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TDA7541TR

STMicroelectronics

TDA7541TR by STMicroelectronics

TDA7541TR by STMicroelectronics is a BICMOS telecom interface IC designed for industrial applications. It features a low profile 64-terminal flatpack package, operating b/w -40 °C to 85°C with a nominal voltage of 8.5V. Ideal for compact telecom systems, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,806 parts In-Stock

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4,806

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Vyrian

USA . 3,002 parts In-Stock

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3,002

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Anansix

USA . 1,081 parts In-Stock

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1,081

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 455 parts In-Stock

1+ parts

$12.730

100+ parts

-

1k+ parts

$11.457

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455

$12.730

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$11.457

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MKK Technologies

India . 1,691 parts In-Stock

1+ parts

$23.938

100+ parts

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1,691

$23.938

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DigiPath Technology Company

USA . 1,691 parts In-Stock

1+ parts

$23.938

100+ parts

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1,691

$23.938

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Corphita

USA . 4,478 parts In-Stock

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4,478

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Parana Technologies

USA . 962 parts In-Stock

1+ parts

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100+ parts

$15.221

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962

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$15.221

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Overview

Elevate your telecom applications with the TDA7541TR from STMicroelectronics, a leader in innovative solutions. Engineered for reliability in demanding environments, this versatile interface IC enhances audio quality and performance while ensuring robust functionality. With its low-profile design and industrial-grade temperature resilience, the TDA7541TR is perfect for automotive, telecommunications, and consumer electronics, delivering exceptional value and efficiency for your projects. Transform your designs with trusted technology from STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliable performance and protection for the IC in various operating environments.

Surface Mount: YES

Surface mount technology allows for efficient use of board space and simplifies the manufacturing process.

Package Shape: SQUARE

The square package shape provides a balanced thermal distribution, which is beneficial for heat dissipation.

No. of Terminals: 64

With 64 terminals, this IC offers a high level of connectivity, facilitating complex circuitry and expanded functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low profile and fine pitch design make it suitable for compact applications without sacrificing performance.

Maximum Operating Temperature: 85 °C

Designed to operate effectively in temperatures as high as 85 °C, this IC is suitable for demanding industrial applications.

Minimum Operating Temperature: -40 °C

The ability to function in extreme cold (-40 °C) ensures reliability in harsh environments, making it ideal for outdoor and extreme conditions.

Terminal Position: QUAD

The quad terminal position enhances connectivity options and allows for easier routing on printed circuit boards.

Maximum Seated Height: 1.6 mm

The low seated height ensures compatibility with space-constrained designs and helps maintain a slim profile for the end product.

Width: 10 mm

A standardized width of 10 mm enables placement flexibility on various boards, optimizing layout efficiency.

Length: 10 mm

The equal length further promotes uniform design standards and easy integration into existing systems.

Temperature Grade: INDUSTRIAL

Classified as industrial grade, this IC is built for longevity and reliability under rigorous operational conditions.

Technology: BICMOS

BICMOS technology combines high-speed and low-power characteristics, ideal for telecom applications requiring efficient signal processing.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering to printed circuit boards, enhancing manufacturing efficiency.

Telecom IC Type: TELECOM CIRCUIT

Specialized as a telecom circuit IC, it ensures optimal performance for telecommunications applications, meeting specific industry requirements.

Nominal Supply Voltage: 8.5 V

Operating at a nominal supply voltage of 8.5 V allows for compatibility with a wide range of telecom equipment.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for high-density connections, maximizing the functionality of space-restricted designs.

Technical Specifications

Other Function Telecom Interface ICs TDA7541TR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

8.5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

TDA7541TR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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