Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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PN5120A0HN1/C2 by NXP Semiconductors is a 32-terminal telecom IC with a 3V supply voltage. It features a chip carrier package style, 0.5mm terminal pitch, and plastic/epoxy body material. Ideal for telecom circuits, this square-shaped IC has no-lead terminals and quad position for diverse applications.
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AZTECH Wire
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$10.419
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$13.660
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$60.664
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$101.000
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$712.000
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Plastic/epoxy material is lightweight, durable, and cost-effective, making it a good choice for telecom interface ICs.
Surface mount technology allows for easy and compact integration onto PCBs, saving space and enabling efficient assembly.
Square shape helps in uniform mounting and alignment, making it easier to handle during the manufacturing process.
Having 32 terminals provides flexibility in connectivity options and allows for integration with a variety of devices in the telecom system.
Chip carrier package style offers a compact and low profile design, ideal for space-constrained telecom applications.
Low profile design with a maximum seated height of 1 mm allows for slim and sleek device designs, suitable for modern telecom equipment.
Narrow width of 5 mm helps in space-saving integration on PCBs, enabling dense packing of components for efficient use of board space.
Compact length of 5 mm further contributes to the space-saving design of the IC, allowing for efficient layout on the PCB.
No-lead terminal form offers improved connections, reduced signal loss, and better thermal performance, enhancing the overall reliability of the IC.
Specifically designed for telecom applications, this IC provides optimized performance and functionality for telecommunications systems.
Operating at a nominal supply voltage of 3V ensures compatibility and reliability with standard voltage levels used in telecom systems.
Fine terminal pitch of 0.5 mm allows for high-density mounting of terminals, facilitating precise connections and compact design of the IC.
Other Function Telecom Interface ICs PN5120A0HN1/C2 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors
JESD-30 Code:
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PN5120A0HN1/C2 Telecommunications trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
1N4148
Synsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM555CM
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LFXTAL025159REEL
Iqd Frequency Products
LFXTAL025159REEL by IQD Frequency Products is a 32.768 kHz crystal oscillator with 20 ppm frequency tolerance and 40,000 ohm series resistance. It is ideal for applications requiring precise timekeeping, such as real-time clocks in IoT devices or microcontrollers in wearables. The surface-mount design with a drive level of 1 uW makes it suitable for compact electronic systems.
SMBJ18CA
Dc Components
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
L78L05ABZ-AP
STMicroelectronics
L78L05ABZ-AP by STMicroelectronics is a BIPOLAR fixed positive single output standard regulator with an operating temperature range of -40 to 125°C. It has a nominal output voltage of 5V, max load regulation of 0.06%, and can handle a max output current of 0.07A. Ideal for applications requiring stable voltage regulation in various electronic devices.
RN41N-I/RM
Microchip Technology
Microchip Technology's RN41N-I/RM is a telecom IC with 35 terminals, operating from -40 to 85°C. It has a supply voltage of 3.3V and is surface mountable in industrial applications. The package style is rectangular, measuring 13.2mm x 20.1mm with a seated height of 2.2mm, suitable for telecom interface functions.
2N2222A
Bharat Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
SS14
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1554216002
Molex
WIRE AND CABLE;
New England Semiconductor
KSZ9031RNXIC
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
Central Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Transistor Application: SWITCHING; Transistor Element Material: SILICON;
Rfe International
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Forward Voltage (VF): 1 V; Config: SINGLE;
Jinan Jingheng Electronics
LL4148
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
RC0402JR-070RL
Yageo
Yageo's RC0402JR-070RL is a SMT fixed resistor with 0 ohm resistance, rated for temperatures from -55 to 155 °C. It features METAL GLAZE/THICK FILM tech, WRAPAROUND terminals, and 0.0625 W power dissipation. Ideal for jumper applications in electronics requiring compact surface mount components.
KSZ9031RNXIC by Microchip Technology is a network interface chip with 1 transceiver. It operates at a data rate of 1000 Mbps and has a nominal voltage of 1.2V. This chip is commonly used in industrial applications requiring Ethernet connectivity.
CDSOT23-SM712
Bourns
Bourns CDSOT23-SM712 is a bidirectional Transient Voltage Suppressor diode with 400W peak power dissipation and 20uA reverse current. Ideal for surge protection in applications requiring a max clamping voltage of 14V, such as IEC-61000-4-2 compliant systems. Operates b/w -55°C to 150°C with matte tin finish and Gull Wing terminals.
Frontier Electronics
BGM113A256V2R
Silicon Labs
BGM113A256V2R by Silicon Labs is a telecom IC with 36 terminals, operating temperature range of -40 to 85°C. It has a nominal voltage of 3.3V and terminal pitch of 0.8mm. This surface-mount IC is ideal for industrial applications requiring compact microelectronic assemblies.
CC430F5137IRGZ
Texas Instruments
CC430F5137IRGZ by Texas Instruments is a telecom IC with a data rate of 0.5 Mbps and operates at a nominal voltage of 2.2V. This industrial-grade chip carrier has 48 terminals, is surface mountable, and suitable for telecom circuit applications. With a temperature range from -40 to 85°C, it features nickel palladium gold terminal finish and very thin profile package style.
L86-M33
Quectel Wireless Solutions
Quectel Wireless Solutions' L86-M33 is a telecom IC with 12 terminals, operating from -40 to 85°C. It has a nominal voltage of 3.3V and is designed for industrial applications. With a compact square package style and no-lead terminal form, it's ideal for space-constrained telecom interfaces.
SA636DK/01,112
NXP Semiconductors
SA636DK/01,112 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features include nickel palladium gold terminal finish, 3V supply voltage, and gull wing terminal form for telecom circuit applications.
SPSGRF-868
SPSGRF-868 by STMicroelectronics is a telecom IC with 11 terminals, operating b/w -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 1.27mm, suitable for industrial applications requiring compact MICROELECTRONIC ASSEMBLY packages in surface mount form.
RS9116N-DB00-CC1-B00
TELECOM CIRCUIT;
ADAR1000ACCZN
Analog Devices
ADAR1000ACCZN by Analog Devices is a telecom IC with 88 terminals in a grid array package. It operates b/w -40°C to 85°C, with a nominal voltage of 3.3V and negative supply voltage of -5V. This IC is designed for telecom circuits requiring precise temperature control and industrial-grade performance.
NEO-M8U-05B
U-blox Ag
NEO-M8U-05B by U-blox Ag is a telecom IC with 24 terminals, operating at -40 to 85°C. Its compact size of 12.2x16mm and low supply voltage of 3V make it ideal for industrial applications requiring precise positioning and timing accuracy. With AEC-Q100 screening, it's suitable for automotive and IoT devices needing reliable telecom interfaces.
14450R-500
Echelon
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: QCCN; Package Shape: SQUARE;
RS9116W-DB00-CC0-B24
CC2564BYFVR-XI
CC2564BYFVR-XI by Texas Instruments is a 54-terminal IC with a package style of GRID ARRAY. It operates at -40 to 85°C, has a data rate of 4 Mbps, and requires a nominal voltage of 3.6 V. Ideal for telecom circuits, this IC is surface mountable and features TIN SILVER COPPER terminal finish.
WF111-A-V1
LTC5596IDC#TRMPBF
LTC5596IDC#TRMPBF by Analog Devices is a Telecom IC with 8 terminals, matte tin finish, and 3.3V supply voltage. It is a small outline package suitable for telecom circuit applications requiring a compact design with a 0.5mm terminal pitch.
MAX2771ETI+
Maxim Integrated
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: HVQCCN; Package Shape: SQUARE;
ISP1507-AX-JT
Insight Sip
ISP1507-AX-JT by Insight Sip is a telecom IC with 62 terminals, operating at -40 to 85°C. It has a data rate of 2 Mbps and nominal voltage of 3V. Ideal for industrial applications requiring high-speed communication in compact form factor.
MAX-M8W-0-10
MAX-M8W-0-10 by U-blox Ag is a GNSS module with 18 terminals and a rectangular package shape. It operates in industrial temperature range (-40 to 85 °C) and has a compact size of 2.5mm width and 10.1mm length. This module is suitable for various applications requiring precise positioning and navigation capabilities.
NINA-B112
NINA-B112 by U-blox Ag is a telecom interface IC with a rectangular package shape and microelectronic assembly style. It operates in industrial temperature range (-40°C to 85°C) and has a nominal voltage of 3V. It is suitable for various telecom circuit applications.
CLEO35-WIFI1
Bridgetek
TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: UNSPECIFIED; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel; Maximum Seated Height: 4.6 mm;
TLK2711IRCP
TLK2711IRCP by Texas Instruments is a telecom IC with 64 terminals, operating at -40 to 85°C. It has a supply voltage of 2.5V and terminal pitch of 0.5mm. Ideal for telecom circuits, it features a flatpack package style and nickel palladium gold terminal finish.
CC2530F256RHAR
CC2530F256RHAR by Texas Instruments is a telecom IC with 40 terminals, operating from -40 to 125°C. It has a supply voltage of 3V, terminal pitch of 0.5mm, and MSL level of 3. Ideal for automotive applications due to its nickel palladium gold finish and no-lead terminal form.
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PN5120A0HN1/C2,151
NXP Semiconductors PN5120A0HN1/C2,151 is a telecom IC with 32 terminals and operates at -30 to 85°C. It has a supply voltage of 3V and terminal pitch of 0.5mm. This chip carrier package is suitable for telecom circuits requiring low-profile components.
PN5120A0HN1/C2,118
NXP Semiconductors PN5120A0HN1/C2,118 is a telecom IC with 32 terminals in a square chip carrier package. Operating at -30 to 85°C, it supports power supplies of 1.8/3.3V and 2.5/3.3V for various applications requiring surface mount technology and moisture sensitivity level of 1.
PN5180A0ET/C2QL
TELECOM CIRCUIT; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260; JESD-609 Code: e1;
PN5180A0HN/C1Y
TELECOM CIRCUIT; Terminal Finish: NICKEL PALLADIUM GOLD; Peak Reflow Temperature (C): 260; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30;
PN5120A0HN1/C2,157
NXP Semiconductors PN5120A0HN1/C2,157 is a telecom IC with 32 terminals in a square chip carrier package. Operating at -30 to 85°C, it supports power supplies of 1.8/3.3V and 2.5/3.3V for various applications requiring surface mount technology and no-lead terminal form.
PN5120A0HN1/C1,151
PN5120A0HN1/C1,151 by NXP Semiconductors is a telecom interface IC with 32 terminals and power supplies of 1.8/3.3V, suitable for telecom circuits. It operates b/w -30 to 85°C, has a terminal pitch of 0.5mm, and features a nickel palladium gold finish for robust connectivity in various applications.
PN5180A0HN/C3E
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: NICKEL PALLADIUM GOLD; Peak Reflow Temperature (C): 260; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 3;
PN5120A0HN/C2,551
Other Telecom ICs; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: QCCN; Package Shape: SQUARE;
PN5120A0HN/C2,557
PN5120A0HN/C2,557 by NXP Semiconductors is a 40-terminal chip carrier with power supplies of 1.8/3.3V and 2.5/3.3V, operating b/w -30 to 85°C. Ideal for telecom interfaces, it features nickel palladium gold finish, quad terminal position, and moisture sensitivity level of 3 MSL.
PN5180A0HN/C3Y
TELECOM CIRCUIT; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Terminal Finish: NICKEL PALLADIUM GOLD;
PN5120A0HN/C2,518
PN5190B1EV/C121E
TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
PN5190B1EV/C121Y
PN5120A0HN1/C1,118
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
PN5120A0HN1/C1,157
PN5120A0HN/C2
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; Package Style (Meter): CHIP CARRIER;
PN5180A0HN/C2Y
PN5190B1HN/C121Y
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
PN5120A0ET/C2QL
Other Telecom ICs; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 64; Package Code: FBGA; Package Shape: SQUARE;
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