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PN5120A0HN1/C2

NXP Semiconductors

PN5120A0HN1/C2 by NXP Semiconductors

PN5120A0HN1/C2 by NXP Semiconductors is a 32-terminal telecom IC with a 3V supply voltage. It features a chip carrier package style, 0.5mm terminal pitch, and plastic/epoxy body material. Ideal for telecom circuits, this square-shaped IC has no-lead terminals and quad position for diverse applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 28,000 parts In-Stock

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28,000

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Digiode

USA . 2,527 parts In-Stock

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2,527

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Vyrian

USA . 1,063 parts In-Stock

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1,063

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Anansix

USA . 730 parts In-Stock

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730

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Sensible Micro Corp

USA . 226 parts In-Stock

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226

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 5,378 parts In-Stock

1+ parts

$1.220

100+ parts

$1.160

1k+ parts

$1.120

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5,378

$1.220

$1.160

$1.120

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AZTECH Wire

Italy . 818 parts In-Stock

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$9.648

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818

$9.648

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Corohmni

South Africa . 323 parts In-Stock

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$10.419

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323

$10.419

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Aztec Data Supply Inc.

USA . 3,158 parts In-Stock

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$13.660

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3,158

$13.660

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Microchip USA

USA . 2,457 parts In-Stock

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$60.664

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2,457

$60.664

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One Stop Electronics

USA . 631 parts In-Stock

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$101.000

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631

$101.000

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Ampacity Inc.

Singapore . 1,377 parts In-Stock

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$712.000

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1,377

$712.000

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Authorized Procurement Solutions

USA . 60,000 parts In-Stock

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60,000

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Kepictronics

USA . 39,600 parts In-Stock

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39,600

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Futuretech Components

Singapore . 10,500 parts In-Stock

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10,500

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A-Z Elektronik GmbH

Germany . 10,170 parts In-Stock

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10,170

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UNI Independent Distributors

Spain . 7,198 parts In-Stock

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7,198

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Continental Prestige Electronics

USA . 6,044 parts In-Stock

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6,044

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Argo Parts USA

USA . 3,862 parts In-Stock

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3,862

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S.R.D Solutions

India . 3,000 parts In-Stock

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3,000

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Corphita

USA . 805 parts In-Stock

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805

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Bastille Electronics

Australia . 120 parts In-Stock

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120

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Overview

Revolutionize your telecommunications experience with the PN5120A0HN1/C2 from NXP Semiconductors. Known for their top-quality products, NXP Semiconductors delivers innovative solutions that meet the demands of today's fast-paced world. This telecom interface IC offers seamless connectivity and reliable performance in a compact chip carrier package. Whether you're looking to enhance your communication systems or streamline your network infrastructure, the PN5120A0HN1/C2 is the perfect choice. Upgrade your technology with NXP Semiconductors and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight, durable, and cost-effective, making it a good choice for telecom interface ICs.

Surface Mount: YES

Surface mount technology allows for easy and compact integration onto PCBs, saving space and enabling efficient assembly.

Package Shape: SQUARE

Square shape helps in uniform mounting and alignment, making it easier to handle during the manufacturing process.

No. of Terminals: 32

Having 32 terminals provides flexibility in connectivity options and allows for integration with a variety of devices in the telecom system.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers a compact and low profile design, ideal for space-constrained telecom applications.

Maximum Seated Height: 1 mm

Low profile design with a maximum seated height of 1 mm allows for slim and sleek device designs, suitable for modern telecom equipment.

Width: 5 mm

Narrow width of 5 mm helps in space-saving integration on PCBs, enabling dense packing of components for efficient use of board space.

Length: 5 mm

Compact length of 5 mm further contributes to the space-saving design of the IC, allowing for efficient layout on the PCB.

Terminal Form: NO LEAD

No-lead terminal form offers improved connections, reduced signal loss, and better thermal performance, enhancing the overall reliability of the IC.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, this IC provides optimized performance and functionality for telecommunications systems.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3V ensures compatibility and reliability with standard voltage levels used in telecom systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm allows for high-density mounting of terminals, facilitating precise connections and compact design of the IC.

Technical Specifications

Other Function Telecom Interface ICs PN5120A0HN1/C2 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

No. of Functions:

1

No. of Terminals:

32

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

PN5120A0HN1/C2 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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