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TCP-3012H-QT

Onsemi

TCP-3012H-QT by Onsemi

TCP-3012H-QT by Onsemi is a small outline, very thin profile telecom IC with 6 terminals. It operates b/w -30 °C to 85°C and has a terminal pitch of 0.5mm. Ideal for telecom circuit applications due to its compact size and surface mount capability.

Median Price

$5.270

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,940 parts In-Stock

1+ parts

$5.270

100+ parts

$3.290

1k+ parts

$2.670

10k+ parts

-

1,940

$5.270

$3.290

$2.670

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 797 parts In-Stock

1+ parts

$5.006

100+ parts

-

1k+ parts

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797

$5.006

-

-

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Vyrian

USA . 8,743 parts In-Stock

1+ parts

-

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8,743

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Flip Electronics

USA . 2,000 parts In-Stock

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2,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 897 parts In-Stock

1+ parts

$4.743

100+ parts

-

1k+ parts

-

10k+ parts

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897

$4.743

-

-

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Corohmni

South Africa . 400 parts In-Stock

1+ parts

$5.270

100+ parts

-

1k+ parts

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400

$5.270

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-

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AZTECH Wire

Italy . 132 parts In-Stock

1+ parts

$8.540

100+ parts

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132

$8.540

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Perfect Parts

USA . 13,227 parts In-Stock

1+ parts

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13,227

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TANS Electronics

Latvia . 7,935 parts In-Stock

1+ parts

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7,935

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Problanco Electronics

Mexico . 5,874 parts In-Stock

1+ parts

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5,874

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SupplyDigital Components

Austria . 4,868 parts In-Stock

1+ parts

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4,868

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Kepictronics

USA . 1,940 parts In-Stock

1+ parts

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100+ parts

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1,940

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Authorized Procurement Solutions

USA . 1,940 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,940

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Kulean Microsystems

USA . 1,294 parts In-Stock

1+ parts

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100+ parts

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1,294

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UHIMA Technologies

Türkiye . 591 parts In-Stock

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591

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Overview

Enhance your telecom interfaces with the TCP-3012H-QT from Onsemi. Known for its superior quality and reliability, Onsemi delivers cutting-edge solutions for various applications in the telecom industry. This small outline, very thin profile IC boasts a dual terminal position, making it versatile and easy to integrate into your designs. With a wide operating temperature range and no lead terminal form, this product offers unmatched value and performance for your projects. Upgrade your telecom systems with the TCP-3012H-QT and experience seamless connectivity like never before.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and reducing production costs.

Package Shape: RECTANGULAR

The rectangular package shape makes it easy to align and mount the IC onto the circuit board, ensuring proper placement and connectivity.

No. of Terminals: 6

Having 6 terminals provides sufficient connectivity options for versatile use in telecom interface applications.

Package Style: SMALL OUTLINE, VERY THIN PROFILE

The small outline and very thin profile make this IC suitable for compact devices and applications where space is limited.

Operating Temperature: -30 °C to 85°C

The wide operating temperature range allows for reliable performance in various environmental conditions.

Terminal Position: DUAL

Dual terminal positions provide flexibility in circuit design and allow for different connection configurations.

Maximum Seated Height: 1 mm

The low seated height makes this IC suitable for slim and compact devices, contributing to overall space savings in the design.

Width: 1.2 mm

The narrow width of 1.2 mm facilitates close placement of components on the circuit board, optimizing board space usage.

Length: 1.6 mm

The compact length of 1.6 mm contributes to the overall small form factor of the IC, making it ideal for space-constrained applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the assembly process and enhances reliability by eliminating the risk of lead-related issues.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designed for telecom circuits, this IC offers optimized performance and functionality for telecom interface applications.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for high-density mounting of the IC on the circuit board, enabling efficient use of board space.

Technical Specifications

Other Function Telecom Interface ICs TCP-3012H-QT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-XDSO-N6

Length:

1.6 mm

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.2 mm

Trade Compliance

TCP-3012H-QT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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