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LA72914V-TLM-H

Onsemi

LA72914V-TLM-H by Onsemi

LA72914V-TLM-H by Onsemi is a small outline, shrink pitch telecom interface IC with 16 terminals. It operates at temperatures ranging from -20 to 70 °C and has a nominal voltage of 5 V. This IC is commonly used in telecommunications applications.

Median Price

$3.966

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 497 parts In-Stock

1+ parts

$13.700

100+ parts

$7.220

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497

$13.700

$7.220

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Farnell

UK . 2,000 parts In-Stock

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$3.844

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$3.844

Rochester

USA . 1,961 parts In-Stock

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-

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$3.270

1k+ parts

$2.920

10k+ parts

$2.750

1,961

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$3.270

$2.920

$2.750

DigiKey

USA . 1,961 parts In-Stock

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$4.300

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$4.300

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Verical

USA . 1,961 parts In-Stock

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$4.088

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$3.650

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$3.438

1,961

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$4.088

$3.650

$3.438

Mouser Electronics

USA . 1,454 parts In-Stock

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$3.120

1,454

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$3.120

Distributors (In-Stock)

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Digiode

USA . 2,009 parts In-Stock

1+ parts

$3.458

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2,009

$3.458

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Nova Conductors

Japan . 75 parts In-Stock

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$3.458

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75

$3.458

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DigiKey Marketplace

USA . 2,000 parts In-Stock

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Vyrian

USA . 1,446 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,398 parts In-Stock

1+ parts

$2.650

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1,398

$2.650

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Corohmni

South Africa . 151 parts In-Stock

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$3.120

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151

$3.120

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Corphita

USA . 2,350 parts In-Stock

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$3.276

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$3.276

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Aranea Global

USA . 2,000 parts In-Stock

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$3.389

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$3.254

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$3.389

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$3.254

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Argo Parts USA

USA . 2,363 parts In-Stock

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$3.458

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$3.458

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Aztec Data Supply Inc.

USA . 268 parts In-Stock

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$15.410

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268

$15.410

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QUARKTWIN TECHNOLOGY LTD

USA . 15,086 parts In-Stock

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TANS Electronics

Latvia . 8,400 parts In-Stock

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Problanco Electronics

Mexico . 6,247 parts In-Stock

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Perfect Parts

USA . 3,918 parts In-Stock

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Kulean Microsystems

USA . 3,748 parts In-Stock

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SupplyDigital Components

Austria . 2,497 parts In-Stock

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Continental Prestige Electronics

USA . 2,000 parts In-Stock

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$2.990

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Microchip USA

USA . 1,446 parts In-Stock

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Authorized Procurement Solutions

USA . 497 parts In-Stock

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497

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GreenTree Electronics

Israel . 497 parts In-Stock

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497

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UHIMA Technologies

Türkiye . 3 parts In-Stock

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Overview

Discover the LA72914V-TLM-H by Onsemi, a top-quality telecom interface IC designed to revolutionize your communication systems. With Onsemi's renowned manufacturing expertise, this product guarantees exceptional performance and reliability. Its compact design and surface mount capability make it suitable for a wide range of applications. Experience the value and benefits of this product, from its low power consumption to its versatile terminal configuration. Upgrade your telecom interface with the LA72914V-TLM-H and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product is made with a durable plastic/epoxy material, ensuring a long-lasting lifespan and resistance to external factors.

Surface Mount: YES

With a surface mount feature, this product offers easy installation and allows for efficient use of space on the circuit board.

Package Shape: RECTANGULAR

The rectangular package shape of this product makes it compatible with a wide range of electronic devices, enabling versatile usage.

Power Supplies (V): 5

Operating at a power supply of 5 volts, this product provides a reliable and stable electrical connection for optimal performance.

No. of Terminals: 16

With 16 terminals, this product offers sufficient connectivity options, accommodating various input and output connections.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

This small outline, shrink pitch package style contributes to the compact design of the product, allowing for more efficient use of space.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand high temperature conditions without compromising its performance.

Minimum Operating Temperature: -20 °C

Operating at temperatures as low as -20°C, this product is suitable for use in both hot and cold environments.

Terminal Finish: TIN BISMUTH

The tin bismuth terminal finish enhances the product's conductivity and improves its resistance to corrosion, ensuring optimal signal transmission.

Terminal Position: DUAL

Featuring dual terminal positions, this product offers flexibility in terms of circuit board layout and ease of connection.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this product undergoes efficient soldering processes, minimizing the risk of damage.

Peak Reflow Temperature °C: 260

Operating at a peak reflow temperature of 260°C, this product is designed to withstand high-temperature soldering processes without any performance issues.

Temperature Grade: COMMERCIAL

This product is designed for commercial applications, ensuring reliable operation and performance in standard temperature environments.

Technology: BIPOLAR

Utilizing bipolar technology, this product offers high-speed and high-performance capabilities, making it suitable for demanding telecom interface applications.

Terminal Form: GULL WING

The gull wing terminal form of this product allows for easy soldering and secure connections, making it ideal for efficient assembly processes.

Maximum Supply Current: 0.04 mA

With a maximum supply current of 0.04 mA, this product ensures low power consumption and efficient energy usage.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 volts, this product provides a stable and reliable power source for optimal functionality.

Terminal Pitch: 0.635 mm

With a terminal pitch of 0.635 mm, this product offers precise and accurate connections, ensuring efficient signal transmission.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this product has a moderate moisture sensitivity level, making it suitable for a wide range of environmental conditions.

Technical Specifications

Other Function Telecom Interface ICs LA72914V-TLM-H attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.04 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LA72914V-TLM-H Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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