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LA72912V-MPB-H

Onsemi

LA72912V-MPB-H by Onsemi

LA72912V-MPB-H by Onsemi is a 24-terminal IC with 5V supply voltage, operating b/w -30 to 70°C. It features Gull Wing terminals, BIPOLAR technology, and a small outline package shape. Ideal for telecom interfaces due to its low supply current and high reflow temperature of 260°C.

Median Price

$4.188

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 34 parts In-Stock

1+ parts

$3.131

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-

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34

$3.131

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Chip1Stop

Japan . 120 parts In-Stock

1+ parts

$15.100

100+ parts

$7.880

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120

$15.100

$7.880

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Rochester

USA . 157 parts In-Stock

1+ parts

-

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$3.350

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$3.000

10k+ parts

$2.820

157

-

$3.350

$3.000

$2.820

DigiKey

USA . 157 parts In-Stock

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$4.410

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157

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$4.410

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Verical

USA . 157 parts In-Stock

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-

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$4.188

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$3.750

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$3.525

157

-

$4.188

$3.750

$3.525

Distributors (In-Stock)

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Digiode

USA . 533 parts In-Stock

1+ parts

$2.984

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533

$2.984

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Nova Conductors

Japan . 79 parts In-Stock

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$3.538

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79

$3.538

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Vyrian

USA . 4,840 parts In-Stock

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4,840

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Distributors (Availability)

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Ampacity Inc.

Singapore . 136 parts In-Stock

1+ parts

$2.650

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136

$2.650

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Semicontronic

India . 136 parts In-Stock

1+ parts

$2.650

100+ parts

$2.584

1k+ parts

$2.570

10k+ parts

-

136

$2.650

$2.584

$2.570

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Corphita

USA . 1,513 parts In-Stock

1+ parts

$2.827

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1,513

$2.827

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Corohmni

South Africa . 95 parts In-Stock

1+ parts

$3.120

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95

$3.120

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Argo Parts USA

USA . 2,169 parts In-Stock

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$3.538

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2,169

$3.538

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$3.538

100+ parts

$3.467

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2,000

$3.538

$3.467

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Aztec Data Supply Inc.

USA . 3,837 parts In-Stock

1+ parts

$17.438

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3,837

$17.438

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AZTECH Wire

Italy . 806 parts In-Stock

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$18.312

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806

$18.312

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SupplyDigital Components

Austria . 7,058 parts In-Stock

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Kulean Microsystems

USA . 5,645 parts In-Stock

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Problanco Electronics

Mexico . 3,356 parts In-Stock

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3,356

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TANS Electronics

Latvia . 3,231 parts In-Stock

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Perfect Parts

USA . 941 parts In-Stock

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941

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UHIMA Technologies

Türkiye . 702 parts In-Stock

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702

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Microchip USA

USA . 313 parts In-Stock

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313

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Continental Prestige Electronics

USA . 157 parts In-Stock

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$3.120

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157

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Authorized Procurement Solutions

USA . 120 parts In-Stock

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120

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Overview

Enhance your telecommunications devices with the LA72912V-MPB-H by Onsemi, a high-quality interface IC designed for superior performance and reliability. Manufactured by industry leader Onsemi, this product offers unmatched value with its innovative technology and durable construction. Ideal for a wide range of applications in the telecom industry, this product provides customers with seamless connectivity and efficient operation. Trust Onsemi to deliver cutting-edge solutions that exceed expectations and elevate your communication systems to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of a strong and durable plastic/epoxy material in the package body ensures reliability and longevity in various operating conditions.

Surface Mount: YES

Being surface mount compatible makes it easier for manufacturers to integrate this product onto their circuit boards, saving space and simplifying assembly.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of board space and easy placement within electronic systems.

Power Supplies (V): 5

The 5V power supply ensures compatibility with standard voltage requirements, making it suitable for a wide range of applications.

No. of Terminals: 24

Having 24 terminals allows for multiple connections and functionalities, making this product versatile and capable of handling various tasks.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style reduces the overall size of the component, enabling compact designs and saving space in electronic devices.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures stable performance even in demanding environmental conditions.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature of -30°C allows this product to function reliably in cold environments.

Terminal Finish: TIN BISMUTH

The tin bismuth terminal finish provides excellent solderability and corrosion resistance, ensuring secure connections and long-term reliability.

Terminal Position: DUAL

Having dual terminal positions enables flexible mounting options and simplifies the connection of the product within a circuit.

Maximum Time At Peak Reflow Temperature (s): 30

This product can withstand a peak reflow temperature for up to 30 seconds, ensuring proper soldering and assembly during manufacturing processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for reliable and efficient soldering of the component onto circuit boards.

Technology: BIPOLAR

Utilizing bipolar technology ensures fast and precise signal processing, making this product suitable for high-performance telecom interface applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy installation and removal of the component, simplifying maintenance and repair tasks.

Maximum Supply Current: 0.032 mA

The low maximum supply current of 0.032 mA results in efficient power consumption, making this product suitable for energy-conscious applications.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage provides reliable power to the component and ensures compatibility with standard voltage levels in electronic systems.

Terminal Pitch: 0.635 mm

The small terminal pitch of 0.635 mm allows for high-density mounting on circuit boards, enabling efficient use of board space.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that this product is suitable for reflow soldering and can withstand moderate exposure to moisture during handling and storage.

Technical Specifications

Other Function Telecom Interface ICs LA72912V-MPB-H attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.032 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LA72912V-MPB-H Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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