Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SL3S1002AC0 by NXP Semiconductors is a robust telecom interface IC designed for industrial applications. It features a wide operating temperature range of -40 °C to 85 °C, a compact no-lead design, and utilizes CMOS technology for efficient performance. Ideal for surface mount integration in telecom circuits, it ensures reliability in demanding environments.
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The use of plastic/epoxy ensures durability and protection against environmental factors, making this IC a reliable choice for various applications.
Surface mount technology allows for efficient and compact assembly on the circuit board, enabling space-saving designs in telecom applications.
A rectangular package shape is optimal for layout flexibility on PCBs and aids in organized component placement, enhancing overall design efficiency.
Having only two terminals simplifies the design and can reduce costs, making it suitable for straightforward telecom circuit implementations.
The unencased chip design allows for integration into various environments and provides flexibility in system design.
Operating reliably up to 85 °C ensures performance in diverse operational environments, especially in industrial applications.
Withstanding temperatures as low as -40 °C, this IC can be deployed in harsh climates, broadening its usability across different regions.
The upper terminal positioning facilitates easier soldering and integration into existing systems, improving manufacturing efficiency.
Industrial-grade components are designed for longevity and reliability, making this telecom IC ideal for demanding applications.
CMOS technology is known for low power consumption and high noise immunity, which is essential for efficient telecom circuitry.
The no-lead terminal form contributes to a smaller footprint, which is advantageous in dense circuit designs and helps in efficient PCB layout.
Specifically designed for telecom applications, ensuring optimized performance for signal processing and communications.
Other Function Telecom Interface ICs SL3S1002AC0 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors
JESD-30 Code:
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Qualification:
Surface Mount:
Technology:
Telecom IC Type:
Temperature Grade:
Terminal Form:
Terminal Position:
SL3S1002AC0 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
LM78L05ACMX/NOPB
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 8; Package Code: SOP; Terminal Form: GULL WING; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
BAV99
Panjit International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Fagor Electronica S Coop
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/58-360
Amphenol
CONNECTOR ACCESSORY; MIL Conformity: YES; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: MALE; Terminal Type: CRIMP; IEC Conformity: NO;
M39029/56-351
Itt Cannon
CONNECTOR ACCESSORY; MIL Conformity: YES; Terminal Type: WIRE; IEC Conformity: NO; Alternate Contact Sources: ITT CANNON; Associated Military - Specifications: MIL-C-38999;
SS14
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138BKW,115
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Terminal Finish: TIN; No. of Terminals: 3; Additional Features: LOGIC LEVEL COMPATIBLE;
BSS84PH6327XTSA2
Infineon Technologies
BSS84PH6327XTSA2 by Infineon is a P-CHANNEL FET with 60V DS breakdown voltage, ideal for switching applications. It features a single configuration with built-in diode and operates in enhancement mode. With a max drain current of 0.17A and on-resistance of 8 ohm, it offers reliable performance in small outline packages.
LM358MX
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
MMBT2222ALT1G
Onsemi
MMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, max power dissipation of 0.3W, and hFE of 75. Ideal for switching applications, it operates b/w -55 to 150 °C with a max collector-emitter voltage of 40V. This surface-mount device has a transition frequency of 300MHz and turn-on time of 35ns.
1N4148
Rfe International
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Forward Voltage (VF): 1 V; Config: SINGLE;
Electronic Devices
BSS138
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Qualification: Not Qualified;
MMBT3906LT1G
MMBT3906LT1G by Onsemi is a PNP BJT with VCEsat of 0.4V, hFE of 30, and fT of 250MHz. Ideal for small signal applications in electronics due to its low power dissipation, high transition frequency, and compact SOT-23 package. Suitable for use in temperature-sensitive environments with an operating range from -65°C to 150°C.
LM358N
Kec
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
2N2222A
Minilogic Device
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .001 A;
M24308/2-1F
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Additional Features: STANDARD: MIL-DTL-24308, POLARIZED; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Filter Feature: NO;
Surge Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N7002
Supertex
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Maximum Feedback Capacitance (Crss): 5 pF;
LM317T
Integrated Power Semiconductors
Other Regulators; No. of Terminals: 3; Operating Temperature (TJ-Min): 0 Cel; Terminal Pitch: 2.54 mm; Maximum Load Regulation (%): 1.5 %; Nominal Dropout Voltage-1: 3 V;
88E6176-A1-TFJ2I000
Marvell Technology
Marvell Technology's 88E6176-A1-TFJ2I000 is a telecom circuit IC with 128 terminals in a square flatpack package. It features gull wing terminal form and quad terminal position, suitable for surface mount applications. Ideal for various functions in telecommunications interfaces.
AD630JN/+
Analog Devices
Analog Devices' AD630JN/+ is a bipolar technology IC with +-15V power supplies, 20 terminals, and 70°C max operating temp. Ideal for telecom interfaces, it features PLASTIC/EPOXY body material in an IN-LINE package style for commercial applications.
MRF24J40MDT-I/RM
Microchip Technology
Microchip Technology's MRF24J40MDT-I/RM is a telecom IC with 12 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 2.54mm. Ideal for industrial applications requiring reliable wireless communication in compact spaces.
BGM111A256V2R
Silicon Labs
BGM111A256V2R by Silicon Labs is a telecom IC with 31 terminals, operating b/w -40°C to 85°C. It has a supply voltage of 3.3V and compact dimensions of 12.9mm width and 15mm length. Ideal for industrial applications requiring a surface-mount rectangular package with a terminal pitch of 1.2mm.
XB3-24Z8RM-J
Digi International
The Digi International XB3-24Z8RM-J is a surface mount telecom IC with 34 terminals. It operates in industrial temperature range (-40 to 85°C) and has a rectangular package style (13x19mm). Ideal for telecom circuits, this IC is designed for various applications requiring reliable communication interfaces.
TM1062DSB2
Pulser
TELECOM CIRCUIT; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;
BLUENRG-MSCSP
STMicroelectronics
BLUENRG-MSCSP by STMicroelectronics is a telecom IC with 34 terminals, operating at -40 to 85°C. Its grid array package has a very thin profile and fine pitch, suitable for industrial applications requiring a 3V supply voltage. The IC is designed for surface mount assembly in compact devices due to its small dimensions of 2.56mm width and 2.66mm length.
RN41-I/RM630
Microchip Technology's RN41-I/RM630 is a telecom IC with 32 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and gold over nickel terminal finish. Suitable for industrial applications, it comes in a rectangular package style with surface mount capability.
NRF52840-QIAA-T
Nordic Semiconductor Asa
NRF52840-QIAA-T by Nordic Semiconductor Asa is a telecom IC with 73 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 3V and compact dimensions of 7x7mm, it's ideal for telecom interface applications.
NRF51822-QFAB-R
NRF51822-QFAB-R by Nordic Semiconductor Asa is a 48-terminal telecom IC with 1.8V supply voltage, operating from -25 to 75°C. It features a square chip carrier package style at 0.95mm height, suitable for telecom circuit applications.
NEO-M8P-0-11
U-blox Ag
NEO-M8P-0-11 by U-blox Ag is a telecom IC with 24 terminals, operating temperature range of -40 to 85 °C. It has AEC-Q100 screening level and TS 16949 certification. Ideal for industrial applications requiring precise positioning and communication capabilities.
XCC2642R1FRGZR
Texas Instruments
XCC2642R1FRGZR by Texas Instruments is a telecom IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a nominal voltage of 3V. Ideal for telecom circuit applications, it features nickel palladium gold terminal finish and very thin profile design.
MAX3799ETJ+T
Maxim Integrated
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
MCP2140A-I/P
MCP2140A-I/P by Microchip: Telecom IC with 18 terminals, CMOS tech, 3V supply voltage. Ideal for telecom circuits in industrial settings. Operating temp -40 to 85°C, package style in-line, TS 16949 screening level.
SA602AD
Philips Components
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Package Code: SOP; Package Shape: RECTANGULAR; Width: 3.9 mm; Nominal Supply Voltage: 6 V;
CLRC66302HN,151
NXP Semiconductors
CLRC66302HN,151 by NXP Semiconductors is a telecom interface IC with 1 function. It has a square package shape with 32 terminals and a max seated height of 1mm. This IC operates at temperatures ranging from -25 to 85 °C and is suitable for telecom circuit applications.
SIM7020G
Simcom Wireless Solutions
TELECOM CIRCUIT;
MAX7033EUI
MAX7033EUI by Maxim Integrated is a telecom IC with 28 terminals, operating at -40 to 105°C. It has a supply voltage of 3.3V, consumes 0.00688mA current, and features GULL WING terminals for industrial applications in telecom circuits.
HTRC11001T/03EE
NXP Semiconductors' HTRC11001T/03EE is a telecom IC with 14 terminals, operating at -40 to 85°C. It has a supply voltage of 3V and current of 0.01mA, suitable for industrial applications. The package is small outline, rectangular in shape, with gull wing terminals for surface mount assembly.
MRF24WB0MA/RM
MRF24WB0MA/RM by Microchip: 3.3V supply, 36 terminals, telecom IC for commercial use. Rectangular package, surface mountable. Ideal for telecom circuit applications in temperatures from 0 to 70°C.
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SL3S4011FHK,125
SL3S4011FHK,125 by NXP Semiconductors is a telecom interface IC with 8 terminals in a square chip carrier package. Operating at -40 to 85°C, it supports power supplies of 1.8/3.6V for industrial applications. This surface-mount IC has a terminal pitch of 0.5mm and is ideal for telecom circuit integration.
SL3S1002FTB1,115
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 3; Package Code: BCC; Package Shape: RECTANGULAR;
SL3S1003FTB0,115
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: VSON; Package Shape: RECTANGULAR;
SL3S4021FHKH
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: QCCN; Package Shape: SQUARE;
SL3S1002FTT
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;
SL3S1004FUD/BG1
Other Telecom ICs;
SL3S1013FTB0
SL3S1013FTB0,115
NXP Semiconductors SL3S1013FTB0,115 is a telecom IC with CMOS technology. It features 6 terminals in a small outline package with very thin profile. Operating temperature range from -40 to 85 °C, suitable for industrial applications like telecom circuits.
SL3S1001FTT,118
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;
SL3S1002AC2
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 2; Package Code: DIE; Package Shape: RECTANGULAR;
SL3S1003FTB0
SL3S1004FUD/BG
SL3S1002AC2,118
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Package Equivalence Code: DIE OR CHIP; Qualification: Not Qualified; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 85 Cel;
SL3S1003FUD
SL3S1004FUD/BG1Z
TELECOM CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
SL3S1002AC0,118
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Maximum Operating Temperature: 85 Cel; Qualification: Not Qualified; Minimum Operating Temperature: -40 Cel; Package Equivalence Code: DIE OR CHIP;
SL3S1003FUD/BG
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: RECTANGULAR;
SL3S1002FTT,118
SL3S1001FTT
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