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MD0100DK6-G

Microchip Technology

MD0100DK6-G by Microchip Technology

Microchip Technology's MD0100DK6-G is a Telecom IC with 8 terminals, operating b/w -40 to 125°C. It features a small outline package style and matte tin finish, suitable for automotive applications requiring telecom circuit interfaces. The IC is TS 16949 compliant and surface mountable, making it ideal for compact designs in telecommunications equipment.

Median Price

$1.870

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 22 parts In-Stock

1+ parts

$1.171

100+ parts

-

1k+ parts

-

10k+ parts

-

22

$1.171

-

-

-

DigiKey

USA . 517 parts In-Stock

1+ parts

$3.150

100+ parts

$2.601

1k+ parts

-

10k+ parts

-

517

$3.150

$2.601

-

-

Master Electronics

USA . 772 parts In-Stock

1+ parts

-

100+ parts

$2.570

1k+ parts

$2.530

10k+ parts

$2.330

772

-

$2.570

$2.530

$2.330

Verical

USA . 22 parts In-Stock

1+ parts

-

100+ parts

$1.078

1k+ parts

-

10k+ parts

-

22

-

$1.078

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,567 parts In-Stock

1+ parts

-

100+ parts

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2,567

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-

-

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Electro Sonic

Canada . 2,420 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.380

10k+ parts

$2.340

2,420

-

-

$2.380

$2.340

IBS Electronics

USA . 972 parts In-Stock

1+ parts

-

100+ parts

$3.338

1k+ parts

$3.254

10k+ parts

$3.212

972

-

$3.338

$3.254

$3.212

Nova Conductors

Japan . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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750

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,252 parts In-Stock

1+ parts

$2.660

100+ parts

-

1k+ parts

-

10k+ parts

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2,252

$2.660

-

-

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Aztec Data Supply Inc.

USA . 2,002 parts In-Stock

1+ parts

$6.099

100+ parts

-

1k+ parts

-

10k+ parts

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2,002

$6.099

-

-

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Corohmni

South Africa . 207 parts In-Stock

1+ parts

$7.172

100+ parts

-

1k+ parts

-

10k+ parts

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207

$7.172

-

-

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Microchip USA

USA . 1,585 parts In-Stock

1+ parts

$15.540

100+ parts

$15.440

1k+ parts

$15.390

10k+ parts

$15.340

1,585

$15.540

$15.440

$15.390

$15.340

Kepictronics

USA . 30,839 parts In-Stock

1+ parts

-

100+ parts

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30,839

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 25,481 parts In-Stock

1+ parts

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25,481

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Lixinc

USA . 13,974 parts In-Stock

1+ parts

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100+ parts

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13,974

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-

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Continental Prestige Electronics

USA . 4,062 parts In-Stock

1+ parts

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4,062

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Fulton Briggs Corp.

USA . 2,959 parts In-Stock

1+ parts

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2,959

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-

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Argo Parts USA

USA . 1,412 parts In-Stock

1+ parts

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100+ parts

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1,412

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-

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Bastille Electronics

Australia . 120 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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120

-

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-

Overview

Elevate your telecom interface with the MD0100DK6-G by Microchip Technology. Designed with precision and quality in mind, this innovative product offers a range of benefits for various applications in the telecommunications industry. Whether you're looking to enhance connectivity or improve performance, this small outline, heat sink IC delivers exceptional value with its automotive-grade temperature grade, dual-terminal position, and matte tin finish. Trust in Microchip Technology to provide reliable solutions that meet your needs and exceed your expectations. Experience seamless integration and superior functionality with the MD0100DK6-G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material in the package body makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on the PCB.

Screening Level: TS 16949

TS 16949 screening level ensures high quality and reliability, making this product suitable for demanding applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this product can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The product can operate efficiently in very low temperatures as low as -40 °C.

Terminal Finish: MATTE TIN

The use of MATTE TIN terminal finish provides good conductivity and corrosion resistance.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this product offers optimized performance in telecom interfaces.

Technical Specifications

Other Function Telecom Interface ICs MD0100DK6-G attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Length:

4 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.16SQ,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Width:

4 mm

Trade Compliance

MD0100DK6-G Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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