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XWL1805MODGAMOCR

Texas Instruments

XWL1805MODGAMOCR by Texas Instruments

XWL1805MODGAMOCR by Texas Instruments is a Telecom IC with 130 terminals in a grid array package. Operates b/w -20°C to 70°C, with nominal voltage of 3.7V. Ideal for telecom circuit applications due to its compact rectangular shape and surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,322 parts In-Stock

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4,322

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Digiode

USA . 1,463 parts In-Stock

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1,463

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 518 parts In-Stock

1+ parts

$5.213

100+ parts

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518

$5.213

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Parana Technologies

USA . 1,289 parts In-Stock

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$7.615

100+ parts

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$8.131

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1,289

$7.615

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$8.131

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DigiPath Technology Company

USA . 1,252 parts In-Stock

1+ parts

$8.385

100+ parts

$7.714

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1,252

$8.385

$7.714

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ChromeModa Solutions

Germany . 4,214 parts In-Stock

1+ parts

$8.556

100+ parts

$7.016

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4,214

$8.556

$7.016

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IDEA Electronic Components Group

UK . 1,868 parts In-Stock

1+ parts

$8.556

100+ parts

$8.128

1k+ parts

$7.700

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1,868

$8.556

$8.128

$7.700

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One Stop Electronics

USA . 270 parts In-Stock

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$972.000

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270

$972.000

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Corphita

USA . 1,777 parts In-Stock

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1,777

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Overview

Elevate your telecom interface with the XWL1805MODGAMOCR by Texas Instruments, a top-of-the-line solution for all your connectivity needs. Crafted by industry-leading manufacturers, this product guarantees quality and reliability like no other. Perfect for a wide range of applications, this telecom IC offers unparalleled value, benefits, and advantages to customers looking to enhance their communication systems. Say goodbye to connectivity issues and hello to seamless communication with the XWL1805MODGAMOCR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the IC, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto printed circuit boards, saving time and cost in production.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate into various electronic devices and systems.

No. of Terminals: 130

Having a high number of terminals allows for versatile connectivity and communication options.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions.

Nominal Supply Voltage: 3.7 V

Operating at a low supply voltage makes the IC energy-efficient and suitable for portable devices.

Technical Specifications

Other Function Telecom Interface ICs XWL1805MODGAMOCR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PBGA-B130

Length:

13.4 mm

No. of Functions:

1

No. of Terminals:

130

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2 mm

Nominal Supply Voltage:

3.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Width:

13.3 mm

Trade Compliance

XWL1805MODGAMOCR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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