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TDA7541BWTR

STMicroelectronics

TDA7541BWTR by STMicroelectronics

TDA7541BWTR by STMicroelectronics is a BICMOS telecom interface IC designed for industrial applications. It operates b/w -40 °C to 85°C, with a nominal voltage of 8.5V and features a 64-terminal gull-wing package. Ideal for robust telecom systems, it supports surface mount technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,058 parts In-Stock

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4,058

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Digiode

USA . 1,235 parts In-Stock

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1,235

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Anansix

USA . 1,024 parts In-Stock

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1,024

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,334 parts In-Stock

1+ parts

$10.987

100+ parts

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$9.888

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2,334

$10.987

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$9.888

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MKK Technologies

India . 1,440 parts In-Stock

1+ parts

$20.660

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$20.660

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DigiPath Technology Company

USA . 1,440 parts In-Stock

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$20.660

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1,440

$20.660

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Component Stockers USA

USA . 628 parts In-Stock

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$99.990

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628

$99.990

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Perfect Parts

USA . 22,850 parts In-Stock

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22,850

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A-Z Elektronik GmbH

Germany . 7,058 parts In-Stock

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7,058

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Kepictronics

USA . 4,989 parts In-Stock

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4,989

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Parana Technologies

USA . 1,610 parts In-Stock

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$13.136

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1,610

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$13.136

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Corphita

USA . 1,604 parts In-Stock

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1,604

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Overview

Unlock the potential of your telecom projects with the TDA7541BWTR from STMicroelectronics, a leader in innovative technology. Designed for robustness and reliability, this versatile interface IC excels in demanding environments, delivering high performance at temperatures ranging from -40 °C to 85°C. Experience seamless integration and exceptional quality that enhances communication systems, ensuring you stay connected when it matters most. Elevate your applications with ST's trusted solutions and enjoy the peace of mind that comes with their industry expertise!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making this IC suitable for a wide range of applications.

Surface Mount: YES

Being a surface mount device enables compact designs and high-density circuit layouts which are essential for modern telecom applications.

Package Shape: SQUARE

The square package shape allows for a balanced thermal performance and efficient use of board space.

No. of Terminals: 64

With 64 terminals, this IC can handle multiple input/output options, enhancing its versatility in telecom applications.

Package Style (Meter): FLATPACK

The flatpack style helps in low-profile designs which are favored in space-constrained environments.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C ensures reliability in high-temperature environments typical in telecommunications installations.

Minimum Operating Temperature: -40 °C

The ability to function down to -40 °C ensures that this IC can be used in harsh and extreme weather conditions.

Terminal Finish: TIN SILVER COPPER

The tin-silver-copper finish provides excellent solderability and reduces the risk of corrosion over time.

Terminal Position: QUAD

Quad terminal positions allow for simpler routing in designs, which can lead to shorter signal paths and enhancements in performance.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds helps to ensure reliable solder joints during the manufacturing process.

Peak Reflow Temperature (°C): 260

The ability to withstand peak temperatures of 260 °C ensures compatibility with modern reflow soldering processes.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperatures indicates robust performance and reliability in demanding environments.

Technology: BICMOS

The BICMOS technology combines the strengths of bipolar and CMOS transistors, making the IC efficient and fast, ideal for telecom applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy handling and enhance the soldering process in manufacturing, ensuring strong connections.

Telecom IC Type: TELECOM CIRCUIT

Specialized for telecom applications, this IC is optimized for signal processing and telecommunications protocols.

Nominal Supply Voltage: 8.5 V

A nominal supply voltage of 8.5 V is standard in telecom circuitry, ensuring compatibility with existing systems.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the IC can withstand a certain level of humidity, which is essential for maintaining performance during production and usage.

Technical Specifications

Other Function Telecom Interface ICs TDA7541BWTR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Nominal Supply Voltage:

8.5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

TDA7541BWTR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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