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SN65DSI85ZQET

Texas Instruments

SN65DSI85ZQET by Texas Instruments

Texas Instruments SN65DSI85ZQET is a 64-terminal, telecom interface IC with a package style of grid array. Operating temperature ranges from -40 to 85°C, suitable for industrial applications. It has a nominal voltage of 1.8V and terminal pitch of 0.5mm, making it ideal for telecom circuit designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,533 parts In-Stock

1+ parts

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7,533

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Digiode

USA . 4,200 parts In-Stock

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4,200

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 739 parts In-Stock

1+ parts

$9.172

100+ parts

-

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739

$9.172

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Parana Technologies

USA . 608 parts In-Stock

1+ parts

$15.386

100+ parts

-

1k+ parts

$15.774

10k+ parts

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608

$15.386

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$15.774

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DigiPath Technology Company

USA . 638 parts In-Stock

1+ parts

$16.942

100+ parts

$15.587

1k+ parts

-

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638

$16.942

$15.587

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IDEA Electronic Components Group

UK . 328 parts In-Stock

1+ parts

$17.288

100+ parts

$16.424

1k+ parts

$15.559

10k+ parts

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328

$17.288

$16.424

$15.559

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ChromeModa Solutions

Germany . 127 parts In-Stock

1+ parts

$17.288

100+ parts

$14.176

1k+ parts

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127

$17.288

$14.176

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One Stop Electronics

USA . 857 parts In-Stock

1+ parts

$450.000

100+ parts

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857

$450.000

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Corphita

USA . 1,782 parts In-Stock

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1,782

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Overview

Upgrade your telecom devices with the SN65DSI85ZQET by Texas Instruments, a high-quality Other Function Telecom Interface IC that promises superior performance and reliability. Designed by a trusted manufacturer, this product is perfect for a wide range of applications in the telecommunications industry. With advanced features and a compact design, this IC offers exceptional value to customers looking for cutting-edge technology. Experience seamless connectivity and enhanced functionality with the SN65DSI85ZQET, your solution for all telecom interface needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and flexibility, making the product suitable for various telecom applications.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving time and effort during assembly.

Package Shape: SQUARE

Square shape helps in efficient use of PCB space and allows for compact design in telecom devices.

No. of Terminals: 64

With 64 terminals, this product can accommodate a wide range of connections and interfaces, providing versatility in telecom applications.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style with a very thin profile and fine pitch design enhances signal integrity and performance in telecom interfaces.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and stability even in demanding telecom environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in a wide range of temperature conditions, suitable for varied telecom applications.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy connection and installation on PCBs, improving overall usability.

Maximum Seated Height: 1 mm

Low seated height ensures a compact design and efficient use of space in telecom devices.

Width: 5 mm

Compact width of 5mm allows for space-efficient integration in telecom systems.

Length: 5 mm

Short length of 5mm further enhances the compact design of the product, suitable for modern telecom applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments, making the product suitable for industrial telecom applications.

Terminal Form: BALL

Ball terminal form offers reliable and secure connections, ensuring stable performance in telecom interfaces.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, offering optimized performance and functionality in telecom applications.

Nominal Supply Voltage: 1.8 V

Operates at a nominal supply voltage of 1.8V, suitable for low power consumption and efficiency in telecom devices.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density connections and precise signal routing in telecom interfaces.

Technical Specifications

Other Function Telecom Interface ICs SN65DSI85ZQET attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B64

Length:

5 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

5 mm

Trade Compliance

SN65DSI85ZQET Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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