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PN5120A0HN/C2,551

NXP Semiconductors

PN5120A0HN/C2,551 by NXP Semiconductors

PN5120A0HN/C2,551 by NXP Semiconductors is a 40-terminal IC with power supplies of 1.8/3.3V and 2.5/3.3V, operating b/w -30 to 85°C. Its no-lead terminal finish and quad position make it ideal for telecom interface applications requiring a moisture sensitivity level of 3 MSL.

Median Price

$8.029

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 465 parts In-Stock

1+ parts

$9.870

100+ parts

$7.120

1k+ parts

$6.170

10k+ parts

-

465

$9.870

$7.120

$6.170

-

DigiKey

USA . 336 parts In-Stock

1+ parts

$9.870

100+ parts

$7.486

1k+ parts

-

10k+ parts

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336

$9.870

$7.486

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Rochester

USA . 436 parts In-Stock

1+ parts

-

100+ parts

$4.950

1k+ parts

$4.430

10k+ parts

$4.170

436

-

$4.950

$4.430

$4.170

Verical

USA . 436 parts In-Stock

1+ parts

-

100+ parts

$6.188

1k+ parts

$5.537

10k+ parts

$5.213

436

-

$6.188

$5.537

$5.213

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$4.217

100+ parts

-

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650

$4.217

-

-

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Digiode

USA . 4,120 parts In-Stock

1+ parts

$5.225

100+ parts

-

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10k+ parts

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4,120

$5.225

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-

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Vyrian

USA . 4,685 parts In-Stock

1+ parts

-

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4,685

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DigiKey Marketplace

USA . 2,420 parts In-Stock

1+ parts

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2,420

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Anansix

USA . 1,384 parts In-Stock

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1,384

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NAC Semi

USA . 980 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$8.000

10k+ parts

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980

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-

$8.000

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IBS Electronics

USA . 490 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.816

10k+ parts

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490

-

-

$6.816

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 3,391 parts In-Stock

1+ parts

$4.098

100+ parts

$4.098

1k+ parts

$4.098

10k+ parts

-

3,391

$4.098

$4.098

$4.098

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Corohmni

South Africa . 35 parts In-Stock

1+ parts

$4.098

100+ parts

-

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35

$4.098

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Netroflash

USA . 100 parts In-Stock

1+ parts

$4.217

100+ parts

-

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100

$4.217

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Ampacity Inc.

Singapore . 438 parts In-Stock

1+ parts

$4.670

100+ parts

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10k+ parts

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438

$4.670

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Semicontronic

India . 66 parts In-Stock

1+ parts

$4.670

100+ parts

$4.553

1k+ parts

$4.530

10k+ parts

-

66

$4.670

$4.553

$4.530

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Corphita

USA . 4,677 parts In-Stock

1+ parts

$4.950

100+ parts

-

1k+ parts

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10k+ parts

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4,677

$4.950

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Aztec Data Supply Inc.

USA . 3,871 parts In-Stock

1+ parts

$14.684

100+ parts

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3,871

$14.684

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UNI Independent Distributors

Spain . 5,468 parts In-Stock

1+ parts

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5,468

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Argo Parts USA

USA . 4,029 parts In-Stock

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4,029

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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GreenTree Electronics

Israel . 2,940 parts In-Stock

1+ parts

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100+ parts

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2,940

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Continental Prestige Electronics

USA . 2,570 parts In-Stock

1+ parts

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100+ parts

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2,570

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Overview

Discover the PN5120A0HN/C2,551 by NXP Semiconductors, a cutting-edge telecom interface IC that delivers unparalleled quality and performance. From its durable plastic/epoxy package body to its advanced terminal finish of nickel palladium gold, this product is designed to exceed expectations. With a wide range of applications and a compact square package shape, the PN5120A0HN/C2,551 offers customers a reliable solution for their connectivity needs. Experience the value and benefits of this innovative chip carrier with power supplies ranging from 1.8V to 3.3V and terminal pitch of 0.5mm. Elevate your projects with NXP Semiconductors' industry-leading technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good protection and durability for the product, ensuring long-lasting performance.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly, saving time and labor costs.

Package Shape: SQUARE

The square shape provides a compact design, saving space and enabling versatile placement.

Power Supplies (V): 1.8/3.3,2.5/3.3

Support for multiple power supply voltages allows for compatibility with different systems, enhancing application flexibility.

No. of Terminals: 40

Having a high number of terminals allows for more connections and functionalities, making the product versatile and adaptable to various setups.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers efficient heat dissipation and protection for the integrated circuits, ensuring stable performance.

Maximum Operating Temperature: 85 °C

The high operating temperature range ensures reliable performance even in challenging environmental conditions.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature allows the product to function effectively in cold environments without any issues.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish provides excellent conductivity and corrosion resistance, contributing to the product's overall reliability.

Terminal Position: QUAD

The quad terminal position allows for efficient and organized connections, ensuring ease of installation and maintenance.

Maximum Time At Peak Reflow Temperature (s): 30

With a short reflow time, the product can undergo the assembly process quickly and smoothly, increasing production efficiency.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and bonding during the manufacturing process, leading to reliable connections.

Terminal Form: NO LEAD

The lead-free terminal form complies with environmental regulations and reduces the risk of harmful substances, making the product eco-friendly.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for dense packaging of components, enabling high functionality in a compact form factor.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level indicates the product's resistance to moisture-related damage, ensuring reliability in humid or damp conditions.

Technical Specifications

Other Function Telecom Interface ICs PN5120A0HN/C2,551 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3,2.5/3.3

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

PN5120A0HN/C2,551 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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