Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TLE8457ALEXUMA1 by Infineon is a BICMOS technology telecom IC with 8 terminals in a small outline package. It operates at a nominal voltage of 8V and has a terminal pitch of 0.65mm. This IC is suitable for telecom circuit applications due to its AEC-Q100 screening level and moisture sensitivity level of 2A.
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PLASTIC/EPOXY material provides durability and protection for the IC, ensuring a longer lifespan.
Surface mount capability allows for easy installation on PCBs, saving space and simplifying manufacturing processes.
AEC-Q100 screening ensures high reliability and quality standards, making this IC suitable for automotive applications.
Having 8 terminals provides flexibility in connectivity options, allowing for versatile applications.
BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high performance and low power consumption.
An 8V supply voltage is commonly used in telecom applications, ensuring compatibility with existing systems.
Other Function Telecom Interface ICs TLE8457ALEXUMA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies
JESD-30 Code:
JESD-609 Code:
Length:
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No. of Functions:
No. of Terminals:
Package Body Material:
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Package Shape:
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Screening Level:
Maximum Seated Height:
Nominal Supply Voltage:
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Technology:
Telecom IC Type:
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Width:
TLE8457ALEXUMA1 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
M39029/58-360
Conesys
CONNECTOR ACCESSORY; MIL Conformity: YES; Mating Contacts: M39029/57-354; Terminal Type: CRIMP; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT;
LL4148
Goodwork Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SMBJ18CA
Changzhou Galaxy Century Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Rectron
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Semitronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Jiangsu Jiejie Microelectronics
LM317T
Analog Devices
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; No. of Functions: 1; Package Body Material: PLASTIC/EPOXY; Surface Mount: NO;
2N2222A
M/a-com Technology Solutions
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Terminal Position: BOTTOM; Package Style (Meter): CYLINDRICAL;
Bay Linear
Other Regulators; No. of Terminals: 3; No. of Outputs: 1; Surface Mount: NO; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel;
Yangzhou Yangjie Electronics
2N7002
Dc Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Terminal Form: GULL WING;
BAV99
Zetex Plc
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Jiangsu Changjiang Electronics Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE; Maximum Drain Current (ID): .22 A; Package Shape: RECTANGULAR;
OPA2277UA/2K5
Texas Instruments
OPA2277UA/2K5 by Texas Instruments is a dual operational amplifier with low offset voltage of 100 uV and micropower consumption of 0.004 uA. Ideal for industrial applications, it offers high common mode rejection ratio of 140 dB and unity gain bandwidth of 1 MHz. With a compact rectangular package style, it is suitable for surface mount designs in various electronic systems.
General Diode
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Terminal Finish: Tin/Lead (Sn/Pb); No. of Elements: 1;
SS14
Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Operating Mode: ENHANCEMENT MODE; Maximum Drain Current (ID): .115 A;
LM107H
Intersil
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Nominal Common Mode Reject Ratio: 96 dB;
NE555D
Philips Semiconductors
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
ISL32275EFVZ-T
Renesas Electronics
ISL32275EFVZ-T by Renesas Electronics is a BICMOS technology telecom IC with 16 terminals in a small outline package. It operates b/w -40 to 125°C, suitable for automotive applications. With a nominal voltage of 3.3V and matte tin terminal finish, it is ideal for telecom circuit designs.
BGM111A256V21R
Silicon Labs
BGM111A256V21R by Silicon Labs is a telecom IC with 31 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 1.2mm, suitable for industrial applications requiring compact MICROELECTRONIC ASSEMBLY packages in surface mount form.
RS9116W-SB00-B00-B2A
TELECOM CIRCUIT;
RN4020-V/RM123
Microchip Technology
RN4020-V/RM123 by Microchip Technology is a telecom IC with 24 terminals, operating at 3.3V. It offers a data rate of 1 Mbps and operates b/w -30 to 85°C. Ideal for telecom applications requiring high-speed data transmission in compact designs.
CC2520RHDR
CC2520RHDR by Texas Instruments is a Telecom IC with 28 terminals in a square chip carrier package. It operates b/w -40 to 125°C, suitable for automotive applications. With a data rate of 0.25 Mbps and terminal pitch of 0.5 mm, it's ideal for telecom circuits requiring a 3V supply voltage.
CYBT-343026-01
Cypress Semiconductor
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 24; Package Shape: RECTANGULAR; Surface Mount: YES;
TDA5210XUMA1
Infineon Technologies
TDA5210XUMA1 by Infineon is a telecom IC with 28 terminals, operating from -40 to 105°C. It features a small outline package style, tin terminal finish, and 5V supply voltage. Ideal for telecom circuits, it has a rectangular shape and thin profile suitable for industrial applications.
BT840X
Fanstel
BT840X by Fanstel is a surface mount telecom IC with 61 terminals. It operates b/w -40°C to 85°C, has a nominal voltage of 3.3V, and supports data rates up to 2 Mbps. Ideal for applications requiring high-speed telecommunications in compact electronic assemblies.
UBX-M8030-KT
U-blox Ag
UBX-M8030-KT by U-blox Ag is a telecom IC with AEC-Q100 screening. It operates in industrial temperature range (-40 to 85 °C) and has a supply voltage of 3V. This square chip carrier package with 40 terminals is suitable for telecom circuit applications.
NRF24LE1-F16Q48-T
Nordic Semiconductor Asa
NRF24LE1-F16Q48-T by Nordic Semiconductor Asa is a telecom IC with 48 terminals, operating at -40 to 85°C. It offers a data rate of 2 Mbps, suitable for industrial applications requiring a compact chip carrier package style. With a nominal voltage of 3V and surface mount capability, it's ideal for telecom interface functions in various electronic devices.
DA14682-00F08A92
Dialog Semiconductor
Other Telecom ICs; Peak Reflow Temperature (C): 255; Moisture Sensitivity Level (MSL): 3;
CYBLE-212006-01
Infineon Technologies' CYBLE-212006-01 is a surface mount telecom IC with 1 function. It has a rectangular package shape, 30 terminals, and a max seated height of 2mm. With an operating temperature range of -40 to 85°C, it is suitable for industrial applications.
TESEO-LIV3F
STMicroelectronics
TESEO-LIV3F by STMicroelectronics is a telecom IC with 18 terminals, operating at -40 to 85°C. It has a nominal voltage of 3.3V and compact dimensions of 9.7mm width and 10.1mm length. Ideal for industrial applications requiring a telecom circuit with a terminal pitch of 1.1mm in a rectangular package style.
453-00006C
Laird Technologies
453-00006C by Laird Technologies is a surface mount IC with 39 terminals, operating b/w -40 to 85°C. With a compact rectangular package style, it's ideal for industrial telecom circuits requiring a 3V supply voltage. Featuring a low profile of 2.33mm and dimensions of 14x10mm, it suits applications needing high temperature tolerance and small form factor.
RN41SM-I/RM
Microchip Technology's RN41SM-I/RM is a telecom IC with 32 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and gold over nickel terminal finish. This rectangular package is ideal for industrial applications requiring reliable telecom circuit interfaces.
RS9116W-SB00-B00
Silicon Labs RS9116W-SB00-B00 is a telecom IC with 126 terminals, operating from -40 to 85°C. It has a supply voltage of 1.85V and is designed for industrial applications requiring surface mount technology in a grid array package.
CY7B923-JXIT
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;
CYBT-353027-02
Infineon's CYBT-353027-02 is a square-shaped, surface-mountable telecom IC with 19 terminals. Operating b/w -30°C to 85°C, it has a seated height of 1.75mm and terminal pitch of 1.05mm. Ideal for telecom circuits, this microelectronic assembly is suitable for various applications requiring compact design and reliable performance.
PN5120A0HN1/C2,118
NXP Semiconductors
NXP Semiconductors PN5120A0HN1/C2,118 is a telecom IC with 32 terminals in a square chip carrier package. Operating at -30 to 85°C, it supports power supplies of 1.8/3.3V and 2.5/3.3V for various applications requiring surface mount technology and moisture sensitivity level of 1.
HTRC11001T/03EE,11
The NXP Semiconductors HTRC11001T/03EE,11 is a telecom interface IC with 1 function and 14 terminals. It operates at temperatures ranging from -40 to 85°C and has a supply voltage of 5V. This small outline package is suitable for industrial applications requiring reliable telecom circuitry.
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TLE8457BSJXUMA1
TELECOM CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
TLE8457BLEXUMA1
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: SON; Package Shape: SQUARE; Width: 3 mm;
TLE8457ASJXUMA1
TLE8457ASJXUMA1 by Infineon is a BICMOS technology Telecom IC with 8 terminals in a small outline package. It operates at 8V, AEC-Q100 screening level, suitable for telecom circuit applications. The Gull Wing terminal form and compact size make it ideal for space-constrained designs.
TLE8457ALE
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HTSON; Package Shape: SQUARE; Technology: BICMOS;
TLE8457ASJ
TELECOM CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Technology: BICMOS;
TLE8457BLE
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HTSON; Package Shape: SQUARE; Nominal Supply Voltage: 8 V;
TLE8457BSJ
TELECOM CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Length: 5 mm;
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