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TCP-3012H-DT

Onsemi

TCP-3012H-DT by Onsemi

The Onsemi TCP-3012H-DT is a Telecom Circuit IC with 8 terminals in a very thin profile grid array package. It operates b/w -30 °C to 85°C, making it suitable for telecom interface applications. The package dimensions are 0.722mm x 0.879mm x 0.639mm, with surface mount capability.

Median Price

$1.058

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 66,000 parts In-Stock

1+ parts

-

100+ parts

$1.020

1k+ parts

$0.847

10k+ parts

$0.755

66,000

-

$1.020

$0.847

$0.755

DigiKey

USA . 66,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.270

10k+ parts

-

66,000

-

-

$1.270

-

Verical

USA . 66,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.058

10k+ parts

$0.944

66,000

-

-

$1.058

$0.944

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,026 parts In-Stock

1+ parts

$0.792

100+ parts

-

1k+ parts

-

10k+ parts

-

2,026

$0.792

-

-

-

Vyrian

USA . 693 parts In-Stock

1+ parts

$0.834

100+ parts

-

1k+ parts

-

10k+ parts

-

693

$0.834

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,470 parts In-Stock

1+ parts

$0.751

100+ parts

-

1k+ parts

-

10k+ parts

-

2,470

$0.751

-

-

-

Corohmni

South Africa . 359 parts In-Stock

1+ parts

$0.834

100+ parts

-

1k+ parts

-

10k+ parts

-

359

$0.834

-

-

-

Continental Prestige Electronics

USA . 66,000 parts In-Stock

1+ parts

-

100+ parts

$0.674

1k+ parts

-

10k+ parts

-

66,000

-

$0.674

-

-

Problanco Electronics

Mexico . 8,183 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,183

-

-

-

-

SupplyDigital Components

Austria . 2,513 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,513

-

-

-

-

Kulean Microsystems

USA . 2,462 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,462

-

-

-

-

TANS Electronics

Latvia . 707 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

707

-

-

-

-

UHIMA Technologies

Türkiye . 549 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

549

-

-

-

-

Overview

Upgrade your telecommunication systems with the TCP-3012H-DT by Onsemi, a top-quality telecom interface IC that promises reliability and performance. Onsemi's reputation for innovation and excellence shines through in this product, offering customers a seamless and efficient solution for their communication needs. Ideal for a wide range of applications, this IC provides unparalleled value and benefits, ensuring smooth operation and enhanced functionality. Trust Onsemi to deliver cutting-edge technology that exceeds expectations. Elevate your telecom experience with the TCP-3012H-DT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to harsh environmental conditions, making the product reliable and long-lasting.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

Rectangular shape enables efficient use of space on the circuit board, optimizing layout and design.

No. of Terminals: 8

Having 8 terminals allows for versatile connection options, enhancing compatibility with various systems.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array style with thin profile and fine pitch increases signal integrity and reduces signal distortion, resulting in better performance.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures the product can withstand extended periods of use without overheating or malfunctioning.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature allows the product to function reliably even in cold environments.

Terminal Position: BOTTOM

Bottom terminal position simplifies soldering and connection processes during assembly.

Maximum Seated Height: 0.639 mm

Low maximum seated height minimizes the overall profile of the product, ideal for applications with space constraints.

Width: 0.722 mm

Narrow width saves space on the circuit board, enabling compact designs and efficient use of available space.

Length: 0.879 mm

Short length reduces the footprint of the product, allowing for flexible placement on the circuit board.

Terminal Form: BALL

Ball terminal form provides secure connections and reliable contact, ensuring stable and consistent performance.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, the IC type ensures optimized functionality and performance in telecommunications systems.

Technical Specifications

Other Function Telecom Interface ICs TCP-3012H-DT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PBGA-B8

Length:

.879 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.639 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Width:

.722 mm

Trade Compliance

TCP-3012H-DT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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