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TLE8457ASJXUMA1

Infineon Technologies

TLE8457ASJXUMA1 by Infineon Technologies

TLE8457ASJXUMA1 by Infineon is a BICMOS technology Telecom IC with 8 terminals in a small outline package. It operates at 8V, AEC-Q100 screening level, suitable for telecom circuit applications. The Gull Wing terminal form and compact size make it ideal for space-constrained designs.

Median Price

$0.870

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1,640 parts In-Stock

1+ parts

$0.897

100+ parts

$0.540

1k+ parts

$0.377

10k+ parts

$0.320

1,640

$0.897

$0.540

$0.377

$0.320

Element14

Singapore . 1,640 parts In-Stock

1+ parts

$1.820

100+ parts

$1.180

1k+ parts

$0.828

10k+ parts

$0.707

1,640

$1.820

$1.180

$0.828

$0.707

Rochester

USA . 32,500 parts In-Stock

1+ parts

-

100+ parts

$0.811

1k+ parts

$0.673

10k+ parts

$0.601

32,500

-

$0.811

$0.673

$0.601

Verical

USA . 32,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.842

10k+ parts

$0.751

32,500

-

-

$0.842

$0.751

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 742 parts In-Stock

1+ parts

$0.632

100+ parts

-

1k+ parts

-

10k+ parts

-

742

$0.632

-

-

-

Nova Conductors

Japan . 30 parts In-Stock

1+ parts

$1.355

100+ parts

-

1k+ parts

-

10k+ parts

-

30

$1.355

-

-

-

Vyrian

USA . 49,944 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

49,944

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 49,529 parts In-Stock

1+ parts

$0.570

100+ parts

-

1k+ parts

-

10k+ parts

-

49,529

$0.570

-

-

-

Corphita

USA . 491 parts In-Stock

1+ parts

$0.598

100+ parts

-

1k+ parts

-

10k+ parts

-

491

$0.598

-

-

-

Continental Prestige Electronics

USA . 1,640 parts In-Stock

1+ parts

$0.897

100+ parts

$0.540

1k+ parts

$0.377

10k+ parts

-

1,640

$0.897

$0.540

$0.377

-

Argo Parts USA

USA . 2,502 parts In-Stock

1+ parts

$1.355

100+ parts

-

1k+ parts

-

10k+ parts

-

2,502

$1.355

-

-

-

Modulus Dynamics

Lithuania . 1,785 parts In-Stock

1+ parts

$9.424

100+ parts

$9.047

1k+ parts

$8.670

10k+ parts

-

1,785

$9.424

$9.047

$8.670

-

Aztec Data Supply Inc.

USA . 229 parts In-Stock

1+ parts

$12.510

100+ parts

-

1k+ parts

-

10k+ parts

-

229

$12.510

-

-

-

Corohmni

South Africa . 249 parts In-Stock

1+ parts

$15.873

100+ parts

-

1k+ parts

-

10k+ parts

-

249

$15.873

-

-

-

AZTECH Wire

Italy . 223 parts In-Stock

1+ parts

$21.170

100+ parts

-

1k+ parts

-

10k+ parts

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223

$21.170

-

-

-

Lixinc

USA . 14,652 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

14,652

-

-

-

-

Perfect Parts

USA . 11,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,200

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,000

-

-

-

-

Microchip USA

USA . 281 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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281

-

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Overview

Experience seamless communication with the TLE8457ASJXUMA1 from Infineon Technologies. Known for their superior quality and reliability, Infineon Technologies offers a wide range of telecom interface ICs designed to meet your communication needs. This small outline package boasts a dual terminal position and Gull Wing terminal form, making it easy to integrate into your telecom circuit. With a nominal supply voltage of 8V and AEC-Q100 screening level, this product ensures optimal performance and durability. Upgrade your communication systems today with the TLE8457ASJXUMA1 and enjoy uninterrupted connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ideal for telecom applications.

Surface Mount: YES

With the ability to be surface mounted, this IC is easier to install and saves space on the PCB, making it a convenient choice for compact designs.

Screening Level: AEC-Q100

Meeting the AEC-Q100 screening level ensures the product's reliability and performance under harsh automotive environments, making it a dependable choice for telecom interfaces.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement on the PCB, optimizing space utilization and enhancing the overall design of the telecom interface IC.

No. of Terminals: 8

With 8 terminals, this IC provides sufficient connectivity options for various telecom functions, offering versatility and flexibility in circuit design.

Package Style: SMALL OUTLINE

The small outline package style minimizes the footprint of the IC, enabling dense packing of components and enhancing the overall efficiency of the telecom interface circuit.

Terminal Finish: TIN

The terminal finish of tin provides excellent conductivity and corrosion resistance, ensuring reliable performance and longevity of the IC in telecom applications.

Terminal Position: DUAL

The dual terminal position allows for increased connection options, facilitating easy integration into different circuit configurations and making it a versatile choice for telecom interfaces.

Maximum Seated Height: 1.75 mm

The low maximum seated height enables the IC to be used in applications with tight space constraints, making it suitable for compact telecom devices.

Width: 4 mm

The narrow width of 4 mm ensures that the IC can be accommodated in tight layouts, making it an ideal choice for space-constrained telecom interfaces.

Technical Specifications

Other Function Telecom Interface ICs TLE8457ASJXUMA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

8 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

4 mm

Trade Compliance

TLE8457ASJXUMA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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