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LA72914V-MPB-H

Onsemi

LA72914V-MPB-H by Onsemi

LA72914V-MPB-H by Onsemi is a 16-terminal IC with 5V supply, operating from -20 to 70 °C. It features Gull Wing terminals, shrink pitch style, and commercial temperature grade. Ideal for telecom interfaces, it has a max supply current of 0.04mA and terminal pitch of 0.635mm.

Median Price

$15.000

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 68 parts In-Stock

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$15.000

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Digiode

USA . 1,053 parts In-Stock

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$14.250

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Chip Stock

USA . 70,000 parts In-Stock

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70,000

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Vyrian

USA . 7,649 parts In-Stock

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Corphita

USA . 2,329 parts In-Stock

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$13.500

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Corohmni

South Africa . 377 parts In-Stock

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$15.000

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AZTECH Wire

Italy . 599 parts In-Stock

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$19.320

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QUARKTWIN TECHNOLOGY LTD

USA . 24,278 parts In-Stock

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TANS Electronics

Latvia . 8,063 parts In-Stock

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SupplyDigital Components

Austria . 6,058 parts In-Stock

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Kulean Microsystems

USA . 2,544 parts In-Stock

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Problanco Electronics

Mexico . 1,176 parts In-Stock

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UHIMA Technologies

Türkiye . 466 parts In-Stock

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Perfect Parts

USA . 464 parts In-Stock

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Metaverse IC Inc.

Canada . 135 parts In-Stock

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Microchip USA

USA . 100 parts In-Stock

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Authorized Procurement Solutions

USA . 68 parts In-Stock

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GreenTree Electronics

Israel . 68 parts In-Stock

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ChipstoGo Electronic ltd

UK . 35 parts In-Stock

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Overview

Upgrade your telecom interface systems with the LA72914V-MPB-H from Onsemi. Crafted with precision and quality, this small outline IC offers unparalleled performance and reliability. Perfect for a wide range of applications, this product provides superior functionality while maintaining a compact design. Experience the seamless integration and enhanced efficiency that this innovative technology brings to your projects. Trust Onsemi to deliver cutting-edge solutions that exceed expectations. Elevate your communication systems with the LA72914V-MPB-H today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability to the product, ensuring a long lifespan.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort.

Power Supplies (V): 5

Operates at a standard voltage level, making it compatible with many systems.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures, making it suitable for various environments.

Technology: BIPOLAR

Utilizes bipolar technology for efficient and reliable performance in telecom applications.

Technical Specifications

Other Function Telecom Interface ICs LA72914V-MPB-H attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.04 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LA72914V-MPB-H Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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