Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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PN5120A0HN/C2,557 by NXP Semiconductors is a 40-terminal chip carrier with power supplies of 1.8/3.3V and 2.5/3.3V, operating b/w -30 to 85°C. Ideal for telecom interfaces, it features nickel palladium gold finish, quad terminal position, and moisture sensitivity level of 3 MSL.
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PLASTIC/EPOXY - This material provides durability and reliability, making the product suitable for a wide range of applications.
YES - The surface mount feature allows for easy installation and integration into various electronic devices.
SQUARE - The square shape of the package makes it easy to handle and place onto circuit boards efficiently.
1.8/3.3, 2.5/3.3 - The multiple power supply options offer flexibility in voltage requirements for different system configurations.
40 - With a high number of terminals, this product can support complex interface requirements and connectivity options.
CHIP CARRIER - The chip carrier style provides compactness and efficient space utilization in electronic assemblies.
85 °C - The high operating temperature range ensures reliable performance in various environmental conditions.
30 °C - The low operating temperature range allows for use in cold environments without compromising functionality.
NICKEL PALLADIUM GOLD - This finish offers excellent conductivity and corrosion resistance for long-lasting performance.
QUAD - The quad terminal position allows for easy connection and secure soldering onto circuit boards.
30 - The short time at peak reflow temperature minimizes the risk of component damage during the soldering process.
260 - The high peak reflow temperature ensures proper soldering and component bonding for reliable operation.
NO LEAD - The lead-free terminal form complies with environmental regulations and is safer for handling and disposal.
0.5 mm - The small terminal pitch enables high-density mounting and compact designs in electronic systems.
3 - The MSL 3 rating indicates the moisture resistance of the product, ensuring long-term reliability in humid conditions.
Other Function Telecom Interface ICs PN5120A0HN/C2,557 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors
JESD-30 Code:
JESD-609 Code:
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No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
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Package Equivalence Code:
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Package Style (Meter):
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Power Supplies (V):
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Sub-Category:
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PN5120A0HN/C2,557 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Packaging - Mult Dev Pkg Seal 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
BSS123,215
NXP Semiconductors
NXP Semiconductors' BSS123,215 is a N-CHANNEL FET for SWITCHING applications. Features include 100V DS Breakdown Voltage, 0.17A Drain Current, and 6 ohm On Resistance. With GULL WING terminals and ENHANCEMENT MODE operation, it's ideal for small outline packages in various electronic devices.
BSS138W-7-F
Multicomp Pro
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Transistor Element Material: SILICON; No. of Elements: 1;
BAV99
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Reverse Recovery Time: .006 us;
2N2222A
Shanghai Lunsure Electronic Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
Secos
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
OPA2277UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LL4148
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N7002-7-F
Diodes Incorporated
Diodes Inc. 2N7002-7-F is a N-channel FET with 60V DS breakdown voltage, 0.115A max drain current, and 13.5 ohm RDS(on). Ideal for switching applications in enhancement mode operation. Features Gull Wing terminals, small outline package style, and operates up to 150°C.
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: END; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148
Microchip Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Leshan Radio
1N5819HW-7-F
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Goodwork Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Onsemi
ISO1050DUBR
Texas Instruments
ISO1050DUBR by Texas Instruments is a network interface IC with 8 terminals, operating from -55 to 105°C. It features a small outline package, nickel palladium gold finish, and gull wing terminal form. Ideal for telecom applications requiring a 5V supply voltage and peak reflow temperature of 260°C.
BAV99W-7-F
Diodes Incorporated BAV99W-7-F is a fast recovery rectifier diode with 2 elements in series connected, center tap configuration. It has a max reverse recovery time of 0.004 us and can handle a max output current of 0.15 A. Ideal for applications requiring fast switching capabilities and operating temperatures ranging from -65 to 150 °C.
ECA2DHG4R7
Panasonic
ECA2DHG4R7 by Panasonic is a 4.7uF aluminum electrolytic capacitor with 200V rated DC voltage. It features tan delta of 0.15, leakage current of 0.0664mA, and ripple current of 50mA, making it ideal for applications requiring high capacitance stability and low leakage in through-hole mounting setups at temperatures ranging from -25 to 105°C.
2N7002
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; JESD-30 Code: R-PDSO-G3;
1N4148WS
Sangdest Microelectronics (Nanjing)
BSS138
Vishay Semiconductors
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE; Package Shape: RECTANGULAR; Transistor Application: SWITCHING;
BGM220SC12WGA2
Silicon Labs
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;
AD9671KBCZ
Analog Devices
AD9671KBCZ by Analog Devices is a 144-terminal GRID ARRAY IC with low profile and fine pitch. Operating b/w 0-85°C, it has a supply voltage of 1.4V and terminal pitch of 0.8mm. Ideal for telecom circuits, its package is made of PLASTIC/EPOXY and is surface mountable for various applications.
RN4678APL-V/RM113
RN4678APL-V/RM113 by Microchip Technology is a telecom IC with 33 terminals, operating b/w -20 to 70°C. It has a compact rectangular package measuring 12mm in width and 22mm in length, suitable for surface mount applications. With a nominal voltage of 1.9V, it is ideal for commercial temperature grade telecom circuit designs.
RN41N-I/RM615
Microchip Technology's RN41N-I/RM615 is a telecom IC with 35 terminals, operating from -40 to 85°C. It has a supply voltage of 3.3V and is surface mountable in industrial applications. The package style is rectangular, measuring 13.2mm in width and 20.1mm in length, making it suitable for various telecom interface functions.
SPSGRF-915
STMicroelectronics
SPSGRF-915 by STMicroelectronics is a telecom IC with 11 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 1.27mm. This surface-mount IC is ideal for industrial telecom applications due to its compact rectangular package design.
DA14531MOD-00F0100C
Dialog Semiconductor
TELECOM CIRCUIT; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 3;
450-0177R
Laird Technologies
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
BM71BLES1FC2-0B04AA
BM71BLES1FC2-0B04AA by Microchip is a telecom IC with 16 terminals, operating temperature range of -40 to 85°C, and data rate of 0.0086 Mbps. It is a surface-mount rectangular package suitable for industrial applications requiring a nominal voltage of 3V.
BMD-300-A-R-10
U-blox Ag
The U-blox Ag BMD-300-A-R-10 is a surface mount telecom IC with 47 terminals. It operates in industrial temperature range (-40 to 85 °C) and has a nominal voltage of 3V. With a data rate of 2 Mbps, it's ideal for applications requiring high-speed telecommunications functionality.
ZED-F9R-01B
TELECOM CIRCUIT; Peak Reflow Temperature (C): 245; Moisture Sensitivity Level (MSL): 4;
MAX7044AKA-T
Maxim Integrated
MAX7044AKA-T by Maxim Integrated is a telecom IC with 8 terminals, operating at -40 to 125°C. It has a supply voltage of 2.7V and low power consumption of 0.0257mA, suitable for automotive applications due to its CMOS technology and small form factor.
AP22814BW5-7
Diodes Inc. AP22814BW5-7 is a telecom IC with 5V supply voltage, operating from -40 to 85°C. It features a small outline package with matte tin finish, suitable for telecom circuit applications. The IC has dual terminals in gull wing form, measuring 3x1.6mm and 1.4mm seated height for industrial temperature grade use.
BT832F
Fanstel
BT832F by Fanstel is a surface mount telecom IC with 40 terminals. It operates in an industrial temperature range of -40 to 85°C and has a data rate of 1 Mbps. This compact rectangular package is suitable for various telecom circuit applications.
MAX3946ETG+T
MAX3946ETG+T by Analog Devices is a 24-terminal telecom IC with 3.3V supply voltage, operating from -40 to 95°C. It features a square chip carrier package style, matte tin finish, and industrial temperature grade. Ideal for telecom circuits, it has a terminal pitch of 0.5mm and no-lead terminal form.
HMC799LP3ETR
Analog Devices' HMC799LP3ETR is a 16-terminal telecom IC with 5V supply, operating from -40 to 85°C. It's a surface-mount chip carrier package suitable for industrial applications, drawing max 80mA current. With matte tin finish and quad terminal position, it's ideal for telecom circuit interfaces.
AS3933-BQFT
Ams Ag
AS3933-BQFT by Ams Ag is a telecom IC with 16 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. It has a nominal voltage of 3V and terminal pitch of 0.65mm, ideal for telecom circuit applications.
XCC3135MODRNMMOBR
XCC3135MODRNMMOBR by Texas Instruments is a telecom IC with 63 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and comes in a rectangular chip carrier package style. Ideal for industrial applications requiring telecom circuit interfaces.
CC2640R2FRGZR
CC2640R2FRGZR by Texas Instruments is a telecom IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 3V. Ideal for telecom circuits, it features nickel palladium gold terminal finish and no-lead terminal form.
RN4871-I/RM128
RN4871-I/RM128 by Microchip Technology is a telecom IC with 16 terminals, operating at -40 to 85 °C. It has a data rate of 0.01 Mbps and nominal voltage of 3.3 V. Ideal for industrial applications requiring reliable telecom circuit interfaces in compact spaces.
451-00001
Laird Technologies' 451-00001 is a telecom IC with 71 terminals, operating at -40 to 85°C. With a supply voltage of 3.3V, it supports data rates up to 2 Mbps. This surface-mount IC in rectangular package is ideal for telecom circuit applications.
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PN5120A0HN1/C2,151
NXP Semiconductors PN5120A0HN1/C2,151 is a telecom IC with 32 terminals and operates at -30 to 85°C. It has a supply voltage of 3V and terminal pitch of 0.5mm. This chip carrier package is suitable for telecom circuits requiring low-profile components.
PN5120A0HN1/C2,118
NXP Semiconductors PN5120A0HN1/C2,118 is a telecom IC with 32 terminals in a square chip carrier package. Operating at -30 to 85°C, it supports power supplies of 1.8/3.3V and 2.5/3.3V for various applications requiring surface mount technology and moisture sensitivity level of 1.
PN5180A0ET/C2QL
TELECOM CIRCUIT; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260; JESD-609 Code: e1;
PN5180A0HN/C1Y
TELECOM CIRCUIT; Terminal Finish: NICKEL PALLADIUM GOLD; Peak Reflow Temperature (C): 260; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30;
PN5120A0HN1/C2,157
NXP Semiconductors PN5120A0HN1/C2,157 is a telecom IC with 32 terminals in a square chip carrier package. Operating at -30 to 85°C, it supports power supplies of 1.8/3.3V and 2.5/3.3V for various applications requiring surface mount technology and no-lead terminal form.
PN5120A0HN1/C1,151
PN5120A0HN1/C1,151 by NXP Semiconductors is a telecom interface IC with 32 terminals and power supplies of 1.8/3.3V, suitable for telecom circuits. It operates b/w -30 to 85°C, has a terminal pitch of 0.5mm, and features a nickel palladium gold finish for robust connectivity in various applications.
PN5180A0HN/C3E
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: NICKEL PALLADIUM GOLD; Peak Reflow Temperature (C): 260; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 3;
PN5120A0HN/C2,551
Other Telecom ICs; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: QCCN; Package Shape: SQUARE;
PN5180A0HN/C3Y
TELECOM CIRCUIT; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Terminal Finish: NICKEL PALLADIUM GOLD;
PN5120A0HN1/C2
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Seated Height: 1 mm;
PN5120A0HN/C2,518
PN5190B1EV/C121E
TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
PN5190B1EV/C121Y
PN5120A0HN1/C1,118
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
PN5120A0HN1/C1,157
PN5120A0HN/C2
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; Package Style (Meter): CHIP CARRIER;
PN5180A0HN/C2Y
PN5190B1HN/C121Y
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
PN5120A0ET/C2QL
Other Telecom ICs; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 64; Package Code: FBGA; Package Shape: SQUARE;
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