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MRF24J40-I/MLVAO

Microchip Technology

MRF24J40-I/MLVAO by Microchip Technology

MRF24J40-I/MLVAO by Microchip is a 40-terminal telecom IC with 3.3V supply voltage, operating from -40 to 85°C. It features a chip carrier package style, suitable for industrial applications requiring a very thin profile and AEC-Q100 screening level compliance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Vyrian

USA . 156 parts In-Stock

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156

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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AZTECH Wire

Italy . 518 parts In-Stock

1+ parts

$12.276

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518

$12.276

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Aztec Data Supply Inc.

USA . 3,438 parts In-Stock

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$17.140

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3,438

$17.140

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Corohmni

South Africa . 999 parts In-Stock

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$17.623

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999

$17.623

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Ampacity Inc.

Singapore . 1,276 parts In-Stock

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$48.000

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1,276

$48.000

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Fulton Briggs Corp.

USA . 3,948 parts In-Stock

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3,948

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Continental Prestige Electronics

USA . 2,429 parts In-Stock

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2,429

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Argo Parts USA

USA . 2,392 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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Overview

Upgrade your telecommunications systems with the MRF24J40-I/MLVAO by Microchip Technology. Known for their top-quality products, Microchip Technology delivers reliable and cutting-edge solutions for various applications in the telecom industry. This square-shaped chip carrier boasts a very thin profile and a high operating temperature range, making it ideal for industrial use. With 40 terminals and a nominal supply voltage of 3.3V, this telecom circuit offers unmatched performance and durability. Embrace the future of telecommunications with Microchip Technology's MRF24J40-I/MLVAO.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for telecom applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation, saving time and effort during production.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality, making this product suitable for demanding automotive applications.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design, making it ideal for applications with limited space.

No. of Terminals: 40

With 40 terminals, this product offers ample connectivity options for various telecom interfaces, ensuring flexibility in design.

Package Style: CHIP CARRIER, VERY THIN PROFILE

The chip carrier with a very thin profile design enables high density packaging and efficient heat dissipation, making this product ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperature environments, ensuring reliability in extreme conditions.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C makes this product suitable for cold climates and ensures reliable performance in harsh environments.

Terminal Position: QUAD

The quad terminal position allows for easy connections and secure mounting, enhancing the overall reliability of the product.

Maximum Seated Height: 1 mm

With a maximum seated height of 1 mm, this product offers a low profile design, making it suitable for applications where space is limited.

Width: 6 mm

The 6 mm width of this product provides a compact form factor, making it ideal for applications requiring a small footprint.

Length: 6 mm

With a length of 6 mm, this product offers a compact and space-efficient design, suitable for applications with limited space constraints.

Temperature Grade: INDUSTRIAL

The industrial temperature grade of this product ensures reliable operation in harsh industrial environments, making it a robust choice for telecom applications.

Terminal Form: NO LEAD

The no lead terminal form reduces the risk of lead contamination and ensures environmental friendliness, making this product a sustainable choice.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuits, this product offers optimized performance and compatibility with telecom interfaces, making it a reliable choice for telecom applications.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3 V, this product operates efficiently with standard voltage levels, ensuring compatibility with existing systems.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5 mm provides a high level of connectivity density, allowing for more terminals in a smaller space, making this product suitable for high-density applications.

Technical Specifications

Other Function Telecom Interface ICs MRF24J40-I/MLVAO attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PQCC-N40

Length:

6 mm

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

6 mm

Trade Compliance

MRF24J40-I/MLVAO Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8529.90.22.00

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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