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AFEM-S257-TR2G

Broadcom

AFEM-S257-TR2G by Broadcom

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 44; Package Code: HQCCN; Package Shape: RECTANGULAR;

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Digiode

USA . 453 parts In-Stock

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453

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Vyrian

USA . 98 parts In-Stock

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98

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Distributors (Availability)

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Decca Corp

Germany . 1,457 parts In-Stock

1+ parts

$1.000

100+ parts

$0.980

1k+ parts

$0.970

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1,457

$1.000

$0.980

$0.970

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Northwest PG Solutions

USA . 2,253 parts In-Stock

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2,253

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Native Components

USA . 715 parts In-Stock

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715

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Supply Digital

USA . 646 parts In-Stock

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646

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Corphita

USA . 283 parts In-Stock

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283

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Technical Specifications

Other Function Telecom Interface ICs AFEM-S257-TR2G attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Broadcom

Specs

JESD-30 Code:

R-XQCC-N44

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.7 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

AFEM-S257-TR2G Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Broadcom

Broadcom Inc, a Delaware corporation headquartered in San Jose, CA, is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise and mainframe software focused on automation, monitoring and security, smartphone components, telecoms and factory automation.

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