Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TDA7541BTR by STMicroelectronics is a telecom interface IC designed for industrial applications, featuring a max operating temp of 85 °C and a nominal voltage of 8.5V. It comes in a low-profile flatpack package with 64 terminals. This BICMOS technology ensures reliable performance in demanding environments.
Median Price
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3
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Digiode
IDEA Electronic Components Group
$8.826
$7.944
MKK Technologies
$16.598
DigiPath Technology Company
Corphita
Parana Technologies
$10.553
The use of plastic/epoxy offers durability and resistance to environmental factors, making it suitable for various applications.
Surface mount technology allows for efficient use of PCB space, enabling compact designs in telecom applications.
A square shape optimizes PCB layout flexibility and facilitates easier placement and soldering processes.
Having 64 terminals provides ample connectivity options for complex telecom circuits.
The low profile and fine pitch design enhance performance by reducing parasitic inductance and improving signal integrity.
The ability to function at elevated temperatures ensures reliability in demanding environments.
Operating in low temperatures expands its usability in harsh environments found in various telecommunications applications.
The terminal finish improves solderability and enhances corrosion resistance, ensuring long-term reliability.
Quad terminal arrangement facilitates efficient routing and connections on a PCB, optimizing space and performance.
A low seated height contributes to the overall compactness of the circuit design, essential for space-constrained applications.
A consistent width helps maintain compatibility with standard PCB layouts, simplifying the design process.
A longer allowable reflow time can result in better solder joint quality, which is crucial for reliable performance.
Operating at high peak reflow temperatures ensures compatibility with modern soldering techniques, improving assembly efficiency.
A standardized length that aligns with typical component dimensions facilitates seamless integration into existing designs.
Rated for industrial use, this product can withstand harsher operational conditions, ensuring long-term durability.
BICMOS technology combines high-speed performance with low power consumption, making it ideal for telecom applications.
Gull wing terminals provide excellent mechanical strength and ease of soldering, ensuring reliable connections.
Specifically designed for telecom applications, this IC ensures optimal performance in communication systems.
A nominal supply voltage of 8.5 V fits well with standard power supply voltages typically used in telecom circuitry.
A 0.5 mm terminal pitch allows for a dense array of connections, which is ideal for high-performance telecom circuits.
With an MSL of 3, the device can tolerate a degree of moisture, providing flexibility in handling and assembly processes.
Other Function Telecom Interface ICs TDA7541BTR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics
JESD-30 Code:
JESD-609 Code:
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No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
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Package Style (Meter):
Peak Reflow Temperature (C):
Qualification:
Maximum Seated Height:
Nominal Supply Voltage:
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Technology:
Telecom IC Type:
Temperature Grade:
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TDA7541BTR Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
FDD5614P
Onsemi
FDD5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 45A IDM and 0.1 ohm RDS(ON), operating in ENHANCEMENT MODE at up to 175°C. The PLASTIC/EPOXY package with GULL WING terminals ensures efficient heat dissipation and reliable performance.
LM317T/NOPB
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; JESD-609 Code: e3; Package Shape: RECTANGULAR;
BSS138
Jiangsu Changjiang Electronics Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE; Maximum Drain Current (ID): .22 A; Package Shape: RECTANGULAR;
BAV99
Promax-johnton
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Good-ark Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): 1.8 W; Maximum Collector Current (IC): .8 A;
SMBJ18CA
KYOCERA AVX
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M85049/85-08W02
Amphenol
CIRCULAR CONN ACCESSORY; Shell Sizes: 8; 9; IEC Conformity: NO; MIL-Connector Accessory Name: BAND LOCK ADAPTER; MIL Conformity: YES; DIN Conformity: NO;
FDN5618P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Moisture Sensitivity Level (MSL): 1;
Sangdest Microelectronics (Nanjing)
LL4148
Excel (Suzhou) Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
C0805C104K5RACTU
KEMET Corporation
KEMET C0805C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and reliable performance.
International Devices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
2N7002-7-F
Diodes Incorporated
Diodes Inc. 2N7002-7-F is a N-channel FET with 60V DS breakdown voltage, 0.115A max drain current, and 13.5 ohm RDS(on). Ideal for switching applications in enhancement mode operation. Features Gull Wing terminals, small outline package style, and operates up to 150°C.
M24308/2-1F
Adi Electronics
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; MIL Conformity: YES; Filter Feature: NO; Mating Info.: MULTIPLE MATING PARTS AVAILABLE;
FDN306P
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Maximum Drain Current (Abs) (ID): 2.6 A; Operating Mode: ENHANCEMENT MODE;
Goodwork Semiconductor
NC7WZ17P6X
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
2N7002
Central Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .115 A; Maximum Drain Current (Abs) (ID): .115 A;
M39029/58-360
CONNECTOR ACCESSORY; MIL Conformity: YES; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: MALE; Terminal Type: CRIMP; IEC Conformity: NO;
Bkc Semiconductors
CY7B933-JXI
Cypress Semiconductor
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;
RN4870-V/RM118
Microchip Technology
RN4870-V/RM118 by Microchip Technology is a telecom IC with 33 terminals, operating temperature range of -20 to 70°C, and data rate of 0.01 Mbps. It is used in applications requiring a nominal voltage of 3.3V, such as IoT devices and wireless communication systems.
BGM113A256V2
Silicon Labs
BGM113A256V2 by Silicon Labs is a telecom IC with 36 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 0.8mm. This rectangular microelectronic assembly is ideal for industrial applications requiring telecom circuit interfaces.
BM70BLES1FC2-0B04AA
Microchip Technology's BM70BLES1FC2-0B04AA is a telecom IC with 33 terminals, operating at -40 to 85°C. It has a data rate of 0.0086 Mbps and operates at 3V supply voltage. This rectangular package is ideal for industrial applications requiring low-power telecom circuit integration.
TSC2000IPW
Texas Instruments
TSC2000IPW by Texas Instruments is a Telecom Interface IC with 20 terminals, operating temperature range of -40 to 85°C. It features CMOS technology, GULL WING terminal form, and SINGLE-ENDED input type. Ideal for telecom circuits due to its small outline package style and industrial temperature grade suitability.
WL1805MODGBMOCT
WL1805MODGBMOCT by Texas Instruments is a telecom interface IC with 100 terminals in a rectangular grid array package. Operating at -20 to 70°C, it supports data rates up to 100 Mbps at 3.7V supply voltage. Ideal for commercial applications requiring high-speed telecommunications functionality.
DC-ME-01T-C
Digi International
DC-ME-01T-C by Digi International is a SERIAL DEVICE SERVER with 100 Mbps data rate, operating at -40 to 85°C. Its MICROELECTRONIC ASSEMBLY package style and NO LEAD terminal form make it ideal for telecom applications requiring a compact design and reliable connectivity.
XB3-24ARM-J
The Digi International XB3-24ARM-J is a TELECOM CIRCUIT IC with 1 Mbps data rate. Operating temperature range: -40 to 85°C. RECTANGULAR package shape for telecom interfaces, ideal for various telecommunications applications.
FUSB340TMX
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 18; Package Code: HVQCCN; Package Shape: RECTANGULAR;
CYBLE-416045-02
Infineon Technologies
CYBLE-416045-02 by Infineon Technologies is a telecom IC with 43 terminals, operating at -40 to 85°C. It has a data rate of 8000 Mbps and operates at a nominal voltage of 3V. This surface-mount IC is ideal for industrial applications requiring high-speed telecommunications interfaces.
ZED-F9P-00B
U-blox Ag
ZED-F9P-00B by U-blox Ag is a 54-terminal IC with AEC-Q100 screening, operating from -40 to 85°C. It features a 3V supply voltage, telecom circuit type, and compact rectangular package. Ideal for telecom interfaces in industrial applications due to its small size and wide temperature range.
CLRC66302HN,118
NXP Semiconductors
NXP Semiconductors' CLRC66302HN,118 is a 32-terminal IC with CMOS technology. It operates b/w -25 to 85 °C and has a nominal voltage of 5V. Ideal for telecom circuits, it comes in a square chip carrier package style suitable for surface mount applications.
CC2640F128RSMR
CC2640F128RSMR by Texas Instruments is a telecom IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a nominal voltage of 3V. Ideal for telecom applications, it features nickel/palladium/gold/silver terminal finish and very thin profile design.
453-00059R
Laird Technologies
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260;
MGM240PB22VNA3
TELECOM CIRCUIT;
MAX-M8Q-0
MAX-M8Q-0 by U-blox Ag is a GNSS Module with 18 terminals, operating at -40 to 85°C. It has a compact size of 10.1x9.7mm and low profile of 2.7mm, suitable for industrial applications requiring precise location tracking in harsh environments.
MGM240PA22VNA3
ODIN-W260-05B
ODIN-W260-05B by U-blox Ag is a surface mount telecom IC with 52 terminals, operating at -40 to 85°C. With a compact size of 14.8mm x 22.3mm and terminal pitch of 1.2mm, it's ideal for industrial applications requiring a nominal voltage of 3.3V.
MGM240SD22VNA2
ESP32-WROOM-32D
Espressif Systems (Shanghai)
ESP32-WROOM-32D by Espressif Systems is a 38-terminal IC with 3.3V supply voltage, operating from -40 to 85°C. It features no-lead terminals, telecom circuit type, and industrial temperature grade. Ideal for IoT applications requiring compact size and high performance in telecommunications interfaces.
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TDA7116FHTMA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: TSSOP; Package Shape: SQUARE;
TDA7200XUMA1
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR;
TDA7100HTMA1
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: TSSOP; Package Shape: SQUARE;
TDA7116F
TDA7116FXT
TDA7116FXT by Infineon is a telecom IC with 10 terminals, operating from -40 to 85°C. Its small outline package makes it suitable for telecom circuits requiring 3V supply voltage. With a terminal pitch of 0.5mm and gull wing form, it's ideal for compact applications in industrial settings.
TDA7110FHTMA1
TDA7110FHTMA1 by Infineon Technologies is a telecom interface IC with 1 function. It has a small outline, thin profile package style and operates in an industrial temperature range of -40 to 85°C. This IC is suitable for telecom circuit applications.
TDA7541
STMicroelectronics
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE;
TDA7541B
TDA7541WTR
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: SQUARE;
TDA7541BW
TDA7541TR
TDA7541W
TDA7541BWTR
TDA7212
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
TDA7110
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
TDA7255VXUMA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: VQCCN; Package Shape: RECTANGULAR;
TDA7110F
TDA7200
TDA7200XT
Supply Digital Components
$106.00
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12,000 In-Stock
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