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TLE8457ALEXUMA1

Infineon Technologies

TLE8457ALEXUMA1 by Infineon Technologies

TLE8457ALEXUMA1 by Infineon is a BICMOS technology telecom IC with 8 terminals in a small outline package. It operates at a nominal voltage of 8V and has a terminal pitch of 0.65mm. This IC is suitable for telecom circuit applications due to its AEC-Q100 screening level and moisture sensitivity level of 2A.

Median Price

$1.025

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 4,795 parts In-Stock

1+ parts

$0.763

100+ parts

$0.729

1k+ parts

$0.694

10k+ parts

$0.682

4,795

$0.763

$0.729

$0.694

$0.682

Chip1Stop

Japan . 4,815 parts In-Stock

1+ parts

$1.080

100+ parts

$0.771

1k+ parts

$0.742

10k+ parts

-

4,815

$1.080

$0.771

$0.742

-

Mouser Electronics

USA . 9,975 parts In-Stock

1+ parts

$1.550

100+ parts

$0.913

1k+ parts

$0.798

10k+ parts

$0.733

9,975

$1.550

$0.913

$0.798

$0.733

DigiKey

USA . 9,596 parts In-Stock

1+ parts

$1.550

100+ parts

$0.912

1k+ parts

$0.798

10k+ parts

$0.737

9,596

$1.550

$0.912

$0.798

$0.737

Rochester

USA . 7,956 parts In-Stock

1+ parts

-

100+ parts

$0.934

1k+ parts

$0.776

10k+ parts

$0.692

7,956

-

$0.934

$0.776

$0.692

Verical

USA . 4,306 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.970

10k+ parts

$0.864

4,306

-

-

$0.970

$0.864

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 372 parts In-Stock

1+ parts

$0.768

100+ parts

-

1k+ parts

-

10k+ parts

-

372

$0.768

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$1.305

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$1.305

-

-

-

Vyrian

USA . 5,391 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,391

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 5,089 parts In-Stock

1+ parts

$0.620

100+ parts

$0.604

1k+ parts

$0.601

10k+ parts

-

5,089

$0.620

$0.604

$0.601

-

Ampacity Inc.

Singapore . 4,991 parts In-Stock

1+ parts

$0.620

100+ parts

-

1k+ parts

-

10k+ parts

-

4,991

$0.620

-

-

-

Corphita

USA . 509 parts In-Stock

1+ parts

$0.727

100+ parts

-

1k+ parts

-

10k+ parts

-

509

$0.727

-

-

-

Continental Prestige Electronics

USA . 9,966 parts In-Stock

1+ parts

$0.733

100+ parts

$0.494

1k+ parts

$0.343

10k+ parts

-

9,966

$0.733

$0.494

$0.343

-

Modulus Dynamics

Lithuania . 571 parts In-Stock

1+ parts

$0.886

100+ parts

$0.851

1k+ parts

$0.815

10k+ parts

-

571

$0.886

$0.851

$0.815

-

Corohmni

South Africa . 137 parts In-Stock

1+ parts

$0.886

100+ parts

-

1k+ parts

-

10k+ parts

-

137

$0.886

-

-

-

Component Stockers USA

USA . 17,743 parts In-Stock

1+ parts

$0.900

100+ parts

$0.810

1k+ parts

$0.720

10k+ parts

-

17,743

$0.900

$0.810

$0.720

-

Argo Parts USA

USA . 4,211 parts In-Stock

1+ parts

$1.305

100+ parts

-

1k+ parts

-

10k+ parts

-

4,211

$1.305

-

-

-

Aztec Data Supply Inc.

USA . 1,226 parts In-Stock

1+ parts

$17.060

100+ parts

-

1k+ parts

-

10k+ parts

-

1,226

$17.060

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$1.279

1k+ parts

$1.240

10k+ parts

$1.213

50

-

$1.279

$1.240

$1.213

Overview

Unleash the power of seamless communication with the TLE8457ALEXUMA1 by Infineon Technologies. Crafted with precision and expertise, this telecom interface IC promises unparalleled quality and reliability. From small outline packaging to dual terminal position, this product offers a wide range of applications in the telecommunications industry. Elevate your projects with Infineon's cutting-edge technology and experience the value and benefits of top-notch connectivity solutions. Choose the TLE8457ALEXUMA1 for superior performance and unmatched customer satisfaction.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the IC, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and simplifying manufacturing processes.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards, making this IC suitable for automotive applications.

No. of Terminals: 8

Having 8 terminals provides flexibility in connectivity options, allowing for versatile applications.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high performance and low power consumption.

Nominal Supply Voltage: 8 V

An 8V supply voltage is commonly used in telecom applications, ensuring compatibility with existing systems.

Technical Specifications

Other Function Telecom Interface ICs TLE8457ALEXUMA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

2A

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Screening Level:

AEC-Q100

Maximum Seated Height:

1.15 mm

Nominal Supply Voltage:

8 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

TLE8457ALEXUMA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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