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TDA7100HTMA1

Infineon Technologies

TDA7100HTMA1 by Infineon Technologies

TDA7100HTMA1 by Infineon Technologies is a telecom interface IC with 10 terminals in a small outline package. Operating temperature range from -20 to 70°C, suitable for telecom circuits with a nominal voltage of 3V. Features matte tin finish, gull wing terminal form, and shrink pitch package style.

Median Price

$0.908

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 155,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.089

10k+ parts

$0.971

155,000

-

-

$1.089

$0.971

Avnet

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.727

20,000

-

-

-

$0.727

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 92 parts In-Stock

1+ parts

$0.779

100+ parts

-

1k+ parts

-

10k+ parts

-

92

$0.779

-

-

-

Digiode

USA . 831 parts In-Stock

1+ parts

$0.816

100+ parts

-

1k+ parts

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10k+ parts

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831

$0.816

-

-

-

Vyrian

USA . 5,621 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,621

-

-

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Bristol Electronics

USA . 1,998 parts In-Stock

1+ parts

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1,998

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 103,120 parts In-Stock

1+ parts

$0.730

100+ parts

-

1k+ parts

-

10k+ parts

-

103,120

$0.730

-

-

-

Semicontronic

India . 79,908 parts In-Stock

1+ parts

$0.730

100+ parts

$0.712

1k+ parts

$0.708

10k+ parts

-

79,908

$0.730

$0.712

$0.708

-

Corphita

USA . 602 parts In-Stock

1+ parts

$0.773

100+ parts

-

1k+ parts

-

10k+ parts

-

602

$0.773

-

-

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.779

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$0.779

-

-

-

Component Stockers USA

USA . 9,350 parts In-Stock

1+ parts

$0.890

100+ parts

$0.840

1k+ parts

$0.760

10k+ parts

-

9,350

$0.890

$0.840

$0.760

-

Corohmni

South Africa . 135 parts In-Stock

1+ parts

$7.843

100+ parts

-

1k+ parts

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10k+ parts

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135

$7.843

-

-

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AZTECH Wire

Italy . 1,179 parts In-Stock

1+ parts

$8.360

100+ parts

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1k+ parts

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10k+ parts

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1,179

$8.360

-

-

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Modulus Dynamics

Lithuania . 672 parts In-Stock

1+ parts

$11.471

100+ parts

$11.012

1k+ parts

$10.553

10k+ parts

-

672

$11.471

$11.012

$10.553

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Aztec Data Supply Inc.

USA . 851 parts In-Stock

1+ parts

$13.968

100+ parts

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1k+ parts

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851

$13.968

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Perfect Parts

USA . 27,623 parts In-Stock

1+ parts

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27,623

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Continental Prestige Electronics

USA . 4,497 parts In-Stock

1+ parts

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4,497

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Argo Parts USA

USA . 2,559 parts In-Stock

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2,559

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Overview

Unleash the power of seamless communication with the TDA7100HTMA1 by Infineon Technologies. Crafted with precision and expertise, this telecom interface IC offers unparalleled quality and reliability. Its versatile applications cater to various industries, ensuring optimal performance in every scenario. Elevate your projects with the exceptional value and benefits that this product brings - from its compact design to its wide operating temperature range. Experience seamless connectivity like never before with the TDA7100HTMA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Surface mount feature allows for easy and efficient installation onto circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

The square package shape provides a compact design, optimizing space utilization on the circuit board.

No. of Terminals: 10

Having 10 terminals allows for versatile connectivity options, enabling compatibility with a range of devices and systems.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style enhances the overall efficiency and performance of the product, making it suitable for various telecom interface applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand challenging environmental conditions, ensuring reliable operation in demanding situations.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature range allows the product to function effectively even in cold environments, increasing its versatility and usability.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent conductivity and corrosion resistance, enhancing the product's long-term performance and reliability.

Terminal Position: DUAL

Having dual terminal positions offers flexibility in installation and connection options, accommodating various circuit board layouts and designs.

Maximum Seated Height: 1.1 mm

The low maximum seated height contributes to a slim and compact overall profile, making the product suitable for space-constrained applications.

Width: 3 mm

The compact width dimension allows for efficient use of space on the circuit board, enabling a more streamlined and effective layout.

Length: 3 mm

The small length dimension contributes to the product's overall compact and space-saving design, ideal for applications where size constraints are a consideration.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy installation and soldering onto the circuit board, simplifying the assembly process and ensuring a secure connection.

Telecom IC Type: TELECOM CIRCUIT

As a telecom circuit type IC, the product is specifically designed for telecommunication applications, ensuring reliable and high-performance operation in communication systems.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage is suitable for a wide range of telecom applications, providing compatibility with various power sources and systems.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density mounting on the circuit board, maximizing space efficiency and enabling advanced connectivity options.

Technical Specifications

Other Function Telecom Interface ICs TDA7100HTMA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

TDA7100HTMA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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