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PN5120A0ET/C2QL

NXP Semiconductors

PN5120A0ET/C2QL by NXP Semiconductors

NXP Semiconductors' PN5120A0ET/C2QL is a telecom interface IC with 64 terminals, operating at temperatures from -30 to 85°C. It has a power supply of 3/3.3V and peak reflow temperature of 260°C. This square-shaped IC in plastic/epoxy package is ideal for applications requiring fine pitch grid array style components.

Median Price

$5.569

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 490 parts In-Stock

1+ parts

-

100+ parts

$4.950

1k+ parts

$4.430

10k+ parts

$4.170

490

-

$4.950

$4.430

$4.170

Verical

USA . 490 parts In-Stock

1+ parts

-

100+ parts

$6.188

1k+ parts

$5.537

10k+ parts

$5.213

490

-

$6.188

$5.537

$5.213

Distributors (In-Stock)

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Nova Conductors

Japan . 41 parts In-Stock

1+ parts

$4.253

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41

$4.253

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Digiode

USA . 1,583 parts In-Stock

1+ parts

$5.225

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1,583

$5.225

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Vyrian

USA . 7,621 parts In-Stock

1+ parts

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7,621

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Anansix

USA . 387 parts In-Stock

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387

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Distributors (Availability)

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$4.168

100+ parts

-

1k+ parts

$4.001

10k+ parts

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2,000

$4.168

-

$4.001

-

Ampacity Inc.

Singapore . 184 parts In-Stock

1+ parts

$4.670

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184

$4.670

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Corphita

USA . 3,885 parts In-Stock

1+ parts

$4.950

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3,885

$4.950

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$7.301

100+ parts

$6.644

1k+ parts

$5.987

10k+ parts

-

2,500

$7.301

$6.644

$5.987

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Aztec Data Supply Inc.

USA . 88 parts In-Stock

1+ parts

$8.520

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88

$8.520

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Corohmni

South Africa . 207 parts In-Stock

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$13.451

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207

$13.451

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AZTECH Wire

Italy . 431 parts In-Stock

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$16.949

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431

$16.949

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Argo Parts USA

USA . 2,912 parts In-Stock

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2,912

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Continental Prestige Electronics

USA . 1,291 parts In-Stock

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1,291

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UNI Independent Distributors

Spain . 158 parts In-Stock

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158

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Overview

Enhance your telecom interface with the PN5120A0ET/C2QL by NXP Semiconductors. Known for their top-quality products, NXP Semiconductors delivers reliable and efficient solutions for various applications. This package features a user-friendly design, making it easy to integrate into your projects. With a temperature range of -30°C to 85°C and a maximum supply current of 100mA, this IC is built to last. Upgrade your system with the PN5120A0ET/C2QL and experience improved performance and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during production.

Package Shape: SQUARE

The square package shape helps in efficient space utilization on the PCB, making it suitable for compact designs.

Power Supplies (V): 3/3.3

The product supports multiple power supply voltages, providing flexibility in different system configurations.

No. of Terminals: 64

With a high number of terminals, this product offers extensive connectivity options for various functions.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array, fine pitch package style enables high density mounting on the PCB, allowing for more functionalities in a limited space.

Maximum Operating Temperature: 85 °C

The product can operate at relatively high temperatures, ensuring reliability in harsh environmental conditions.

Minimum Operating Temperature: -30 °C

With a low minimum operating temperature, this product can withstand cold environmental conditions, making it versatile in various applications.

Terminal Position: BOTTOM

The bottom terminal position offers ease of PCB layout and assembly, simplifying the integration of the product into the system.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures strong solder joints during the assembly process, enhancing the product's reliability.

Terminal Form: BALL

The ball terminal form provides good electrical contact and reliability, contributing to the overall performance of the product.

Maximum Supply Current: 100 mA

With a maximum supply current of 100 mA, this product is suitable for low power consumption applications, helping in energy efficiency.

Terminal Pitch: 0.635 mm

The fine terminal pitch allows for high density mounting and precise connections, making the product suitable for intricate designs.

Technical Specifications

Other Function Telecom Interface ICs PN5120A0ET/C2QL attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B64

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,25

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

100 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

BOTTOM

Trade Compliance

PN5120A0ET/C2QL Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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