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BM70BLE01FC2-0B04AA

Microchip Technology

BM70BLE01FC2-0B04AA by Microchip Technology

The Microchip Technology BM70BLE01FC2-0B04AA is a telecom IC with 30 terminals, operating temperature range of -40 to 85°C, and data rate of 0.0086 Mbps. It is designed for industrial applications requiring a nominal voltage of 3V, such as wireless communication systems.

Median Price

$7.650

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 82 parts In-Stock

1+ parts

$1.368

100+ parts

-

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82

$1.368

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Microchip Technology

USA . 272 parts In-Stock

1+ parts

$7.650

100+ parts

$6.550

1k+ parts

$5.880

10k+ parts

$5.500

272

$7.650

$6.550

$5.880

$5.500

DigiKey

USA . 73 parts In-Stock

1+ parts

$7.650

100+ parts

$6.988

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-

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73

$7.650

$6.988

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Newark

USA . 106 parts In-Stock

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$7.880

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106

$7.880

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Element14

Singapore . 107 parts In-Stock

1+ parts

$8.110

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107

$8.110

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Verical

USA . 106 parts In-Stock

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$6.625

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106

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$6.625

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 272 parts In-Stock

1+ parts

$8.220

100+ parts

$7.450

1k+ parts

$6.820

10k+ parts

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272

$8.220

$7.450

$6.820

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VNN

France . 22,139 parts In-Stock

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Vyrian

USA . 4,059 parts In-Stock

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4,059

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 144 parts In-Stock

1+ parts

$1.640

100+ parts

-

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144

$1.640

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Component Stockers USA

USA . 849 parts In-Stock

1+ parts

$3.040

100+ parts

$4.610

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849

$3.040

$4.610

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Continental Prestige Electronics

USA . 69 parts In-Stock

1+ parts

$5.530

100+ parts

$5.140

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69

$5.530

$5.140

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Corohmni

South Africa . 102 parts In-Stock

1+ parts

$11.151

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102

$11.151

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Advanced Electronics

New Zealand . 90 parts In-Stock

1+ parts

$16.668

100+ parts

$15.168

1k+ parts

$13.668

10k+ parts

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90

$16.668

$15.168

$13.668

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Marpe Global Electronics

Taiwan . 5,462 parts In-Stock

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5,462

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QualityLine Systems

Poland . 5,462 parts In-Stock

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5,462

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XL Components Corporation

Australia . 5,462 parts In-Stock

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5,462

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Netroflash

USA . 1,000 parts In-Stock

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1,000

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Overview

Enhance your communication devices with the BM70BLE01FC2-0B04AA from Microchip Technology. Designed with precision and reliability in mind, this Telecom Interface IC offers unmatched quality and performance. Ideal for a wide range of applications, this product ensures seamless connectivity and efficient data transmission. With its advanced features and industrial-grade temperature grade, customers can trust in the value and benefits that this product brings. Upgrade your technology today with the BM70BLE01FC2-0B04AA and experience the convenience and reliability that Microchip Technology is known for.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting on PCBs, saving space and simplifying assembly process.

Screening Level: TS 16949

TS 16949 is a quality management standard specific to the automotive industry, indicating high quality and reliability of the product.

Package Shape: RECTANGULAR

Rectangular shape facilitates easy integration into various electronic devices and PCB layouts.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Nominal Supply Voltage: 3 V

Compatible with common voltage supply standards, making it suitable for a wide range of applications.

Data Rate: 0.0086 Mbps

Capable of handling data transfer at a moderate speed, suitable for many telecom applications.

Technical Specifications

Other Function Telecom Interface ICs BM70BLE01FC2-0B04AA attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

Data Rate:

.0086 Mbps

JESD-30 Code:

R-XXMA-N30

Length:

15 mm

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

XMA

Package Equivalence Code:

MODULE,30LEAD(UNSPEC)

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Screening Level:

TS 16949

Maximum Seated Height:

.66 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.1 mm

Terminal Position:

UNSPECIFIED

Width:

12 mm

Trade Compliance

BM70BLE01FC2-0B04AA Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8529.90.22.00

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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