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SL3S1001FTT

NXP Semiconductors

SL3S1001FTT by NXP Semiconductors

SL3S1001FTT by NXP Semiconductors is a telecom interface IC designed for industrial applications. It features an operating temp range of -40 °C to 85 °C, an 8-terminal gull-wing design, and a compact 3mm x 3mm footprint. Ideal for surface mount technology in telecom systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,518 parts In-Stock

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2,518

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Digiode

USA . 1,758 parts In-Stock

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1,758

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Anansix

USA . 1,007 parts In-Stock

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1,007

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Distributors (Availability)

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One Stop Electronics

USA . 1,468 parts In-Stock

1+ parts

$772.000

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1,468

$772.000

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A-Z Elektronik GmbH

Germany . 7,421 parts In-Stock

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7,421

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UNI Independent Distributors

Spain . 5,186 parts In-Stock

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5,186

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Corphita

USA . 173 parts In-Stock

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173

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Perfect Parts

USA . 132 parts In-Stock

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132

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Overview

Elevate your telecom projects with the SL3S1001FTT from NXP Semiconductors, a leader in innovation and reliability. This high-performance interface IC combines robust quality with exceptional durability, making it perfect for industrial applications. Designed for seamless integration, it ensures optimal functionality even in extreme conditions. Experience unmatched value and efficiency, empowering your solutions to thrive in today's demanding environments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Utilizing durable plastic/epoxy material enhances reliability and protects the IC from environmental stressors.

Surface Mount: YES

Surface mount design allows for compact PCB layout, facilitating higher density designs.

Package Shape: SQUARE

Square package shape provides flexibility in placement and minimizes board space usage.

No. of Terminals: 8

With 8 terminals, it enables various connection options while maintaining simplicity in design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make it ideal for space-constrained applications while ensuring a clean layout.

Maximum Operating Temperature: 85 °C

High maximum operating temperature makes this IC suitable for demanding industrial environments.

Minimum Operating Temperature: -40 °C

Capability to operate at low temperatures ensures reliable performance in extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent corrosion resistance and enhances solderability.

Terminal Position: DUAL

Dual terminal position allows for enhanced connectivity options and easier integration into various circuit designs.

Maximum Seated Height: 1.1 mm

Low seated height supports compact design configurations, fitting perfectly in tight spaces.

Width: 3 mm

Compact width of 3 mm contributes to the overall space-efficient design ideal for modern electronics.

Maximum Time At Peak Reflow Temperature (s): 30

Optimized time at peak reflow ensures reliable solder joint formation, enhancing long-term reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability improves compatibility with lead-free solder processes.

Length: 3 mm

The short length aids in saving board space, making it a great choice for miniaturized devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures robust performance across a wide range of demanding applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy handling and soldering, ensuring good mechanical stability.

Telecom IC Type: TELECOM CIRCUIT

Specialized for telecom applications, this IC is designed to meet the specific needs of communication systems.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch supports precise mounting and soldering, ideal for high-density applications.

Technical Specifications

Other Function Telecom Interface ICs SL3S1001FTT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

SL3S1001FTT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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