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TDA7116F

Infineon Technologies

TDA7116F by Infineon Technologies

TDA7116F by Infineon is a telecom IC with 10 terminals, operating at -40 to 85°C. It has a supply voltage of 3V and max current of 0.021mA. This square-shaped IC in small outline package is ideal for telecom interface applications requiring low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 857 parts In-Stock

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Vyrian

USA . 681 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Modulus Dynamics

Lithuania . 1,545 parts In-Stock

1+ parts

$8.637

100+ parts

$8.292

1k+ parts

$7.946

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1,545

$8.637

$8.292

$7.946

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AZTECH Wire

Italy . 457 parts In-Stock

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$14.636

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457

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Andel Nordic

Denmark . 5,323 parts In-Stock

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$30.680

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$21.473

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$21.473

5,323

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$21.473

$21.473

Ampacity Inc.

Singapore . 1,187 parts In-Stock

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$194.000

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$194.000

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A-Z Elektronik GmbH

Germany . 7,507 parts In-Stock

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7,507

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Continental Prestige Electronics

USA . 5,670 parts In-Stock

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Bastille Electronics

Australia . 870 parts In-Stock

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Argo Parts USA

USA . 649 parts In-Stock

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Corphita

USA . 170 parts In-Stock

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Perfect Parts

USA . 34 parts In-Stock

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Overview

Discover the TDA7116F by Infineon Technologies, a top-quality telecom interface IC that offers unparalleled performance and reliability. With its cutting-edge technology and industrial-grade design, this product is perfect for a wide range of applications. From telecommunications to consumer electronics, the TDA7116F delivers exceptional value and benefits to customers seeking a high-performance solution. Trust in Infineon Technologies for all your interface IC needs and experience the advantages of superior quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the internal components of the product, making it suitable for long-term use.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on printed circuit boards, saving time and effort during assembly.

Power Supplies (V): 2.1/4

Supports a wide range of power supplies, offering flexibility in usage and compatibility with different systems.

Maximum Operating Temperature: 85 °C

Can operate efficiently at high temperatures, making it suitable for industrial applications where temperature variations are common.

Technology: BIPOLAR

BIPOLAR technology ensures reliable performance and high-speed operation, enhancing the overall functionality of the product.

Technical Specifications

Other Function Telecom Interface ICs TDA7116F attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

S-PDSO-G10

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP10,.19,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.1/4

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.021 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

BIPOLAR

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

TDA7116F Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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