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XWL1835MODGAMOCR

Texas Instruments

XWL1835MODGAMOCR by Texas Instruments

XWL1835MODGAMOCR by Texas Instruments is a telecom IC with 130 terminals in a grid array package. It operates b/w -20°C to 70°C, with a nominal voltage of 3.7V. This rectangular plastic/epoxy package is surface mountable and suitable for telecom circuit applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,456 parts In-Stock

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3,456

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Digiode

USA . 2,618 parts In-Stock

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2,618

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 557 parts In-Stock

1+ parts

$11.801

100+ parts

$1,095.856

1k+ parts

$10.620

10k+ parts

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557

$11.801

$1,095.856

$10.620

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DigiPath Technology Company

USA . 445 parts In-Stock

1+ parts

$12.994

100+ parts

$11.954

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445

$12.994

$11.954

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ChromeModa Solutions

Germany . 3,198 parts In-Stock

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$13.259

100+ parts

$10.872

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3,198

$13.259

$10.872

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IDEA Electronic Components Group

UK . 1,137 parts In-Stock

1+ parts

$13.259

100+ parts

$12.596

1k+ parts

$11.933

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1,137

$13.259

$12.596

$11.933

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AZTECH Wire

Italy . 649 parts In-Stock

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$17.891

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649

$17.891

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One Stop Electronics

USA . 741 parts In-Stock

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$72.000

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741

$72.000

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Semicontronic

India . 218 parts In-Stock

1+ parts

$90.000

100+ parts

$87.750

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$87.300

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218

$90.000

$87.750

$87.300

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Ampacity Inc.

Singapore . 213 parts In-Stock

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$962.000

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213

$962.000

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Corphita

USA . 4,152 parts In-Stock

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Corohmni

South Africa . 356 parts In-Stock

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356

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Overview

Unlock the power of seamless communication with the XWL1835MODGAMOCR by Texas Instruments. As a leader in cutting-edge technology, Texas Instruments delivers unparalleled quality and innovation in the telecom interface ICs category. This versatile product offers a wide range of applications, providing customers with superior performance and reliability. Experience the value and benefits of effortless connectivity with the XWL1835MODGAMOCR, designed to elevate your communication experience to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC material provides durability and EPOXY ensures good electrical insulation, making this product suitable for long-term use in various environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and reducing production costs.

Package Shape: RECTANGULAR

Rectangular shape enables easy integration into existing circuit designs and layouts, maximizing space efficiency.

No. of Terminals: 130

With a high number of terminals, this product offers extensive connectivity options for versatile communication applications.

Package Style (Meter): GRID ARRAY

Grid array package style provides a compact footprint while offering high terminal density, contributing to overall space-saving benefits.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can perform reliably under normal operating conditions without overheating.

Minimum Operating Temperature: -20 °C

The minimum operating temperature of -20°C ensures this product can function in a wide range of temperature environments, making it versatile and suitable for various applications.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier soldering and connection to the circuit board, simplifying the installation process.

Maximum Seated Height: 2 mm

The low maximum seated height of 2mm allows for a slim profile, making this product ideal for applications with space constraints.

Width: 13.3 mm

The compact width of 13.3mm makes this product suitable for integration into smaller electronic devices or circuitry.

Length: 13.4 mm

The length of 13.4mm provides a balanced form factor, suitable for various circuit board layouts and installations.

Terminal Form: BALL

Ball terminal form offers reliable contact with the circuit board and minimizes the risk of poor connections or signal loss.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this product offers optimized performance and reliability in communication systems.

Nominal Supply Voltage: 3.7 V

The nominal supply voltage of 3.7V ensures compatibility with common power sources and enables efficient power management within the circuit.

Technical Specifications

Other Function Telecom Interface ICs XWL1835MODGAMOCR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PBGA-B130

Length:

13.4 mm

No. of Functions:

1

No. of Terminals:

130

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2 mm

Nominal Supply Voltage:

3.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Width:

13.3 mm

Trade Compliance

XWL1835MODGAMOCR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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