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MAX2851ITK+T

Analog Devices

MAX2851ITK+T by Analog Devices

MAX2851ITK+T by Analog Devices is a BICMOS telecom IC with 68 terminals in a square chip carrier package. Operating b/w -25 to 85°C, it has a supply voltage of 2.85V and peak reflow temp of 260°C. Ideal for telecom circuits, this IC is surface mountable and has a very thin profile for compact applications.

Median Price

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5

In-Stock Inventory

1k+

MAX2851ITK+T by Analog Devices
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Chip Stock

USA . 6,100 parts In-Stock

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Vyrian

USA . 5,601 parts In-Stock

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Digiode

USA . 2,490 parts In-Stock

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Anansix

USA . 1,383 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Corohmni

South Africa . 762 parts In-Stock

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$7.993

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762

$7.993

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MARBEL Systems

Belgium . 790 parts In-Stock

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$8.379

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790

$8.379

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Texas Native Microelectronics

USA . 90 parts In-Stock

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$9.631

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$9.246

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$8.957

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$8.475

90

$9.631

$9.246

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$8.475

Kenton Components

USA . 403 parts In-Stock

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$11.557

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$10.170

403

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Ampacity Inc.

Singapore . 922 parts In-Stock

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$12.000

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Aztec Data Supply Inc.

USA . 2,459 parts In-Stock

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$14.360

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AZTECH Wire

Italy . 683 parts In-Stock

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Qasali Group International

UK . 110 parts In-Stock

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$26.004

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$24.183

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$22.883

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One Stop Electronics

USA . 2,447 parts In-Stock

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$102.000

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Semicontronic

India . 337 parts In-Stock

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$360.000

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$351.000

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$349.200

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Corphita

USA . 2,838 parts In-Stock

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Continental Prestige Electronics

USA . 2,634 parts In-Stock

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Argo Parts USA

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Perfect Parts

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Bastille Electronics

Australia . 67 parts In-Stock

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Overview

Elevate your telecom interface solutions with the MAX2851ITK+T by Analog Devices. As a trusted manufacturer in the industry, Analog Devices delivers top-notch quality and reliability. This versatile product falls under the category of Other Function Telecom Interface ICs, offering a wide range of applications. With its surface mount capability, square package shape, and 68 terminals, this chip carrier is designed for optimal performance. Experience the benefits of seamless integration, high efficiency, and precision engineering with the MAX2851ITK+T. Upgrade your telecommunications systems today and stay ahead of the competition with this innovative solution.

Feature Benefit Bullets

Surface Mount: YES

This allows for easy and secure mounting on PCBs, simplifying the assembly process.

Package Shape: SQUARE

The square shape helps optimize space on the PCB, making it ideal for compact designs.

No. of Terminals: 68

With a high number of terminals, this IC offers a wide range of functionalities and connectivity options.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style ensures efficient heat dissipation and space-saving design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC is suitable for a wide range of environments.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature allows for reliable performance even in extreme cold conditions.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides excellent solderability and durability, ensuring a reliable connection.

Terminal Position: QUAD

The quad terminal position offers stable and secure connections for better overall performance.

Maximum Seated Height: 0.8 mm

The low seated height allows for a slim profile and space-efficient placement on the PCB.

Width: 10 mm

The compact width makes it suitable for designs where space is limited.

Maximum Time At Peak Reflow Temperature (s): 30

This IC can withstand peak reflow temperatures for a sufficient duration, ensuring proper soldering.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability makes this IC suitable for lead-free soldering processes.

Length: 10 mm

The compact length complements the width, making it ideal for space-constrained designs.

Technology: BICMOS

The BICMOS technology offers a balance of speed and power efficiency, making this IC versatile for various applications.

Terminal Form: NO LEAD

The no-lead terminal form reduces the chance of lead-related issues and offers a more environmentally friendly option.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring reliable and efficient communication functions.

Nominal Supply Voltage: 2.85 V

The nominal supply voltage compatibility makes it suitable for a wide range of power input requirements.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting on the PCB, maximizing space usage.

Moisture Sensitivity Level (MSL): 3

With a moderate moisture sensitivity level, this IC can withstand typical handling and storage conditions.

Technical Specifications

Other Function Telecom Interface ICs MAX2851ITK+T attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N68

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

2.85 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

MAX2851ITK+T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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