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TCP-3027H-DT

Onsemi

TCP-3027H-DT by Onsemi

The Onsemi TCP-3027H-DT is a telecom IC with 8 terminals in a grid array package. It operates b/w -30 °C to 85°C, with a very thin profile of 0.611mm height and fine pitch. Ideal for telecom interface applications requiring compact design and surface mount compatibility.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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ACDS - Activité Composants Distribution Service

France . 3,429 parts In-Stock

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Bristol Electronics

USA . 3,429 parts In-Stock

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Dan-Mar Components

USA . 3,429 parts In-Stock

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Vyrian

USA . 718 parts In-Stock

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718

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Digiode

USA . 69 parts In-Stock

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69

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SupplyDigital Components

Austria . 6,473 parts In-Stock

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Kulean Microsystems

USA . 3,711 parts In-Stock

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Corphita

USA . 2,169 parts In-Stock

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Problanco Electronics

Mexico . 1,973 parts In-Stock

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TANS Electronics

Latvia . 1,129 parts In-Stock

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Metaverse IC Inc.

Canada . 700 parts In-Stock

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700

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UHIMA Technologies

Türkiye . 666 parts In-Stock

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Corohmni

South Africa . 383 parts In-Stock

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Overview

Upgrade your telecom systems with the TCP-3027H-DT by Onsemi, a top-quality telecom interface IC designed to enhance communication performance. Onsemi's reputation for excellence ensures that this product meets all industry standards and guarantees reliability. With applications in various telecom functions, this versatile IC offers customers exceptional value, benefits, and advantages. Trust Onsemi's TCP-3027H-DT to take your telecom systems to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications without adding excessive weight.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly, reducing production time and cost.

Package Shape: RECTANGULAR

Rectangular shape is common and easy to integrate into existing designs or circuit boards.

No. of Terminals: 8

Having 8 terminals allows for multiple connections and functions within the same component.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a thin profile and fine pitch provides high density and efficient use of space on a circuit board.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand elevated temperatures without sacrificing performance.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature ensures the product can operate in cold environments without any issues.

Terminal Position: BOTTOM

Bottom terminal position allows for easier PCB layout and integration.

Maximum Seated Height: 0.611 mm

With a low maximum seated height, the component can be used in slim and compact devices.

Width: 0.722 mm

The narrow width of the component allows for more efficient use of space on a PCB.

Length: 0.879 mm

The compact length of the component enables it to be easily integrated into tight spaces or smaller devices.

Terminal Form: BALL

Ball terminal form provides better connectivity and reliability compared to other forms.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimal performance and compatibility within telecom systems.

Technical Specifications

Other Function Telecom Interface ICs TCP-3027H-DT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PBGA-B8

Length:

.879 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.611 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Width:

.722 mm

Trade Compliance

TCP-3027H-DT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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