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XWL1835MODGAMOCT

Texas Instruments

XWL1835MODGAMOCT by Texas Instruments

XWL1835MODGAMOCT by Texas Instruments is a telecom IC with 100 terminals in a rectangular grid array package. It operates b/w -20°C to 70°C, with a nominal voltage of 3.7V. This IC is designed for telecom circuit applications requiring surface mount installation and has a compact size of 13.3mm x 13.4mm x 2mm.

Median Price

$16.480

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 130 parts In-Stock

1+ parts

$16.480

100+ parts

$16.150

1k+ parts

$15.820

10k+ parts

-

130

$16.480

$16.150

$15.820

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,373 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,373

-

-

-

-

Digiode

USA . 409 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

409

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,250 parts In-Stock

1+ parts

$11.267

100+ parts

$1,046.266

1k+ parts

$10.140

10k+ parts

-

2,250

$11.267

$1,046.266

$10.140

-

AZTECH Wire

Italy . 812 parts In-Stock

1+ parts

$11.992

100+ parts

-

1k+ parts

-

10k+ parts

-

812

$11.992

-

-

-

DigiPath Technology Company

USA . 1,389 parts In-Stock

1+ parts

$12.406

100+ parts

-

1k+ parts

-

10k+ parts

-

1,389

$12.406

-

-

-

ChromeModa Solutions

Germany . 4,094 parts In-Stock

1+ parts

$12.659

100+ parts

$10.380

1k+ parts

-

10k+ parts

-

4,094

$12.659

$10.380

-

-

IDEA Electronic Components Group

UK . 1,786 parts In-Stock

1+ parts

$12.659

100+ parts

$12.026

1k+ parts

$11.393

10k+ parts

-

1,786

$12.659

$12.026

$11.393

-

One Stop Electronics

USA . 363 parts In-Stock

1+ parts

$29.000

100+ parts

-

1k+ parts

-

10k+ parts

-

363

$29.000

-

-

-

Corphita

USA . 1,220 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,220

-

-

-

-

Overview

Upgrade your communication systems with the cutting-edge XWL1835MODGAMOCT by Texas Instruments. Known for its top-notch quality and reliability, this telecom interface IC offers seamless integration and enhanced performance. Whether you're looking to improve data transmission or optimize network efficiency, this product is designed to meet your needs. Experience the value of Texas Instruments technology and unlock a world of benefits with the XWL1835MODGAMOCT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the telecom interface IC, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easy integration into circuit board designs, saving space and making assembly more efficient.

Package Shape: RECTANGULAR

Rectangular shape makes for easier placement and orientation within electronic devices, optimizing space usage.

No. of Terminals: 100

Having 100 terminals provides a wide range of connectivity options, making the IC versatile and compatible with various systems.

Package Style (Meter): GRID ARRAY

Grid array packaging offers better thermal performance and signal integrity, improving overall reliability of the telecom interface IC.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this IC can function effectively in a variety of environments without overheating.

Minimum Operating Temperature: -20 °C

The ability to operate at temperatures as low as -20°C makes this IC suitable for use in cold conditions without compromising performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy connection with other components, streamlining the assembly process and reducing potential errors.

Maximum Seated Height: 2 mm

With a maximum seated height of 2 mm, this IC can be installed in compact spaces without interfering with overall device design.

Width: 13.3 mm

A width of 13.3 mm allows for a slim profile, enabling the IC to be used in devices where space is limited.

Length: 13.4 mm

A length of 13.4 mm provides a compact form factor, making the IC suitable for small electronic devices and applications.

Terminal Form: NO LEAD

No lead terminals reduce the risk of electrical shorts and make soldering easier, enhancing the overall reliability of the IC.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuits, this IC offers optimized performance and functionality for telecommunications applications.

Nominal Supply Voltage: 3.7 V

Operating at a nominal supply voltage of 3.7 V, this IC is energy-efficient and compatible with standard power sources.

Terminal Pitch: 0.7 mm

A terminal pitch of 0.7 mm provides precise connectivity and spacing between terminals, reducing the risk of signal interference.

Technical Specifications

Other Function Telecom Interface ICs XWL1835MODGAMOCT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PBGA-N100

Length:

13.4 mm

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

LGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2 mm

Nominal Supply Voltage:

3.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.7 mm

Terminal Position:

BOTTOM

Width:

13.3 mm

Trade Compliance

XWL1835MODGAMOCT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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