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TDA7116FXT

Infineon Technologies

TDA7116FXT by Infineon Technologies

TDA7116FXT by Infineon is a telecom IC with 10 terminals, operating from -40 to 85°C. Its small outline package makes it suitable for telecom circuits requiring 3V supply voltage. With a terminal pitch of 0.5mm and gull wing form, it's ideal for compact applications in industrial settings.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 1,079 parts In-Stock

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Digiode

USA . 112 parts In-Stock

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Nova Conductors

Japan . 16 parts In-Stock

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Modulus Dynamics

Lithuania . 1,891 parts In-Stock

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$14.895

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$14.299

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$13.703

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AZTECH Wire

Italy . 188 parts In-Stock

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$15.944

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Ampacity Inc.

Singapore . 1,511 parts In-Stock

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$977.000

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Continental Prestige Electronics

USA . 3,746 parts In-Stock

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Argo Parts USA

USA . 3,010 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Corphita

USA . 25 parts In-Stock

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Overview

Elevate your telecommunications projects with the TDA7116FXT by Infineon Technologies. Known for their superior quality and innovative technology, Infineon delivers top-of-the-line telecom interface ICs like no other. Designed for efficiency and reliability, this small outline, thin profile package offers a wide range of applications in the telecom industry. With its industrial-grade temperature rating and dual terminal position, the TDA7116FXT provides unmatched performance and convenience for your projects. Upgrade to Infineon and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, making it ideal for telecom applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

The square package shape offers a compact design, saving valuable space on the PCB and allowing for efficient layout.

No. of Terminals: 10

With 10 terminals, this product provides ample connectivity options, making it versatile and suitable for various telecom interface applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style enhances thermal performance and promotes efficient heat dissipation.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in extreme conditions, making it a dependable choice for telecom interfaces.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in colder environments, increasing the product's versatility and usability.

Terminal Position: DUAL

The dual terminal position provides redundancy and improved connectivity, ensuring stable and consistent performance in telecom applications.

Maximum Seated Height: 1.1 mm

The low maximum seated height minimizes space requirements, enabling compact design solutions for telecom interface circuits.

Width: 3 mm

The 3mm width offers a slim profile, saving space on the PCB and facilitating efficient layout and design.

Length: 3 mm

With a length of 3mm, this product is compact and space-efficient, making it an ideal choice for applications where space is limited.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh environments, making this product suitable for industrial telecom applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ease of soldering, ensuring reliable and durable connections in telecom circuits.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuits, this product offers optimized performance and compatibility for telecom applications.

Nominal Supply Voltage: 3 V

With a nominal supply voltage of 3V, this product is suitable for low-power telecom applications, ensuring efficient energy consumption.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density integration on the PCB, enabling compact and space-efficient circuit designs for telecom interfaces.

Technical Specifications

Other Function Telecom Interface ICs TDA7116FXT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

S-PDSO-G10

Length:

3 mm

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

TDA7116FXT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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