Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SL3S1003FUD/BG by NXP Semiconductors is a robust telecom interface IC designed for industrial applications. It operates within -40 °C to 85 °C, features a 1.8V nominal voltage, and comes in a no-lead rectangular package with 4 terminals. Ideal for reliable communication in harsh environments.
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The surface mount design allows for compact PCB layouts, making it ideal for space-constrained applications.
The rectangular package shape supports efficient space utilization and facilitates easier placement on circuit boards.
Having only 4 terminals simplifies the design and reduces the potential for assembly errors while still allowing for effective interfacing.
The uncased chip style offers flexibility for custom applications and enhances thermal performance due to better heat dissipation.
With a maximum operating temperature of 85 °C, this product is suitable for industrial applications that experience high temperatures.
The capability to operate at temperatures as low as -40 °C makes this IC ideal for demanding environments such as outdoor telecom installations.
Upper terminal positioning allows for straightforward mounting and connection on circuit boards, enhancing ease of integration.
Industrial temperature grading ensures reliability and longevity in harsh conditions, making this IC a robust choice for numerous applications.
CMOS technology provides low power consumption and high noise immunity, making this IC energy-efficient and reliable for telecommunications.
No-lead terminals facilitate a smaller footprint and enable better solder joint reliability, enhancing overall performance in compact designs.
As a dedicated telecom circuit IC, this product is specifically designed to meet the needs of communication applications, ensuring optimal functionality.
Operating at a nominal supply voltage of 1.8 V allows for greater power efficiency and compatibility with other low-voltage devices.
Other Function Telecom Interface ICs SL3S1003FUD/BG attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors
JESD-30 Code:
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Nominal Supply Voltage:
Surface Mount:
Technology:
Telecom IC Type:
Temperature Grade:
Terminal Form:
Terminal Position:
SL3S1003FUD/BG Telecommunications trade compliance attributes, and parameters.
HTS
8542.32.00
SB
8542.39.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
LL4148
Micronas Semiconductor Holding Ag
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .2 A; Maximum Forward Voltage (VF): 1.2 V;
MBRS130LT3G
Rochester Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/58-360
Glenair
CONNECTOR ACCESSORY; Contact Gender: MALE; Material: COPPER ALLOY; IEC Conformity: NO; MIL-Connector Accessory Name: CONTACT; MIL Conformity: YES;
2N7002
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
NE555D
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
EU2B-YS3303C
Idec
ROTARY SWITCH;
MMSZ5245BT1G
Onsemi
MMSZ5245BT1G by Onsemi is a Zener diode with 15V nominal reference voltage, 8.5mA test current, and 16 ohm dynamic impedance. It is used in applications requiring precise voltage regulation in a compact SMD package for temperatures ranging from -55 to 150°C.
M39029/58360
Souriau
CONNECTOR ACCESSORY; Associated Military - Specifications: MIL-DTL-38999; Tool Settings: M22520/2-09; Terminal Type: CRIMP; MIL Conformity: YES; Mating Contacts: M39029/56348;
2N2222A
Motorola
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Collector-Base Capacitance: 8 pF;
Bytesonic Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Elements: 1;
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SMBJ18CA
KYOCERA AVX
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Forward International Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Nominal Breakdown Voltage: 21.05 V; Maximum Clamping Voltage: 29.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
1N4148
Wuxi Xuyang Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
NE555/D
General Electric Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; Maximum Operating Temperature: 70 Cel; Technology: BIPOLAR; Package Equivalence Code: DIE OR CHIP; Qualification: Not Qualified;
INA826AIDGKR
Texas Instruments
INA826AIDGKR by Texas Instruments is an instrumentation amplifier with 150uV max input offset voltage, 0.095uA max average bias current, and 1MHz nominal bandwidth. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and high common mode rejection ratio of 120dB.
Positronic Industries
CONNECTOR ACCESSORY; MIL-Connector Accessory Name: CONTACT; DIN Conformity: NO; National Stock Number (NSN): 5999004733551; Mating Contacts: M39029/56-348, M39029/57-354; Contact Type: CRIMP REAR RELEASE;
Electronic Transistors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
MMBT2222ALT1G
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .3 W; Maximum Collector Current (IC): .6 A;
Bourns
TM1062DSB2
Inrcore
TELECOM CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Package Equivalence Code: SOP28,.5;
BGT24MTR12E6327XUMA1
BGT24MTR12E6327XUMA1 by Infineon is a telecom IC with 32 terminals in a chip carrier package. It operates b/w -40 to 105°C, suitable for industrial use. With a supply voltage of 3.3V, it features a terminal pitch of 0.5mm and is surface mountable for various telecom interface applications.
NEO-M8Q-0-10
U-blox Ag
NEO-M8Q-0-10 by U-blox Ag is a MICROELECTRONIC ASSEMBLY with 24 terminals, operating from -40 to 85 °C. Ideal for TELECOM CIRCUIT applications due to its INDUSTRIAL temperature grade and 3V supply voltage requirement.
RN4678-V/RM113
Microchip Technology
RN4678-V/RM113 by Microchip Tech is a surface mount telecom IC with 33 terminals in a rectangular package. Operating temp range from -20 to 70°C, nominal voltage of 1.9V. Ideal for telecom circuits due to its compact size and gold over nickel terminal finish.
EVA-M8Q-0
EVA-M8Q-0 by U-blox Ag is a telecom IC with 43 terminals, operating at -40 to 85°C. It has a compact square package, 1.16mm height, and requires 3.3V supply voltage. Ideal for industrial applications requiring precise positioning and navigation systems in small form factors.
PD69208T4ILQ-TR
Microchip Technology's PD69208T4ILQ-TR is a 56-terminal telecom IC with a max operating temp of 85°C. It features a no-lead terminal form, quad terminal position, and industrial temperature grade. Ideal for telecom circuits, this chip carrier package has a square shape and very thin profile for surface mount applications.
ANNA-B112-01B-00
TELECOM CIRCUIT;
BGM111A256V2R
Silicon Labs
BGM111A256V2R by Silicon Labs is a telecom IC with 31 terminals, operating b/w -40°C to 85°C. It has a supply voltage of 3.3V and compact dimensions of 12.9mm width and 15mm length. Ideal for industrial applications requiring a surface-mount rectangular package with a terminal pitch of 1.2mm.
AT86RF215M-ZUR
AT86RF215M-ZUR by Microchip Technology is a telecom IC with RF and baseband circuit. It operates at -40 to 85 °C temperature range, has 48 terminals, and a very thin profile package style. It is suitable for various telecom interface applications.
LBEE5KL1DX-883
Murata Manufacturing
Murata Manufacturing's LBEE5KL1DX-883 is a RECTANGULAR MICROELECTRONIC ASSEMBLY with 46 terminals. Operating from -30 to 70°C, it has a seated height of 1.1mm and nominal voltage of 3.6V. Ideal for TELECOM CIRCUITS, this Telecom Interface IC is surface mountable and suited for various telecom applications.
MD0100N8-G
Supertex
TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: FLAT; No. of Terminals: 3; Package Code: LSOF; Package Shape: RECTANGULAR;
L76-M33
Quectel Wireless Solutions
Quectel Wireless Solutions' L76-M33 is a surface mount telecom IC with 18 terminals. Operating temperature range from -40 to 85°C, ideal for industrial applications. Compact package size of 10.1mm x 9.7mm x 2.5mm makes it suitable for various telecom interface functions.
AT86RF215M-ZU
Atmel
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: VQCCN; Package Shape: SQUARE;
ZM3102AE-CME1
ZM3102AE-CME1 by Silicon Labs is a surface mount telecom IC with 1 function and 18 terminals. It has a data rate of 0.04 Mbps and is used in telecom circuits.
LEA-M8S-0-10
Other Telecom ICs; Moisture Sensitivity Level (MSL): 4;
TLV320AIC3104IRHBT
TLV320AIC3104IRHBT by Texas Instruments is a telecom interface IC with 2 channels and a nominal voltage of 1.8V. It has a package style of chip carrier, heat sink/slug, very thin profile and can operate in industrial temperature range (-40 to 85°C). This IC is commonly used in telecom circuits.
CYBLE-212006-01
Cypress Semiconductor
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 30; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
CC430F5137IRGZT
CC430F5137IRGZT by Texas Instruments is a telecom IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 2.2V and data rate of 0.5 Mbps. Ideal for industrial applications requiring low power consumption and reliable communication.
NEO-M8J-0
LM2893M
LM2893M by Texas Instruments is a telecom IC with 20 terminals in a small outline package. It operates b/w -40°C to 85°C, suitable for industrial use. With a nominal voltage of 18V, it is designed for telecom circuit applications.
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SL3S4011FHK,125
NXP Semiconductors
SL3S4011FHK,125 by NXP Semiconductors is a telecom interface IC with 8 terminals in a square chip carrier package. Operating at -40 to 85°C, it supports power supplies of 1.8/3.6V for industrial applications. This surface-mount IC has a terminal pitch of 0.5mm and is ideal for telecom circuit integration.
SL3S1002FTB1,115
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 3; Package Code: BCC; Package Shape: RECTANGULAR;
SL3S1003FTB0,115
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: VSON; Package Shape: RECTANGULAR;
SL3S4021FHKH
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: QCCN; Package Shape: SQUARE;
SL3S1002FTT
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;
SL3S1004FUD/BG1
Other Telecom ICs;
SL3S1013FTB0
SL3S1013FTB0,115
NXP Semiconductors SL3S1013FTB0,115 is a telecom IC with CMOS technology. It features 6 terminals in a small outline package with very thin profile. Operating temperature range from -40 to 85 °C, suitable for industrial applications like telecom circuits.
SL3S1001FTT,118
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;
SL3S1002AC2
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 2; Package Code: DIE; Package Shape: RECTANGULAR;
SL3S1003FTB0
SL3S1004FUD/BG
SL3S1002AC2,118
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Package Equivalence Code: DIE OR CHIP; Qualification: Not Qualified; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 85 Cel;
SL3S1003FUD
SL3S1004FUD/BG1Z
TELECOM CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
SL3S1002AC0,118
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Maximum Operating Temperature: 85 Cel; Qualification: Not Qualified; Minimum Operating Temperature: -40 Cel; Package Equivalence Code: DIE OR CHIP;
SL3S1002FTT,118
SL3S1001FTT
SL3S1002AC0
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