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TCP-3047N-DT

Onsemi

TCP-3047N-DT by Onsemi

TCP-3047N-DT by Onsemi is a telecom IC with 12 terminals in a grid array package. It operates b/w -30 °C to 85°C, with a very thin profile of 0.611mm height and 0.722mm width. Ideal for telecom circuits, it features ball terminal form and plastic/epoxy body material for surface mount applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 966 parts In-Stock

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966

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Vyrian

USA . 161 parts In-Stock

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161

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Kepictronics

USA . 35,996 parts In-Stock

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35,996

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Kulean Microsystems

USA . 5,301 parts In-Stock

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SupplyDigital Components

Austria . 4,964 parts In-Stock

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Problanco Electronics

Mexico . 2,763 parts In-Stock

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Corphita

USA . 2,340 parts In-Stock

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2,340

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TANS Electronics

Latvia . 1,630 parts In-Stock

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1,630

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UHIMA Technologies

Türkiye . 515 parts In-Stock

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Corohmni

South Africa . 404 parts In-Stock

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404

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Overview

Discover the cutting-edge TCP-3047N-DT by Onsemi, a top-tier manufacturer known for delivering high-quality products. This innovative telecom interface IC offers unmatched value and benefits for various applications. With its advanced features and reliable performance, this product is ideal for enhancing communication systems and optimizing efficiency. Experience the difference with Onsemi's TCP-3047N-DT and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good durability and protection for the IC, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving space and enabling automated assembly processes.

Package Shape: RECTANGULAR

Rectangular shape makes the IC compatible with standard PCB designs, enhancing usability and versatility.

No. of Terminals: 12

Having 12 terminals provides ample connectivity options for various communication interfaces, making the IC suitable for diverse telecom applications.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch design allow for high-density mounting, enabling compact and efficient telecom system designs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the IC can operate reliably under normal operating conditions without risk of overheating.

Minimum Operating Temperature: -30 °C

The ability to operate at temperatures as low as -30 °C ensures reliable performance even in extreme cold environments.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout and assembly, simplifying the integration process for manufacturers.

Maximum Seated Height: 0.611 mm

The low maximum seated height of 0.611 mm allows for slim and compact product designs, ideal for space-constrained telecom applications.

Width: 0.722 mm

The narrow width of 0.722 mm saves space on the PCB, enabling densely packed designs for efficient use of available board space.

Length: 1.179 mm

The length of 1.179 mm is compact, making the IC suitable for small form factor devices and applications where space is limited.

Terminal Form: BALL

Ball terminals offer reliable and secure connections to the PCB, ensuring good electrical contact for optimal signal transmission in telecom systems.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuits, this IC is optimized for performance and reliability in communication applications, making it a perfect choice for telecom interfaces.

Technical Specifications

Other Function Telecom Interface ICs TCP-3047N-DT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PBGA-B12

Length:

1.179 mm

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.611 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Width:

.722 mm

Trade Compliance

TCP-3047N-DT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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