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XWL1801MODGAMOCT

Texas Instruments

XWL1801MODGAMOCT by Texas Instruments

XWL1801MODGAMOCT by Texas Instruments is a telecom IC with 100 terminals in a rectangular grid array package. It operates b/w -20°C to 70°C, with a compact size of 13.3mm x 13.4mm and terminal pitch of 0.7mm. Ideal for telecom interface applications requiring surface mount technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,290 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,290

-

-

-

-

Vyrian

USA . 3,094 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,094

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,880 parts In-Stock

1+ parts

$10.258

100+ parts

-

1k+ parts

$10.791

10k+ parts

-

1,880

$10.258

-

$10.791

-

DigiPath Technology Company

USA . 1,559 parts In-Stock

1+ parts

$11.295

100+ parts

-

1k+ parts

-

10k+ parts

-

1,559

$11.295

-

-

-

ChromeModa Solutions

Germany . 4,176 parts In-Stock

1+ parts

$11.526

100+ parts

$9.451

1k+ parts

-

10k+ parts

-

4,176

$11.526

$9.451

-

-

IDEA Electronic Components Group

UK . 987 parts In-Stock

1+ parts

$11.526

100+ parts

$10.950

1k+ parts

$10.373

10k+ parts

-

987

$11.526

$10.950

$10.373

-

AZTECH Wire

Italy . 847 parts In-Stock

1+ parts

$18.961

100+ parts

-

1k+ parts

-

10k+ parts

-

847

$18.961

-

-

-

One Stop Electronics

USA . 937 parts In-Stock

1+ parts

$123.000

100+ parts

-

1k+ parts

-

10k+ parts

-

937

$123.000

-

-

-

Corphita

USA . 3,013 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,013

-

-

-

-

Overview

Enhance your telecommunications projects with the XWL1801MODGAMOCT by Texas Instruments, a top-quality telecom interface IC that delivers unparalleled performance and reliability. Manufactured by industry leader Texas Instruments, this product is designed to meet the demands of modern communication systems, offering seamless connectivity and efficient operation. Whether you're working on networking equipment, mobile devices, or IoT applications, this innovative IC provides the value, benefits, and advantages you need to bring your projects to the next level. Upgrade your designs today with the XWL1801MODGAMOCT and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Being made of plastic/epoxy, this product is lightweight and durable, making it suitable for various telecom applications.

Surface Mount: YES

The surface mount feature allows for easy installation and saves space on the PCB, making it a convenient choice for compact designs.

No. of Terminals: 100

With a high number of terminals, this product offers a wide range of connectivity options, making it versatile for different telecom interface requirements.

Maximum Operating Temperature: 70 °C

The maximum operating temperature of 70°C ensures reliable performance under normal operating conditions.

Width: 13.3 mm

With a compact width of 13.3 mm, this product can fit into tight spaces and is ideal for space-constrained applications.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuits, this product offers optimized performance and functionality for telecom applications.

Technical Specifications

Other Function Telecom Interface ICs XWL1801MODGAMOCT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PBGA-N100

Length:

13.4 mm

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

LGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.7 mm

Terminal Position:

BOTTOM

Width:

13.3 mm

Trade Compliance

XWL1801MODGAMOCT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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