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SL3S1013FTB0,115

NXP Semiconductors

SL3S1013FTB0,115 by NXP Semiconductors

NXP Semiconductors SL3S1013FTB0,115 is a telecom IC with CMOS technology. It features 6 terminals in a small outline package with very thin profile. Operating temperature range from -40 to 85 °C, suitable for industrial applications like telecom circuits.

Median Price

$0.266

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 399 parts In-Stock

1+ parts

$0.206

100+ parts

$0.148

1k+ parts

$0.138

10k+ parts

-

399

$0.206

$0.148

$0.138

-

Rochester

USA . 5,000 parts In-Stock

1+ parts

$0.221

100+ parts

$0.207

1k+ parts

$0.188

10k+ parts

-

5,000

$0.221

$0.207

$0.188

-

DigiKey

USA . 6,945 parts In-Stock

1+ parts

$0.480

100+ parts

$0.354

1k+ parts

$0.307

10k+ parts

$0.268

6,945

$0.480

$0.354

$0.307

$0.268

Mouser Electronics

USA . 2,594 parts In-Stock

1+ parts

$0.480

100+ parts

$0.355

1k+ parts

$0.307

10k+ parts

$0.253

2,594

$0.480

$0.355

$0.307

$0.253

Newark

USA . 237 parts In-Stock

1+ parts

$0.484

100+ parts

$0.357

1k+ parts

$0.309

10k+ parts

-

237

$0.484

$0.357

$0.309

-

Farnell

UK . 9,240 parts In-Stock

1+ parts

-

100+ parts

$0.263

1k+ parts

$0.227

10k+ parts

$0.200

9,240

-

$0.263

$0.227

$0.200

Element14

Singapore . 9,240 parts In-Stock

1+ parts

-

100+ parts

$0.269

1k+ parts

$0.202

10k+ parts

$0.198

9,240

-

$0.269

$0.202

$0.198

Chip1Stop

Japan . 1,782 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,782

-

-

-

-

Verical

USA . 399 parts In-Stock

1+ parts

-

100+ parts

$0.148

1k+ parts

$0.138

10k+ parts

-

399

-

$0.148

$0.138

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,036 parts In-Stock

1+ parts

$0.188

100+ parts

-

1k+ parts

-

10k+ parts

-

2,036

$0.188

-

-

-

Digiode

USA . 2,277 parts In-Stock

1+ parts

$0.210

100+ parts

-

1k+ parts

-

10k+ parts

-

2,277

$0.210

-

-

-

Anansix

USA . 2,876 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,876

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,805 parts In-Stock

1+ parts

$0.199

100+ parts

-

1k+ parts

-

10k+ parts

-

3,805

$0.199

-

-

-

Continental Prestige Electronics

USA . 19,870 parts In-Stock

1+ parts

-

100+ parts

$0.213

1k+ parts

$0.149

10k+ parts

-

19,870

-

$0.213

$0.149

-

UNI Independent Distributors

Spain . 7,879 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,879

-

-

-

-

Overview

Elevate your telecom interface solutions with the SL3S1013FTB0,115 by NXP Semiconductors. Known for their top-quality products, NXP Semiconductors sets the standard for excellence in the industry. This small outline, very thin profile package offers unparalleled value and benefits for various applications, ensuring optimal performance and reliability. Upgrade your telecom circuitry with this industrial-grade technology and experience the advantages of NXP Semiconductors' innovative solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the internal components of the IC, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Package Shape: RECTANGULAR

Optimal shape for space-saving on the PCB, allowing for efficient use of board real estate.

No. of Terminals: 6

Sufficient number of terminals for connecting to external circuitry, providing versatility in application.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in a variety of operating environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Wide temperature range allows the IC to function in extreme conditions, enhancing its usability in diverse settings.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC efficient and reliable in operation.

Technical Specifications

Other Function Telecom Interface ICs SL3S1013FTB0,115 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-N6

Length:

1.45 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.5 mm

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

SL3S1013FTB0,115 Telecommunications trade compliance attributes, and parameters.

HTS

8542.32.00

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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