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TDA7541

STMicroelectronics

TDA7541 by STMicroelectronics

TDA7541 by STMicroelectronics is a BICMOS telecom interface IC designed for industrial applications. It features a low profile 64-terminal package, operates b/w -40 °C to 85°C, and requires a nominal voltage of 8.5V. Ideal for surface mount designs, it ensures reliable performance in telecom circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,171 parts In-Stock

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5,171

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Anansix

USA . 1,941 parts In-Stock

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1,941

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Digiode

USA . 990 parts In-Stock

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990

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,210 parts In-Stock

1+ parts

$6.229

100+ parts

-

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$5.606

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2,210

$6.229

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$5.606

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AZTECH Wire

Italy . 232 parts In-Stock

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$11.540

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232

$11.540

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MKK Technologies

India . 2,249 parts In-Stock

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$11.714

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2,249

$11.714

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DigiPath Technology Company

USA . 2,249 parts In-Stock

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$11.714

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2,249

$11.714

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Kepictronics

USA . 71,332 parts In-Stock

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71,332

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A-Z Elektronik GmbH

Germany . 6,284 parts In-Stock

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6,284

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Corphita

USA . 4,547 parts In-Stock

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4,547

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RC Electronics

USA . 1,200 parts In-Stock

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1,200

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Parana Technologies

USA . 1,026 parts In-Stock

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$7.448

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1,026

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$7.448

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Overview

Unlock unparalleled performance and reliability with the TDA7541 from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for telecom applications, this versatile IC ensures exceptional audio quality and seamless connectivity, even in challenging environments. With a robust industrial temperature range and compact design, the TDA7541 enhances your projects while reducing time-to-market. Experience superior value and peace of mind knowing you’re backed by ST’s commitment to excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures robust protection against environmental factors, making the product reliable for industrial applications.

Surface Mount: YES

Surface mount capability allows for efficient PCB space utilization and simplifies assembly processes, making it suitable for modern compact designs.

Package Shape: SQUARE

The square package shape provides balanced thermal performance and facilitates better handling during the manufacturing process.

No. of Terminals: 64

With 64 terminals, this IC offers extensive connectivity options, enabling versatile integration into various telecom applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile design with fine pitch allows for close placement on PCBs, which is essential for high-density electronic designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliability under elevated thermal conditions typically found in telecom environments.

Minimum Operating Temperature: -40 °C

Operating down to -40 °C makes this IC suitable for use in extreme temperature environments, enhancing its applicability in diverse settings.

Terminal Position: QUAD

The quad terminal positioning provides a stable mounting footprint, ensuring secure connections and reducing mechanical stress.

Maximum Seated Height: 1.6 mm

With a maximum seated height of 1.6 mm, this IC supports low-profile designs which are critical in minimizing overall equipment size.

Width: 10 mm

A compact width of 10 mm helps in maintaining a small form factor, suitable for modern telecom devices with limited space.

Length: 10 mm

The length of 10 mm ensures uniformity with the width, contributing to a symmetrical design that is easier to manage in layout planning.

Temperature Grade: INDUSTRIAL

Rated for industrial use, this IC is built to withstand demanding conditions, ideal for professional-grade applications.

Technology: BICMOS

Utilizing BICMOS technology allows for high-speed performance while maintaining low power consumption, ideal for telecom applications.

Terminal Form: GULL WING

Gull wing terminals enhance solder joint reliability and simplify the soldering process, contributing to lower manufacturing defects.

Telecom IC Type: TELECOM CIRCUIT

As a specialized telecom circuit, this IC is optimized for communication applications, making it a go-to choice for telecom engineers.

Nominal Supply Voltage: 8.5 V

A nominal supply voltage of 8.5 V provides flexibility in integration with a variety of power supply systems used in telecommunications.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for fine pitch PCB layouts, supporting the compact design requirements of contemporary electronic devices.

Technical Specifications

Other Function Telecom Interface ICs TDA7541 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

8.5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Trade Compliance

TDA7541 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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