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TCP-3027N-QT

Onsemi

TCP-3027N-QT by Onsemi

TCP-3027N-QT by Onsemi is a RECTANGULAR CHIP CARRIER with 6 terminals, suitable for TELECOM CIRCUIT applications. It operates b/w -30 °C to 85°C, with a compact size of 1.2mm width and 1.6mm length. Ideal for surface mount installations due to its very thin profile design.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 12,561 parts In-Stock

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Digiode

USA . 2,319 parts In-Stock

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AZTECH Wire

Italy . 1,109 parts In-Stock

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$19.070

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SupplyDigital Components

Austria . 7,763 parts In-Stock

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Problanco Electronics

Mexico . 7,232 parts In-Stock

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TANS Electronics

Latvia . 6,659 parts In-Stock

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Kulean Microsystems

USA . 5,050 parts In-Stock

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UHIMA Technologies

Türkiye . 240 parts In-Stock

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Corphita

USA . 208 parts In-Stock

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Corohmni

South Africa . 143 parts In-Stock

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Overview

Enhance your telecom interface systems with the TCP-3027N-QT by Onsemi. Known for their superior quality and reliability, Onsemi delivers cutting-edge solutions in the category of Other Function Telecom Interface ICs. This surface-mount chip carrier boasts a very thin profile, making it ideal for compact designs. With a wide operating temperature range and no-lead terminal form, this telecom circuit offers unmatched performance and durability. Upgrade your communication devices with the TCP-3027N-QT and experience seamless connectivity like never before.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting on PCBs, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular shape is common and convenient for placement and soldering on circuit boards.

No. of Terminals: 6

Having 6 terminals provides sufficient connectivity options for interfacing with other components in a telecom system.

Package Style: CHIP CARRIER, VERY THIN PROFILE

Chip carrier package style with very thin profile allows for compact and low-profile designs in telecom devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in demanding telecom applications.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature allows the product to function in a wide range of environmental conditions.

Terminal Position: QUAD

Quad terminal position provides stability and ease of connection during installation on PCBs.

Maximum Seated Height: 1 mm

Low maximum seated height helps in maintaining a slim profile and efficient use of space in telecom equipment.

Width: 1.2 mm

Compact width allows for miniaturization of the overall telecom system.

Length: 1.6 mm

Short length contributes to space-saving designs in telecom applications.

Terminal Form: NO LEAD

No lead terminal form simplifies the mounting process and provides a clean look to the product.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, ensuring compatibility and optimal performance in telecommunications systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting on PCBs, enhancing connectivity and functionality in telecom devices.

Technical Specifications

Other Function Telecom Interface ICs TCP-3027N-QT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-XQCC-N6

Length:

1.6 mm

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

1.2 mm

Trade Compliance

TCP-3027N-QT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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