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LA72910V-TLM-E

Onsemi

LA72910V-TLM-E by Onsemi

LA72910V-TLM-E by Onsemi is a 16-terminal IC with 5V power supply, operating from -30 to 70 °C. It features Gull Wing terminals, Tin Bismuth finish, and is surface mountable. Ideal for telecom interfaces due to its small outline package and dual terminal position.

Median Price

$9.160

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 213 parts In-Stock

1+ parts

$9.160

100+ parts

$5.880

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213

$9.160

$5.880

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Distributors (In-Stock)

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Digiode

USA . 97 parts In-Stock

1+ parts

$8.702

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97

$8.702

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Vyrian

USA . 4,364 parts In-Stock

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4,364

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Flip Electronics

USA . 250 parts In-Stock

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250

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Distributors (Availability)

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Corphita

USA . 607 parts In-Stock

1+ parts

$8.244

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607

$8.244

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Corohmni

South Africa . 336 parts In-Stock

1+ parts

$9.160

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336

$9.160

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Problanco Electronics

Mexico . 8,364 parts In-Stock

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8,364

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Kulean Microsystems

USA . 5,257 parts In-Stock

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5,257

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TANS Electronics

Latvia . 3,406 parts In-Stock

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Perfect Parts

USA . 3,194 parts In-Stock

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SupplyDigital Components

Austria . 3,120 parts In-Stock

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UHIMA Technologies

Türkiye . 305 parts In-Stock

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305

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Authorized Procurement Solutions

USA . 213 parts In-Stock

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213

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GreenTree Electronics

Israel . 213 parts In-Stock

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213

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Overview

Enhance your communication systems with the LA72910V-TLM-E by Onsemi, a top-notch solution in the category of Other Function Telecom Interface ICs. Crafted with precision and expertise by Onsemi, this product offers unparalleled quality and reliability. With its compact package shape and high-performance features, this IC is perfect for various applications. Experience seamless integration and optimized functionality with the LA72910V-TLM-E, designed to deliver value and efficiency to our customers. Upgrade your telecom systems today with this exceptional product from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for simplified and efficient manufacturing processes, making this product easier to integrate into circuit boards.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on circuit boards, making it ideal for compact designs.

Power Supplies (V): 5

Operates at a standard power supply voltage of 5V, making it compatible with a wide range of applications.

No. of Terminals: 16

A higher number of terminals allows for more connections and capabilities, increasing the versatility of the product.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product can withstand higher temperature environments, ensuring reliable performance.

Terminal Finish: TIN BISMUTH

TIN BISMUTH terminal finish provides excellent conductivity and corrosion resistance, enhancing the overall reliability and longevity of the product.

Terminal Position: DUAL

Dual terminal position allows for flexibility in installation and connection options, accommodating different circuit board layouts.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, this product can withstand high-temperature soldering processes, ensuring secure and reliable connections during assembly.

Nominal Supply Voltage: 5 V

Operates at a nominal supply voltage of 5V, making it compatible with standard power sources and reducing the need for additional components.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that this product has moderate sensitivity to moisture, making it suitable for a variety of environments and storage conditions.

Technical Specifications

Other Function Telecom Interface ICs LA72910V-TLM-E attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LA72910V-TLM-E Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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