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TCC-106A-RT

Onsemi

TCC-106A-RT by Onsemi

TCC-106A-RT by Onsemi is a Telecom Circuit IC with 20 terminals in a very thin profile grid array package. Operating temperature ranges from -30 to 85 °C, suitable for telecom interface applications. It has a nominal voltage of 3.3V and terminal pitch of 0.4mm, making it ideal for compact electronic devices.

Median Price

$0.956

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 32,100 parts In-Stock

1+ parts

-

100+ parts

$0.938

1k+ parts

$0.778

10k+ parts

$0.694

32,100

-

$0.938

$0.778

$0.694

Verical

USA . 32,100 parts In-Stock

1+ parts

-

100+ parts

-

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$0.973

10k+ parts

$0.868

32,100

-

-

$0.973

$0.868

Distributors (In-Stock)

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Digiode

USA . 322 parts In-Stock

1+ parts

$0.731

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322

$0.731

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Lantek

USA . 32,459 parts In-Stock

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32,459

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Vyrian

USA . 8,604 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 287 parts In-Stock

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$0.623

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-

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287

$0.623

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Corphita

USA . 354 parts In-Stock

1+ parts

$0.692

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354

$0.692

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AZTECH Wire

Italy . 430 parts In-Stock

1+ parts

$16.250

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430

$16.250

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GreenTree Electronics

Israel . 32,459 parts In-Stock

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32,459

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Continental Prestige Electronics

USA . 32,100 parts In-Stock

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$0.595

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$0.595

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QUARKTWIN TECHNOLOGY LTD

USA . 27,915 parts In-Stock

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RC Electronics

USA . 9,000 parts In-Stock

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Metaverse IC Inc.

Canada . 7,699 parts In-Stock

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7,699

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TANS Electronics

Latvia . 6,721 parts In-Stock

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6,721

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Problanco Electronics

Mexico . 3,255 parts In-Stock

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SupplyDigital Components

Austria . 732 parts In-Stock

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732

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Kulean Microsystems

USA . 340 parts In-Stock

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340

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Microchip USA

USA . 266 parts In-Stock

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266

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UHIMA Technologies

Türkiye . 229 parts In-Stock

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229

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Kepictronics

USA . 100 parts In-Stock

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100

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Overview

Transform your communication systems with the TCC-106A-RT by Onsemi, a cutting-edge solution that guarantees top-notch quality and unparalleled performance. Manufactured by industry leader Onsemi, this telecom interface IC boasts a wide range of applications in various industries, offering customers unmatched value and benefits. With its innovative design and reliable functionality, the TCC-106A-RT is the perfect choice for all your telecom circuit needs. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides a durable and cost-effective packaging solution for the telecom interface IC, ensuring reliable performance over time.

Surface Mount: YES

Being surface mountable makes this product easy to integrate into electronic assemblies, saving time and simplifying the manufacturing process.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on a circuit board, making it ideal for applications where board real estate is limited.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this telecom interface IC can withstand harsh environmental conditions without compromising performance.

Nominal Supply Voltage: 3.3 V

The 3.3V supply voltage requirement is commonly found in many electronic systems, ensuring compatibility and ease of integration with existing setups.

Technical Specifications

Other Function Telecom Interface ICs TCC-106A-RT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PBGA-B20

Length:

2.58 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.65 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

2.23 mm

Trade Compliance

TCC-106A-RT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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