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TCP-3039H-QT

Onsemi

TCP-3039H-QT by Onsemi

TCP-3039H-QT by Onsemi is a telecom IC with 6 terminals in a chip carrier package. It operates b/w -30 °C to 85°C, with a compact size of 1.2mm width and 1.6mm length. Ideal for telecom interface applications due to its very thin profile and surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,258 parts In-Stock

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Digiode

USA . 1,310 parts In-Stock

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1,310

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Distributors (Availability)

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SupplyDigital Components

Austria . 8,290 parts In-Stock

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8,290

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TANS Electronics

Latvia . 7,345 parts In-Stock

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Kulean Microsystems

USA . 6,770 parts In-Stock

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6,770

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Problanco Electronics

Mexico . 4,847 parts In-Stock

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Corphita

USA . 1,957 parts In-Stock

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UHIMA Technologies

Türkiye . 891 parts In-Stock

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891

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Corohmni

South Africa . 302 parts In-Stock

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Overview

Enhance your telecom interface with the TCP-3039H-QT by Onsemi. Known for their top-quality products, Onsemi delivers reliable solutions that exceed industry standards. This versatile chip carrier is perfect for various applications within the telecom sector. With a very thin profile and 6 terminals, this product offers seamless integration and exceptional performance. Say goodbye to connectivity issues and hello to efficiency with the TCP-3039H-QT. Elevate your telecom systems today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for smaller and more compact designs, making the product suitable for space-constrained applications.

Package Shape: RECTANGULAR

Rectangular package shape makes it easier to handle and place on circuit boards during assembly.

No. of Terminals: 6

Having 6 terminals provides flexibility in connectivity options for different applications.

Package Style: CHIP CARRIER, VERY THIN PROFILE

The thin profile of the chip carrier package style saves space on the circuit board, ideal for compact devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance under varying environmental conditions.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature allows the product to function in cold environments without issues.

Terminal Position: QUAD

Quad terminal position enhances the stability of connections and reduces the risk of signal interference.

Maximum Seated Height: 1 mm

Low maximum seated height enables the product to be used in slim and compact designs.

Width: 1.2 mm

Narrow width facilitates placement of the product on densely populated circuit boards.

Length: 1.6 mm

Short length saves space on the circuit board, making it suitable for miniaturized electronic devices.

Terminal Form: NO LEAD

No lead terminal form eliminates the risk of lead contamination and is environmentally friendly.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring reliable and efficient communication performance.

Terminal Pitch: 0.5 mm

The tight terminal pitch allows for high-density packaging without compromising on connectivity and signal integrity.

Technical Specifications

Other Function Telecom Interface ICs TCP-3039H-QT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-XQCC-N6

Length:

1.6 mm

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.2 mm

Trade Compliance

TCP-3039H-QT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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