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SL3S4021FHKH

NXP Semiconductors

SL3S4021FHKH by NXP Semiconductors

The NXP Semiconductors SL3S4021FHKH is an 8-terminal telecom interface IC in a square chip carrier package. Operating at temperatures from -40 to 85°C, it supports power supplies of 1.8/3.6V and features nickel palladium gold terminal finish. Ideal for industrial telecom circuits, this surface-mount IC has a terminal pitch of 0.5mm and is suitable for various applications requiring reliable telecommunications functionality.

Median Price

$0.259

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EBV Elektronik

Germany . 160,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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160,000

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-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.259

100+ parts

-

1k+ parts

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10k+ parts

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10

$0.259

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-

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Vyrian

USA . 3,322 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,322

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-

-

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Digiode

USA . 2,331 parts In-Stock

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-

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2,331

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Anansix

USA . 525 parts In-Stock

1+ parts

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1k+ parts

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525

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

$0.259

100+ parts

$0.246

1k+ parts

$0.234

10k+ parts

$0.231

300

$0.259

$0.246

$0.234

$0.231

Argo Parts USA

USA . 1,342 parts In-Stock

1+ parts

$0.259

100+ parts

-

1k+ parts

-

10k+ parts

$0.251

1,342

$0.259

-

-

$0.251

Continental Prestige Electronics

USA . 1 parts In-Stock

1+ parts

$0.259

100+ parts

-

1k+ parts

-

10k+ parts

$0.254

1

$0.259

-

-

$0.254

AZTECH Wire

Italy . 954 parts In-Stock

1+ parts

$15.920

100+ parts

-

1k+ parts

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10k+ parts

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954

$15.920

-

-

-

Ampacity Inc.

Singapore . 175,997 parts In-Stock

1+ parts

$414.000

100+ parts

-

1k+ parts

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10k+ parts

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175,997

$414.000

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QUARKTWIN TECHNOLOGY LTD

USA . 26,659 parts In-Stock

1+ parts

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100+ parts

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26,659

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UNI Independent Distributors

Spain . 6,695 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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6,695

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Corphita

USA . 4,990 parts In-Stock

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100+ parts

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4,990

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Lixinc

USA . 4,267 parts In-Stock

1+ parts

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100+ parts

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4,267

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,000

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Overview

Discover the cutting-edge SL3S4021FHKH by NXP Semiconductors, a top-tier manufacturer known for their high-quality products. This telecom interface IC offers unmatched reliability and performance in various applications. From industrial to consumer electronics, this chip carrier package delivers exceptional value with its wide operating temperature range and nickel palladium gold terminal finish. Trust NXP Semiconductors to provide innovative solutions that exceed customer expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides durability and protection for the IC, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto PCBs, saving time and effort during manufacturing.

Power Supplies (V): 1.8/3.6

Support for multiple power supply voltages offers flexibility in design and compatibility with different systems.

No. of Terminals: 8

Having a sufficient number of terminals allows for proper connectivity and functionality within the telecom interface circuit.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature range ensures the IC can function in a wide range of temperatures, making it suitable for various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring stable connections over time.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, this IC type is optimized for reliable and efficient communication functions.

Technical Specifications

Other Function Telecom Interface ICs SL3S4021FHKH attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N8

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC8,.06SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.6

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

SL3S4021FHKH Telecommunications trade compliance attributes, and parameters.

HTS

8542.32.00

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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