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SN65DSI86ZQET

Texas Instruments

SN65DSI86ZQET by Texas Instruments

Texas Instruments SN65DSI86ZQET is a 64-terminal IC with 1.2V supply voltage, suitable for telecom circuits. Featuring a very thin profile and fine pitch grid array package style, it operates b/w -40°C to 85°C. Ideal for applications requiring high-speed data transmission in telecommunications industry.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,452 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,452

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Digiode

USA . 2,504 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,504

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 472 parts In-Stock

1+ parts

$6.492

100+ parts

-

1k+ parts

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10k+ parts

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472

$6.492

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Parana Technologies

USA . 1,201 parts In-Stock

1+ parts

$7.837

100+ parts

-

1k+ parts

$8.390

10k+ parts

-

1,201

$7.837

-

$8.390

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DigiPath Technology Company

USA . 1,966 parts In-Stock

1+ parts

$8.630

100+ parts

$7.939

1k+ parts

-

10k+ parts

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1,966

$8.630

$7.939

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ChromeModa Solutions

Germany . 3,079 parts In-Stock

1+ parts

$8.806

100+ parts

$7.221

1k+ parts

-

10k+ parts

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3,079

$8.806

$7.221

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IDEA Electronic Components Group

UK . 783 parts In-Stock

1+ parts

$8.806

100+ parts

$8.366

1k+ parts

$7.925

10k+ parts

-

783

$8.806

$8.366

$7.925

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One Stop Electronics

USA . 264 parts In-Stock

1+ parts

$296.000

100+ parts

-

1k+ parts

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10k+ parts

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264

$296.000

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Corphita

USA . 681 parts In-Stock

1+ parts

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681

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Overview

Unlock unparalleled performance and reliability with the SN65DSI86ZQET by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers exceptional quality and innovation in Telecom Interface ICs. This product is essential for a wide range of applications, providing seamless connectivity and efficient data transmission. Experience the value of cutting-edge technology with the SN65DSI86ZQET, offering customers unparalleled benefits and advantages that elevate their projects to new heights of success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability for the product.

Surface Mount: YES

Surface mount capability makes the integration of this product into electronic assemblies easier and more efficient.

Package Shape: SQUARE

Square package shape allows for efficient use of space on a circuit board.

No. of Terminals: 64

Having 64 terminals enables this product to support a wide range of connections and functionalities.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style with a very thin profile and fine pitch enhances the overall performance and reliability of the product.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand various environmental conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this product suitable for a wide range of applications.

Terminal Position: BOTTOM

Bottom terminal position makes it easier to mount and connect the product.

Maximum Seated Height: 1 mm

Low seated height allows for compact design and space-saving on a circuit board.

Width: 5 mm

Having a narrow width makes this product suitable for applications where space is limited.

Length: 5 mm

Compact length ensures that this product can fit into tight spaces on a circuit board.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures that this product can operate reliably in harsh industrial environments.

Terminal Form: BALL

Ball terminal form provides secure connections and ensures reliable performance.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, this product offers optimized performance in telecommunications applications.

Nominal Supply Voltage: 1.2 V

Operates at a nominal supply voltage of 1.2V, making it suitable for low power consumption applications.

Terminal Pitch: 0.5 mm

With a fine terminal pitch of 0.5mm, this product supports high-density connections and enables compact design.

Technical Specifications

Other Function Telecom Interface ICs SN65DSI86ZQET attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B64

Length:

5 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

5 mm

Trade Compliance

SN65DSI86ZQET Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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