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PN5190B1HN/C121Y

NXP Semiconductors

PN5190B1HN/C121Y by NXP Semiconductors

TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;

Median Price

$7.650

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$7.650

12,000

-

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-

$7.650

Digiode

USA . 2,632 parts In-Stock

1+ parts

-

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2,632

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Anansix

USA . 2,363 parts In-Stock

1+ parts

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2,363

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Vyrian

USA . 701 parts In-Stock

1+ parts

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701

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Nova Conductors

Japan . 41 parts In-Stock

1+ parts

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41

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 177 parts In-Stock

1+ parts

$6.166

100+ parts

-

1k+ parts

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177

$6.166

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AZTECH Wire

Italy . 803 parts In-Stock

1+ parts

$11.758

100+ parts

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803

$11.758

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Aztec Data Supply Inc.

USA . 3,376 parts In-Stock

1+ parts

$15.360

100+ parts

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3,376

$15.360

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Ampacity Inc.

Singapore . 641 parts In-Stock

1+ parts

$405.000

100+ parts

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641

$405.000

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One Stop Electronics

USA . 346 parts In-Stock

1+ parts

$713.000

100+ parts

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346

$713.000

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Continental Prestige Electronics

USA . 3,186 parts In-Stock

1+ parts

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3,186

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UNI Independent Distributors

Spain . 2,273 parts In-Stock

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2,273

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Argo Parts USA

USA . 1,444 parts In-Stock

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1,444

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Corphita

USA . 731 parts In-Stock

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731

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Technical Specifications

Other Function Telecom Interface ICs PN5190B1HN/C121Y attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Telecom IC Type:

Trade Compliance

PN5190B1HN/C121Y Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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