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AFEM-S106-TR1G

Broadcom

AFEM-S106-TR1G by Broadcom

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 14; Package Code: HBCC; Package Shape: SQUARE;

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 6,569 parts In-Stock

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Digiode

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Native Components

USA . 717 parts In-Stock

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$0.441

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$0.423

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Northwest PG Solutions

USA . 1,361 parts In-Stock

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$0.485

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$0.428

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Decca Corp

Germany . 884 parts In-Stock

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AZTECH Wire

Italy . 1,131 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,620 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,413 parts In-Stock

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Authorized Procurement Solutions

USA . 2,800 parts In-Stock

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Supply Digital

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Corphita

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Technical Specifications

Other Function Telecom Interface ICs AFEM-S106-TR1G attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Broadcom

Specs

JESD-30 Code:

S-XBCC-B14

Length:

3.2 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Width:

3.2 mm

Trade Compliance

AFEM-S106-TR1G Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Broadcom

Broadcom Inc, a Delaware corporation headquartered in San Jose, CA, is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise and mainframe software focused on automation, monitoring and security, smartphone components, telecoms and factory automation.

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