Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TDA7116FXT by Infineon is a telecom IC with 10 terminals, operating from -40 to 85°C. Its small outline package makes it suitable for telecom circuits requiring 3V supply voltage. With a terminal pitch of 0.5mm and gull wing form, it's ideal for compact applications in industrial settings.
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$15.944
Ampacity Inc.
$977.000
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Argo Parts USA
Bastille Electronics
Corphita
The use of plastic/epoxy material makes this product lightweight and durable, making it ideal for telecom applications.
The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.
The square package shape offers a compact design, saving valuable space on the PCB and allowing for efficient layout.
With 10 terminals, this product provides ample connectivity options, making it versatile and suitable for various telecom interface applications.
The small outline, thin profile, and shrink pitch package style enhances thermal performance and promotes efficient heat dissipation.
The high maximum operating temperature ensures reliable performance even in extreme conditions, making it a dependable choice for telecom interfaces.
The low minimum operating temperature allows for operation in colder environments, increasing the product's versatility and usability.
The dual terminal position provides redundancy and improved connectivity, ensuring stable and consistent performance in telecom applications.
The low maximum seated height minimizes space requirements, enabling compact design solutions for telecom interface circuits.
The 3mm width offers a slim profile, saving space on the PCB and facilitating efficient layout and design.
With a length of 3mm, this product is compact and space-efficient, making it an ideal choice for applications where space is limited.
The industrial temperature grade ensures reliable performance in harsh environments, making this product suitable for industrial telecom applications.
The gull wing terminal form provides secure connections and ease of soldering, ensuring reliable and durable connections in telecom circuits.
Designed specifically for telecom circuits, this product offers optimized performance and compatibility for telecom applications.
With a nominal supply voltage of 3V, this product is suitable for low-power telecom applications, ensuring efficient energy consumption.
The small terminal pitch of 0.5mm allows for high-density integration on the PCB, enabling compact and space-efficient circuit designs for telecom interfaces.
Other Function Telecom Interface ICs TDA7116FXT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies
JESD-30 Code:
Length:
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Peak Reflow Temperature (C):
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Telecom IC Type:
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TDA7116FXT Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
SMBJ18CA
Diodes Incorporated
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Leshan Radio
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
EU2B-YS303C
Idec
ROTARY SWITCH;
Bytesonic Electronics
BSS138BKW,115
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Terminal Finish: TIN; No. of Terminals: 3; Additional Features: LOGIC LEVEL COMPATIBLE;
Kec
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Non Repetitive Peak Forward Current: 2 A; Config: SINGLE; Maximum Operating Temperature: 200 Cel;
LM555CMX
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
2N7002
Weitron Technology
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Terminal Finish: TIN LEAD; Maximum Operating Temperature: 150 Cel;
LM107H
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
Excel (Suzhou) Semiconductor
ECS-.327-12.5-17X-TR
Ecs International
ECS-0.327-12.5-17X-TR by Ecs International is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing in temperature ranges from -40 to 85 °C, such as telecommunications and industrial automation.
LL4148
Itt Components
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .005 us; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Non Repetitive Peak Forward Current: 1 A;
DP83848IVVX/NOPB
Texas Instruments
Texas Instruments DP83848IVVX/NOPB is a 3.3V Ethernet transceiver with 100000 Mbps data rate, suitable for industrial applications. It features CMOS technology, operates b/w -40 to 85 °C, and comes in a low profile flatpack package with matte tin finish.
SS14
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
National Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Feedback Capacitance (Crss): 10 pF; JEDEC-95 Code: TO-236AB;
Db Lectro
AT90CAN128-16AU
Microchip Technology
AT90CAN128-16AU by Microchip Technology is a microcontroller with 8-bit data RAM and 16-bit address bus width. It operates at a max clock frequency of 16 MHz, making it suitable for industrial applications requiring low power mode and connectivity options like CAN, SPI, and USART. With 53 I/O lines and 8-channel 10-bit ADCs, this microcontroller offers versatile peripheral support for various embedded systems.
LM358N
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
STMicroelectronics
BAV99
Secos
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
MAX7042ATJ
Analog Devices
Analog Devices' MAX7042ATJ is a telecom IC with 32 terminals, operating at -40 to 125 °C. It has a supply voltage of 3/5 V and consumes 0.0086 mA current. This CMOS technology chip carrier is ideal for automotive applications due to its low profile and quad terminal position.
CC-WMX-JN58-NE
Digi International
TELECOM CIRCUIT;
XB3-24Z8PT-J
XB3-24Z8PT-J by Digi Int. is a telecom IC with 20 terminals in MICROELECTRONIC ASSEMBLY package. Operating temp range -40 to 85°C, INDUSTRIAL grade. Ideal for TELECOM CIRCUIT applications due to THROUGH-HOLE terminal form and DUAL position.
CY7B933-JXIT
Cypress Semiconductor
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;
BMD-345-A-R
U-blox Ag
ST25R3914-AQWT
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
FUSB340TMX
FUSB340TMX by Onsemi is a Telecom Interface IC with 18 terminals in a rectangular chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 3.6V, it is designed for telecom circuit applications.
SA612AN,112
NXP Semiconductors
SA612AN,112 by NXP Semiconductors is an 8-terminal telecom interface IC with a rectangular package style. It operates b/w -40 to 85°C and has a nominal voltage of 6V. Ideal for industrial applications requiring reliable telecom circuitry in compact designs.
RN52-I/RM
Microchip Technology's RN52-I/RM is a rectangular package IC with 40 terminals, 2.7mm height, and dimensions of 13.5mm x 26mm. It operates at a data rate of 3 Mbps and is used in telecom circuits for various applications requiring surface mount technology.
CC2530F256RHAT
CC2530F256RHAT by Texas Instruments is a telecom IC with 40 terminals, operating b/w -40 to 125°C. It has a supply voltage of 3V, terminal pitch of 0.5mm, and MSL level of 3. Ideal for automotive applications due to its nickel palladium gold finish and no lead terminal form.
RS9116W-DB00-CC1-B2A
Silicon Labs
BLED112-V1
BLED112-V1 by Silicon Labs is a RECTANGULAR MICROELECTRONIC ASSEMBLY with an operating temperature range of -40 to 85°C. It is an INDUSTRIAL-grade TELECOM CIRCUIT suitable for various telecom interface applications.
RCB-F9T
GNSS Module;
BGB707L7ESDE6327XTSA1
Infineon Technologies
BGB707L7ESDE6327XTSA1 by Infineon is a telecom IC with 3V supply voltage. It features a small outline package with 7 terminals, gold palladium finish, and dual terminal position. Ideal for telecom circuit applications due to its AEC-Q101 screening level and very thin profile design.
TRF37B73IDSGT
TRF37B73IDSGT by Texas Instruments is an 8-terminal telecom IC with a package style of small outline, heat sink/slug, and very thin profile. It operates b/w -40 to 85°C, with a nominal voltage of 3.3V. Ideal for telecom circuits due to its nickel palladium gold terminal finish and industrial temperature grade suitability.
MGM240PA32VNA3R
NEO-M8T-0-10
NEO-M8T-0-10 by U-blox Ag is a telecom IC with 24 terminals, operating at -40 to 85°C. It has a supply voltage of 3V and MSL level of 4, suitable for industrial applications requiring precise positioning and timing accuracy. With its compact rectangular package style, it's ideal for space-constrained environments.
450-0177R
Laird Technologies
PN5120A0HN1/C2,151
NXP Semiconductors PN5120A0HN1/C2,151 is a telecom IC with 32 terminals and operates at -30 to 85°C. It has a supply voltage of 3V and terminal pitch of 0.5mm. This chip carrier package is suitable for telecom circuits requiring low-profile components.
EQCO62T20.3
EQCO62T20.3 by Microchip Technology is a telecom interface IC with 1 function, 16 terminals, and a square package shape. It operates in an industrial temperature range of -40 to 85°C and has a nominal voltage of 1.2V. This IC is suitable for telecom circuit applications.
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TDA7116FHTMA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: TSSOP; Package Shape: SQUARE;
TDA7200XUMA1
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR;
TDA7100HTMA1
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: TSSOP; Package Shape: SQUARE;
TDA7116F
TDA7110FHTMA1
TDA7110FHTMA1 by Infineon Technologies is a telecom interface IC with 1 function. It has a small outline, thin profile package style and operates in an industrial temperature range of -40 to 85°C. This IC is suitable for telecom circuit applications.
TDA7541
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE;
TDA7541B
TDA7541BTR
TDA7541WTR
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: SQUARE;
TDA7541BW
TDA7541TR
TDA7541W
TDA7541BWTR
TDA7212
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
TDA7110
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
TDA7255VXUMA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: VQCCN; Package Shape: RECTANGULAR;
TDA7110F
TDA7200
TDA7200XT
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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