECTANGULAR

The rectangular package shape contributes to efficient use of space on the PCB, enabling a compact design for the overall system.

Power Supplies (V): 3

Operating at a power supply of 3V can lead to energy efficiency and lower power consumption, making this product suitable for power-sensitive applications.

No. of Terminals: 14

With 14 terminals, this product offers versatility in connectivity options, allowing for a wide range of configurations and functionalities.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, enabling a more compact and streamlined design for the overall system.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand extended periods of use in potentially harsh environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliability in cold conditions, making this product suitable for a wide range of operating environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent corrosion resistance and ensures reliable electrical connections, enhancing the overall performance and longevity of the product.

Terminal Position: DUAL

The dual terminal position provides redundancy and reliability in connectivity, reducing the risk of connection failures and enhancing the overall performance of the product.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product is built to withstand harsh operating conditions, making it a reliable choice for demanding environments.

Terminal Form: GULL WING

The gull wing terminal form offers mechanical strength and stability, ensuring secure connections and overall durability of the product.

Maximum Supply Current: 0.01 mA

With a low maximum supply current of 0.01 mA, this product is energy efficient and suitable for applications where power consumption is a critical factor.

Telecom IC Type: TELECOM CIRCUIT

As a telecom circuit type IC, this product is specifically designed for telecom applications, ensuring reliable and efficient communication functions in telecommunications systems.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard voltage levels in many electronic systems, making this product widely applicable.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for precise and secure connections, contributing to the overall reliability and performance of the product.

Technical Specifications

Other Function Telecom Interface ICs HTRC11001T attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.01 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

HTRC11001T Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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