Loading...

TCP-3056H-DT

Onsemi

TCP-3056H-DT by Onsemi

TCP-3056H-DT by Onsemi is a telecom IC with 12 terminals in a grid array package. It operates b/w -30 °C to 85°C, with a very thin profile of 0.611mm height and 0.722mm width. Ideal for telecom circuit applications requiring fine pitch and surface mount compatibility.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 674 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

674

-

-

-

-

Digiode

USA . 143 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

143

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 7,218 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,218

-

-

-

-

Kulean Microsystems

USA . 7,051 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,051

-

-

-

-

TANS Electronics

Latvia . 3,763 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,763

-

-

-

-

UHIMA Technologies

Türkiye . 941 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

941

-

-

-

-

Corphita

USA . 707 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

707

-

-

-

-

Problanco Electronics

Mexico . 559 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

559

-

-

-

-

Corohmni

South Africa . 146 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

146

-

-

-

-

Overview

Upgrade your telecom interface with the top-quality TCP-3056H-DT by Onsemi. Made by a trusted manufacturer, this cutting-edge product offers unmatched reliability and performance in the telecom industry. Its innovative design and advanced features make it ideal for a wide range of applications. Experience seamless connectivity and superior functionality with the TCP-3056H-DT, providing exceptional value and benefits to customers looking for top-notch telecom interface ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and resistance to environmental factors, making this product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost in production.

Package Shape: RECTANGULAR

Rectangular package shape is space-efficient and compatible with standard PCB layouts, making integration into existing designs seamless.

No. of Terminals: 12

Having 12 terminals provides flexibility in connectivity options and allows for versatile usage in telecom interfaces.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style with a very thin profile and fine pitch design makes this product suitable for high-density applications where space is limited.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can withstand high temperatures, ensuring reliability in various operating conditions.

Minimum Operating Temperature: -30 °C

The minimum operating temperature of -30 °C allows this product to operate effectively in cold environments without any performance issues.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB mounting and enhances signal integrity for efficient telecom interface operations.

Maximum Seated Height: 0.611 mm

The maximum seated height of 0.611 mm enables a low-profile design, ideal for compact electronic devices.

Width: 0.722 mm

The narrow width of 0.722 mm ensures space-saving integration and compatibility with densely populated PCB layouts.

Length: 1.179 mm

The length of 1.179 mm offers a compact footprint, making this product suitable for applications with limited space constraints.

Terminal Form: BALL

The ball terminal form provides secure electrical connections and enables reliable data transmission in telecom circuits.

Telecom IC Type: TELECOM CIRCUIT

Being a telecom circuit type IC, this product is specifically designed for telecom applications, ensuring optimal performance and compatibility in such systems.

Technical Specifications

Other Function Telecom Interface ICs TCP-3056H-DT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PBGA-B12

Length:

1.179 mm

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.611 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Width:

.722 mm

Trade Compliance

TCP-3056H-DT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19