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LA72910V-MPB-E

Onsemi

LA72910V-MPB-E by Onsemi

LA72910V-MPB-E by Onsemi is a 16-terminal IC with 5V supply voltage, operating from -30 to 70 °C. It features Gull Wing terminals, PLASTIC/EPOXY body material, and is surface mountable. Ideal for telecom interfaces due to its small outline package style and dual terminal position.

Median Price

$71.760

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 85 parts In-Stock

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$71.760

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Digiode

USA . 1,555 parts In-Stock

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$68.172

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Vyrian

USA . 3,753 parts In-Stock

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Corphita

USA . 1,209 parts In-Stock

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$64.584

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Corohmni

South Africa . 182 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 26,532 parts In-Stock

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Problanco Electronics

Mexico . 6,001 parts In-Stock

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TANS Electronics

Latvia . 4,299 parts In-Stock

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Microchip USA

USA . 1,885 parts In-Stock

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Kulean Microsystems

USA . 1,709 parts In-Stock

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SupplyDigital Components

Austria . 1,163 parts In-Stock

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Perfect Parts

USA . 594 parts In-Stock

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UHIMA Technologies

Türkiye . 423 parts In-Stock

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Authorized Procurement Solutions

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GreenTree Electronics

Israel . 85 parts In-Stock

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Overview

Experience seamless connectivity with the LA72910V-MPB-E by Onsemi, a top-of-the-line Other Function Telecom Interface IC. Designed with precision and reliability in mind, this product offers unparalleled performance in various applications. From telecommunications to networking, this versatile IC is your go-to solution for efficient and effective connectivity. Trust in Onsemi's reputation for quality and innovation, and elevate your projects to new heights. Unlock the potential of your devices with the LA72910V-MPB-E and experience the value it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the product.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and cost in production.

Power Supplies (V): 5

The 5V power supply is a common voltage level, making it compatible with a wide range of systems and applications.

No. of Terminals: 16

Having 16 terminals allows for multiple connections and interactions with other components, increasing the versatility of the product.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures that the product can function reliably in various environments without overheating.

Terminal Finish: TIN BISMUTH

The tin bismuth terminal finish provides good solderability and resistance to corrosion, enhancing the longevity of the product.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is within a safe and common range, ensuring stable performance and compatibility with standard power sources.

Technical Specifications

Other Function Telecom Interface ICs LA72910V-MPB-E attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LA72910V-MPB-E Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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