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AFEM-S102-BLKG

Broadcom

AFEM-S102-BLKG by Broadcom

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 13; Package Code: VQCCN; Package Shape: SQUARE;

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 8,291 parts In-Stock

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Digiode

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Andel Nordic

Denmark . 2,059 parts In-Stock

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$2.959

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$2.841

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$2.841

2,059

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AZTECH Wire

Italy . 631 parts In-Stock

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$11.700

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631

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Decca Corp

Germany . 376 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,031 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,354 parts In-Stock

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Authorized Procurement Solutions

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Northwest PG Solutions

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Corphita

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Supply Digital

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Native Components

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Kepictronics

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Technical Specifications

Other Function Telecom Interface ICs AFEM-S102-BLKG attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Broadcom

Specs

JESD-30 Code:

S-XQCC-N13

Length:

2.2 mm

No. of Functions:

1

No. of Terminals:

13

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.65 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

2.2 mm

Trade Compliance

AFEM-S102-BLKG Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.50.00.80

PCN

Manufacturer Highlights

Broadcom

Broadcom Inc, a Delaware corporation headquartered in San Jose, CA, is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise and mainframe software focused on automation, monitoring and security, smartphone components, telecoms and factory automation.

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