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TMS37145TEAIE

Texas Instruments

TMS37145TEAIE by Texas Instruments

TMS37145TEAIE by Texas Instruments is an industrial-grade telecom circuit IC with a max operating temp of 85°C and min of -40°C. It comes in a special shape plastic/epoxy package, measuring 12mm in width and 6mm in length. Ideal for telecom interface applications requiring high-temperature performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 11,500 parts In-Stock

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Vyrian

USA . 6,997 parts In-Stock

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Digiode

USA . 4,585 parts In-Stock

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4,585

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Distributors (Availability)

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Parana Technologies

USA . 144 parts In-Stock

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$7.024

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$7.575

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144

$7.024

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$7.575

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DigiPath Technology Company

USA . 142 parts In-Stock

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$7.734

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$7.115

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142

$7.734

$7.115

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ChromeModa Solutions

Germany . 2,286 parts In-Stock

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$7.892

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$6.471

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2,286

$7.892

$6.471

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IDEA Electronic Components Group

UK . 597 parts In-Stock

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$7.892

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$7.103

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597

$7.892

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$7.103

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AZTECH Wire

Italy . 789 parts In-Stock

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$15.980

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789

$15.980

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One Stop Electronics

USA . 253 parts In-Stock

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$760.000

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253

$760.000

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Kepictronics

USA . 30,000 parts In-Stock

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Lixinc

USA . 14,288 parts In-Stock

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GreenTree Electronics

Israel . 10,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 8,120 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,391 parts In-Stock

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Alle Elektronik GmbH

Germany . 2,100 parts In-Stock

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Corphita

USA . 1,257 parts In-Stock

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1,257

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Overview

Unlock the power of seamless communication with the TMS37145TEAIE by Texas Instruments. As a trusted leader in the industry, Texas Instruments delivers top-quality telecom interface ICs like the TMS37145TEAIE, designed to exceed expectations. This product offers unparalleled reliability and performance, making it an essential component for a wide range of applications. Experience the value, benefits, and advantages that this innovative solution brings to your projects, setting you apart from the competition. Trust Texas Instruments to provide cutting-edge technology that empowers you to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for telecom applications where weight and durability are important factors.

Package Style (Meter): SPECIAL SHAPE

The special shape of the package allows for efficient and compact design, saving valuable space in telecom equipment.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh operating conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function effectively in a wide range of temperatures, making it versatile for various environments.

Width: 12 mm

The compact width of the product enables easy integration into telecom systems with limited space, improving overall functionality and efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures quick and efficient soldering during the manufacturing process, reducing production time and costs.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable soldering connections, ensuring secure attachment and long-term performance of the product in telecom applications.

Length: 6 mm

The compact length of the product further contributes to space-saving design, making it a suitable choice for telecom equipment with limited physical footprint.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the product can withstand rigorous conditions in industrial environments, making it a robust and reliable choice for telecom applications.

Telecom IC Type: TELECOM CIRCUIT

The specific telecom circuit type indicates that the product is designed and optimized for telecom applications, ensuring efficient and reliable performance in telecommunication systems.

Technical Specifications

Other Function Telecom Interface ICs TMS37145TEAIE attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

X-PXSS-X

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SPECIAL SHAPE

Peak Reflow Temperature (C):

260

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

UNSPECIFIED

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

TMS37145TEAIE Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8523.59.00.00

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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