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TCP-3033H-DT

Onsemi

TCP-3033H-DT by Onsemi

TCP-3033H-DT by Onsemi is a telecom IC with 8 terminals in a grid array package. Operating temperature ranges from -30 °C to 85°C, making it suitable for telecom circuit applications. With a very thin profile and fine pitch, this IC is ideal for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,960 parts In-Stock

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1,960

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Digiode

USA . 1,500 parts In-Stock

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1,500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 7,786 parts In-Stock

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7,786

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TANS Electronics

Latvia . 5,970 parts In-Stock

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5,970

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Problanco Electronics

Mexico . 4,329 parts In-Stock

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4,329

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SupplyDigital Components

Austria . 792 parts In-Stock

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792

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Corphita

USA . 717 parts In-Stock

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717

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UHIMA Technologies

Türkiye . 327 parts In-Stock

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327

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Corohmni

South Africa . 209 parts In-Stock

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Overview

Discover the cutting-edge technology of the TCP-3033H-DT by Onsemi, a top-tier manufacturer known for their exceptional quality and reliability. This Telecom Interface IC offers unparalleled performance and versatility in various applications. From communication systems to data networking, this product delivers seamless connectivity and optimal functionality. Experience the value and benefits of this innovative solution, designed to exceed customer expectations and enhance overall user experience. Elevate your projects with the TCP-3033H-DT and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various operating conditions.

Surface Mount: YES

Being surface mountable makes installation and assembly easier and more efficient.

Package Shape: RECTANGULAR

The rectangular shape allows for compact and space-saving design in electronic circuits.

No. of Terminals: 8

With 8 terminals, this product offers flexibility and compatibility with different systems.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style with a very thin profile and fine pitch enables high-density mounting and connectivity.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in elevated temperature environments.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature allows for usage in cold environments without compromising performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure connections in the circuit layout.

Maximum Seated Height: 0.611 mm

The maximum seated height of 0.611 mm contributes to a low-profile design, ideal for space-constrained applications.

Width: 0.722 mm

The compact width of 0.722 mm enables integration into small electronic devices and systems.

Length: 0.879 mm

The length of 0.879 mm offers a balanced form factor for efficient PCB layout and space utilization.

Terminal Form: BALL

The use of ball terminals ensures reliable electrical connections and easy soldering during installation.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC type ensures high performance and compatibility in telecommunications systems.

Technical Specifications

Other Function Telecom Interface ICs TCP-3033H-DT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PBGA-B8

Length:

.879 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.611 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Width:

.722 mm

Trade Compliance

TCP-3033H-DT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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