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TMS3705CDRQ1

Texas Instruments

TMS3705CDRQ1 by Texas Instruments

TMS3705CDRQ1 by Texas Instruments is a telecom interface IC with 16 terminals, operating temperature range of -40 to 85°C. It has a supply voltage of 5V and terminal pitch of 1.27mm. Ideal for industrial applications requiring reliable telecom circuit functionality in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,030 parts In-Stock

1+ parts

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3,030

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Digiode

USA . 2,692 parts In-Stock

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2,692

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 815 parts In-Stock

1+ parts

$5.889

100+ parts

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815

$5.889

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Parana Technologies

USA . 1,752 parts In-Stock

1+ parts

$14.384

100+ parts

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1k+ parts

$14.828

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1,752

$14.384

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$14.828

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ChromeModa Solutions

Germany . 4,969 parts In-Stock

1+ parts

$16.162

100+ parts

$13.253

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4,969

$16.162

$13.253

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IDEA Electronic Components Group

UK . 273 parts In-Stock

1+ parts

$16.162

100+ parts

$15.354

1k+ parts

$14.546

10k+ parts

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273

$16.162

$15.354

$14.546

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One Stop Electronics

USA . 665 parts In-Stock

1+ parts

$623.000

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665

$623.000

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Corphita

USA . 4,779 parts In-Stock

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4,779

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DigiPath Technology Company

USA . 1,400 parts In-Stock

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$14.572

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1,400

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$14.572

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Overview

Unlock seamless communication with the TMS3705CDRQ1 by Texas Instruments, a top-tier manufacturer known for its cutting-edge technology. This innovative telecom interface IC offers unparalleled quality and reliability, making it ideal for various applications in the telecommunications industry. With advanced features and a compact design, this product provides exceptional value and benefits to customers seeking high-performance solutions. Experience the advantages of Texas Instruments' expertise with the TMS3705CDRQ1, setting new standards in telecom circuit technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making it ideal for portable or rugged applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards for automotive applications.

Package Shape: RECTANGULAR

Rectangular shape provides compatibility with standard PCB designs and allows for efficient use of space.

No. of Terminals: 16

16 terminals provide ample connectivity options for interfacing with other components or systems.

Package Style (Meter): SMALL OUTLINE

Small outline package style offers space-saving benefits and allows for compact integration in tight spaces.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in extreme cold environments without issues.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: DUAL

Dual terminal position allows for easy and secure connection to the PCB, enhancing overall functionality.

Maximum Seated Height: 1.75 mm

Low seated height minimizes PCB space requirements and allows for slim device design.

Width: 3.9 mm

Narrow width enables compact integration and efficient use of available space on the PCB.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds at peak reflow temperature ensures proper soldering and reliability during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature guarantees strong and reliable solder joints for robust performance.

Length: 9.9 mm

Moderate length offers a balance between compactness and ease of handling during assembly.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures consistent performance in harsh operating conditions commonly found in industrial settings.

Terminal Form: GULL WING

Gull wing terminal form provides secure soldering and mechanical strength for reliable connectivity.

Telecom IC Type: TELECOM CIRCUIT

Telecom circuit type ensures compatibility and functionality for telecommunications applications.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5V is commonly used in many applications, providing compatibility and ease of use.

Terminal Pitch: 1.27 mm

Fine terminal pitch of 1.27mm allows for high-density integration and precise connections on the PCB.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the component can withstand moderate exposure to moisture without compromising performance.

Technical Specifications

Other Function Telecom Interface ICs TMS3705CDRQ1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

TMS3705CDRQ1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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