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TCP-3027HA-QT

Onsemi

TCP-3027HA-QT by Onsemi

TCP-3027HA-QT by Onsemi is a surface mount telecom IC with 6 terminals in a chip carrier package. Operating temperature range from -30 °C to 85°C, with compact dimensions of 1.2mm width and 1.6mm length. Ideal for telecom circuit applications requiring very thin profile components.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,255 parts In-Stock

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Digiode

USA . 526 parts In-Stock

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526

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SupplyDigital Components

Austria . 5,292 parts In-Stock

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Problanco Electronics

Mexico . 4,209 parts In-Stock

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Kulean Microsystems

USA . 4,195 parts In-Stock

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Corphita

USA . 1,743 parts In-Stock

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TANS Electronics

Latvia . 1,614 parts In-Stock

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UHIMA Technologies

Türkiye . 597 parts In-Stock

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597

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ChipstoGo Electronic ltd

UK . 463 parts In-Stock

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Corohmni

South Africa . 205 parts In-Stock

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Overview

Experience seamless connectivity and superior performance with the TCP-3027HA-QT by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability for all its products. The TCP-3027HA-QT falls under the category of Other Function Telecom Interface ICs, making it versatile and essential for a wide range of applications. With its surface mount feature and compact package style, this product offers convenience and ease of use. Trust Onsemi to deliver excellent value and benefits with the TCP-3027HA-QT, providing customers with unparalleled advantages in their projects and applications.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient assembly onto PCBs, reducing manufacturing time and cost.

Package Shape: RECTANGULAR

Rectangular shape provides a compact design, saving space on the PCB.

No. of Terminals: 6

Provides sufficient connectivity options for the intended telecom application.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Thin profile saves space and allows for more components to be placed in a limited area.

Maximum Operating Temperature: 85 °C

Can withstand higher temperatures, ensuring reliable performance in various environments.

Minimum Operating Temperature: -30 °C

Capable of operating in lower temperature conditions without compromising functionality.

Terminal Position: QUAD

Quad terminal position offers stability and ease of connection during installation.

Maximum Seated Height: 1 mm

Low seated height allows for a slim and compact design, suitable for space-constrained applications.

Width: 1.2 mm

Narrow width facilitates easy integration into tight spaces on the PCB.

Length: 1.6 mm

Compact length ensures the product can fit within confined layout constraints on the PCB.

Terminal Form: NO LEAD

Lead-free terminals are environmentally friendly and comply with RoHS regulations.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimal performance and compatibility.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting, increasing the number of ICs that can be placed on the PCB.

Technical Specifications

Other Function Telecom Interface ICs TCP-3027HA-QT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-XQCC-N6

Length:

1.6 mm

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

1.2 mm

Trade Compliance

TCP-3027HA-QT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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